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TPS2042DRG4

Texas Instruments

TPS2042DRG4 by Texas Instruments

TPS2042DRG4 by Texas Instruments is a Power Management IC with 8 terminals, Vsup range of 2.7V to 5.5V, and operating temperature from -40°C to 85°C. It is ideal for industrial applications requiring compact design and high reliability in surface-mount configurations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,725 parts In-Stock

1+ parts

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7,725

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Chip Stock

USA . 3,860 parts In-Stock

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3,860

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Digiode

USA . 1,375 parts In-Stock

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1,375

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Nova Conductors

Japan . 84 parts In-Stock

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84

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 810 parts In-Stock

1+ parts

$1.500

100+ parts

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810

$1.500

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Ampacity Inc.

Singapore . 353 parts In-Stock

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$6.500

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353

$6.500

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AZTECH Wire

Italy . 622 parts In-Stock

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$12.330

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622

$12.330

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Parana Technologies

USA . 136 parts In-Stock

1+ parts

$13.476

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$13.988

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136

$13.476

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$13.988

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DigiPath Technology Company

USA . 634 parts In-Stock

1+ parts

$14.839

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634

$14.839

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IDEA Electronic Components Group

UK . 1,440 parts In-Stock

1+ parts

$15.142

100+ parts

$14.385

1k+ parts

$13.628

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1,440

$15.142

$14.385

$13.628

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ChromeModa Solutions

Germany . 1,304 parts In-Stock

1+ parts

$15.142

100+ parts

$12.416

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1,304

$15.142

$12.416

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Corphita

USA . 4,612 parts In-Stock

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4,612

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Microchip USA

USA . 4,294 parts In-Stock

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4,294

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Enhance your power management solutions with the TPS2042DRG4 by Texas Instruments. Known for their top-quality products, Texas Instruments delivers reliability and efficiency in every component they manufacture. The TPS2042DRG4 is a versatile Power Management IC that offers seamless integration and optimal performance in various applications. With its compact design and advanced features, this product provides unmatched value and benefits to customers looking for cutting-edge solutions. Upgrade your power management system today with the TPS2042DRG4 and experience the difference Texas Instruments can make in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the components inside the package.

Surface Mount: YES

Ease of installation and space-saving design for compact electronic devices.

Nominal Supply Voltage (Vsup): 5 V

Compatible with standard 5V power supplies for easy integration into existing systems.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in extremely cold environments without any issues.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides good conductivity and corrosion resistance for reliable connections.

Width (mm): 3.899 mm

Compact size for space-constrained applications.

Other IC type: ANALOG CIRCUIT

Suitable for analog signal processing applications requiring high precision.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during manufacturing process for reliable performance.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature and reliability requirements.

Technical Specifications

Power Management ICs TPS2042DRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.899 mm

Trade Compliance

TPS2042DRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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