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TPS2053BDG4

Texas Instruments

TPS2053BDG4 by Texas Instruments

TPS2053BDG4 by Texas Instruments is a Power Management IC with 16 terminals, operating at -40 to 85°C. It supports 3 channels with a supply voltage range of 2.7V to 5.5V, making it ideal for industrial applications requiring power supply support circuits in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,473 parts In-Stock

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4,473

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Vyrian

USA . 4,042 parts In-Stock

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4,042

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Chip Stock

USA . 3,770 parts In-Stock

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3,770

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Quantum Digital Technology

USA . 340 parts In-Stock

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340

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Distributors (Availability)

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One Stop Electronics

USA . 315 parts In-Stock

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$2.500

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315

$2.500

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AZTECH Wire

Italy . 721 parts In-Stock

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$12.580

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721

$12.580

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Parana Technologies

USA . 1,528 parts In-Stock

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$14.510

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$14.951

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1,528

$14.510

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$14.951

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ChromeModa Solutions

Germany . 6,705 parts In-Stock

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$16.303

100+ parts

$13.368

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6,705

$16.303

$13.368

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IDEA Electronic Components Group

UK . 826 parts In-Stock

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$16.303

100+ parts

$15.488

1k+ parts

$14.673

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826

$16.303

$15.488

$14.673

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Component Stockers USA

USA . 765 parts In-Stock

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$99.990

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765

$99.990

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Corphita

USA . 1,846 parts In-Stock

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1,846

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DigiPath Technology Company

USA . 1,684 parts In-Stock

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$14.699

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1,684

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$14.699

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Kepictronics

USA . 1,008 parts In-Stock

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Microchip USA

USA . 990 parts In-Stock

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990

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Perfect Parts

USA . 358 parts In-Stock

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358

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Overview

Enhance your power management solutions with the TPS2053BDG4 by Texas Instruments. With a reputation for quality and reliability, Texas Instruments delivers innovative products that cater to various applications in the Power Management ICs category. The TPS2053BDG4 offers exceptional value by providing efficient power supply support circuits, ensuring optimal performance and reliability. Experience the benefits of this product's advanced features, compact design, and wide operating temperature range, making it an ideal choice for industrial applications. Trust Texas Instruments to deliver excellence in power management solutions with the TPS2053BDG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and cost-effective, making the product easier to handle and more affordable for consumers.

Nominal Supply Voltage (Vsup): 3.3 V

3.3V supply voltage is a common standard in many electronic devices, ensuring compatibility with a wide range of systems.

No. of Terminals: 16

Having 16 terminals allows for more connections and functionalities, making the product more versatile and adaptable to different applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand harsh environmental conditions without compromising its performance.

Width (mm): 3.9 mm

The compact width of 3.9mm makes the product suitable for space-constrained applications where size is a critical factor.

No. of Channels: 3

Having 3 channels allows the product to handle multiple power supply circuits simultaneously, making it efficient and versatile in managing power distribution.

Technical Specifications

Power Management ICs TPS2053BDG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

UNDERVOLTAGE LOCKOUT

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Current (Isup):

.11 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TPS2053BDG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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