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TPS2041DRG4

Texas Instruments

TPS2041DRG4 by Texas Instruments

TPS2041DRG4 by Texas Instruments is a Power Management IC with 8 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 2.7V to 5.5V and can withstand peak reflow temperatures up to 260°C. This small outline rectangular package is ideal for industrial analog circuit applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,924 parts In-Stock

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Digiode

USA . 1,162 parts In-Stock

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1,162

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Distributors (Availability)

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Semicontronic

India . 578 parts In-Stock

1+ parts

$6.500

100+ parts

$6.338

1k+ parts

$6.305

10k+ parts

-

578

$6.500

$6.338

$6.305

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One Stop Electronics

USA . 607 parts In-Stock

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$7.500

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607

$7.500

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Parana Technologies

USA . 729 parts In-Stock

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$8.210

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$8.822

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729

$8.210

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$8.822

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DigiPath Technology Company

USA . 930 parts In-Stock

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$9.040

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$8.317

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930

$9.040

$8.317

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ChromeModa Solutions

Germany . 3,081 parts In-Stock

1+ parts

$9.225

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$7.564

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3,081

$9.225

$7.564

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IDEA Electronic Components Group

UK . 1,982 parts In-Stock

1+ parts

$9.225

100+ parts

$8.764

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$8.302

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1,982

$9.225

$8.764

$8.302

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AZTECH Wire

Italy . 860 parts In-Stock

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$9.665

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860

$9.665

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QUARKTWIN TECHNOLOGY LTD

USA . 26,503 parts In-Stock

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Metaverse IC Inc.

Canada . 3,669 parts In-Stock

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3,669

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Microchip USA

USA . 2,797 parts In-Stock

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Corphita

USA . 1,911 parts In-Stock

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Corohmni

South Africa . 114 parts In-Stock

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Overview

Experience the power of reliable and efficient power management with the TPS2041DRG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and performance in their Power Management ICs. This small outline rectangular IC offers a wide range of applications, from industrial to consumer electronics. With a nominal supply voltage of 5V and a durable plastic/epoxy package body material, this IC ensures optimal functionality in various environments. Trust Texas Instruments for superior products that provide value, efficiency, and peace of mind to customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Nominal Supply Voltage (Vsup): 5 V

Operates efficiently at a standard voltage level commonly found in many electronic devices.

No. of Terminals: 8

Provides ample connectivity options for interfacing with other components in the circuit.

Maximum Operating Temperature: 85 °C

Capable of withstanding high temperatures, making it suitable for industrial applications where heat may be a concern.

Terminal Finish: NICKEL PALLADIUM GOLD

Offers excellent conductivity and corrosion resistance, ensuring reliable performance over time.

Width (mm): 3.899 mm

Compact size allows for space-saving installation in tight layouts.

Minimum Supply Voltage (Vsup): 2.7 V

Can operate at lower voltage levels, providing flexibility in power supply options.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable operation under demanding conditions.

Terminal Form: GULL WING

Facilitates easy soldering onto circuit boards, simplifying the assembly process.

Maximum Supply Voltage (Vsup): 5.5 V

Can handle slightly higher voltage levels without compromising performance, allowing for a margin of safety in operation.

Technical Specifications

Power Management ICs TPS2041DRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.899 mm

Trade Compliance

TPS2041DRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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