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TPS2044DR

Texas Instruments

TPS2044DR by Texas Instruments

TPS2044DR by Texas Instruments is a Power Management IC with 4 functions, operating at 3.3V nominal voltage. It comes in a small outline package suitable for industrial applications, with a temperature range of -40 to 85°C. Ideal for power supply support circuits requiring up to 5.5V max supply voltage.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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R&J Components

USA . 20,000 parts In-Stock

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Chip Stock

USA . 9,398 parts In-Stock

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Vyrian

USA . 7,077 parts In-Stock

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ComSIT Distribution GmbH

Germany . 4,860 parts In-Stock

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Digiode

USA . 3,238 parts In-Stock

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Cyclops Electronics Ltd

UK . 698 parts In-Stock

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Bristol Electronics

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Atlantic Semiconductor

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One Stop Electronics

USA . 605 parts In-Stock

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$2.500

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$2.500

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Parana Technologies

USA . 2,274 parts In-Stock

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$2.559

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$3.049

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DigiPath Technology Company

USA . 92 parts In-Stock

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$2.818

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$2.592

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ChromeModa Solutions

Germany . 4,805 parts In-Stock

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$2.875

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$2.358

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IDEA Electronic Components Group

UK . 1,154 parts In-Stock

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$2.875

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$2.588

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AZTECH Wire

Italy . 651 parts In-Stock

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Component Stockers USA

USA . 1,880 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,586 parts In-Stock

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GreenTree Electronics

Israel . 1,982 parts In-Stock

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Assy Fe

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Authorized Procurement Solutions

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Corphita

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Kepictronics

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Overview

Unlock the power of efficient power management with the TPS2044DR by Texas Instruments. With a reputation for top-notch quality and reliability, Texas Instruments delivers a cutting-edge solution for your power management needs. Designed with four functions in a small outline package, this Power Management IC is perfect for industrial applications where precision and performance are crucial. Experience peace of mind knowing that your devices are powered efficiently and reliably with the TPS2044DR. Elevate your projects with Texas Instruments today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers good durability and reliability for the power management IC.

Surface Mount: YES

This feature makes the IC easy to integrate onto circuit boards, saving space and simplifying assembly.

No. of Functions: 4

Having 4 functions in one IC reduces the need for multiple components, streamlining the design and improving efficiency.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3 V is commonly used in many electronic devices, making this IC compatible with a wide range of applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that the IC can operate reliably in harsh environmental conditions, making it suitable for industrial applications.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5 V, this IC can handle higher voltage inputs, offering flexibility in power management solutions.

Technical Specifications

Power Management ICs TPS2044DR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TPS2044DR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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