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TPS2055ADRG4

Texas Instruments

TPS2055ADRG4 by Texas Instruments

TPS2055ADRG4 by Texas Instruments is a Power Management IC with 8 terminals, operating voltage range of 2.7V to 5.5V, and temperature range of 0°C to 85°C. It is designed for power supply support circuits in various applications requiring a small outline package with surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,711 parts In-Stock

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4,711

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Digiode

USA . 2,764 parts In-Stock

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2,764

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Distributors (Availability)

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Parana Technologies

USA . 824 parts In-Stock

1+ parts

$1.165

100+ parts

-

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$1.974

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824

$1.165

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$1.974

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DigiPath Technology Company

USA . 2,039 parts In-Stock

1+ parts

$1.283

100+ parts

$1.180

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2,039

$1.283

$1.180

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ChromeModa Solutions

Germany . 4,062 parts In-Stock

1+ parts

$1.309

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$1.073

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4,062

$1.309

$1.073

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IDEA Electronic Components Group

UK . 430 parts In-Stock

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$1.309

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$1.178

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430

$1.309

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$1.178

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Semicontronic

India . 830 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

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830

$4.500

$4.388

$4.365

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One Stop Electronics

USA . 1,020 parts In-Stock

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$7.500

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1,020

$7.500

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AZTECH Wire

Italy . 785 parts In-Stock

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$14.410

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785

$14.410

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Component Stockers USA

USA . 273 parts In-Stock

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$99.990

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273

$99.990

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Corphita

USA . 2,953 parts In-Stock

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Microchip USA

USA . 952 parts In-Stock

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Corohmni

South Africa . 204 parts In-Stock

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Overview

Enhance your power management solutions with the TPS2055ADRG4 by Texas Instruments. Manufactured with top-quality materials and cutting-edge technology, this Power Management IC offers unparalleled performance and reliability. Ideal for a wide range of applications, this product provides seamless power supply support in a compact package. Experience the value and benefits of superior quality with the TPS2055ADRG4, designed to optimize your electronic systems for maximum efficiency. Upgrade your power management capabilities today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good durability and resistance to environmental factors, making this product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation onto circuit boards, saving assembly time and effort.

Nominal Supply Voltage (Vsup): 3.3 V

Operates at a commonly used voltage level, ensuring compatibility with a wide range of devices and circuits.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, providing stability and reliability in various environmental conditions.

Minimum Operating Temperature: 0 °C

Capable of functioning in low-temperature environments, making it suitable for a variety of applications.

Width (mm): 3.9 mm

Compact width design allows for space-saving integration into different electronic systems or devices.

Minimum Supply Voltage (Vsup): 2.7 V

Can operate at low supply voltages, enabling energy-efficient performance and compatibility with various power sources.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering connections and facilitates easier PCB assembly.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a relatively high supply voltage range, making it versatile for different power management applications.

Technical Specifications

Power Management ICs TPS2055ADRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

TPS2055ADRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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