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TPS2041BDGNG4

Texas Instruments

TPS2041BDGNG4 by Texas Instruments

TPS2041BDGNG4 by Texas Instruments is a Power Management IC with 8 terminals, operating voltage range of 2.7V to 5.5V, and max current of 0.07mA. It is designed for industrial applications, featuring a small outline package shape and dual terminal position for power supply support circuits. The IC has a temperature range from -40°C to 85°C and is suitable for surface mount assembly with a square package body material made of plastic/epoxy.

Median Price

$1.550

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 424 parts In-Stock

1+ parts

$1.550

100+ parts

$1.110

1k+ parts

$0.809

10k+ parts

-

424

$1.550

$1.110

$0.809

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$0.965

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$0.965

-

-

-

Digiode

USA . 4,365 parts In-Stock

1+ parts

$1.472

100+ parts

-

1k+ parts

-

10k+ parts

-

4,365

$1.472

-

-

-

Vyrian

USA . 2,876 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,876

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,680 parts In-Stock

1+ parts

$0.965

100+ parts

-

1k+ parts

-

10k+ parts

-

4,680

$0.965

-

-

-

Continental Prestige Electronics

USA . 1,750 parts In-Stock

1+ parts

$0.965

100+ parts

-

1k+ parts

-

10k+ parts

$0.946

1,750

$0.965

-

-

$0.946

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.965

100+ parts

-

1k+ parts

$0.917

10k+ parts

$0.897

1,000

$0.965

-

$0.917

$0.897

Semicontronic

India . 253 parts In-Stock

1+ parts

$1.320

100+ parts

$1.287

1k+ parts

$1.280

10k+ parts

-

253

$1.320

$1.287

$1.280

-

Ampacity Inc.

Singapore . 242 parts In-Stock

1+ parts

$1.320

100+ parts

-

1k+ parts

-

10k+ parts

-

242

$1.320

-

-

-

Corphita

USA . 2,016 parts In-Stock

1+ parts

$1.395

100+ parts

-

1k+ parts

-

10k+ parts

-

2,016

$1.395

-

-

-

AZTECH Wire

Italy . 683 parts In-Stock

1+ parts

$7.221

100+ parts

-

1k+ parts

-

10k+ parts

-

683

$7.221

-

-

-

Parana Technologies

USA . 968 parts In-Stock

1+ parts

$8.072

100+ parts

-

1k+ parts

$8.660

10k+ parts

-

968

$8.072

-

$8.660

-

DigiPath Technology Company

USA . 17 parts In-Stock

1+ parts

$8.889

100+ parts

-

1k+ parts

-

10k+ parts

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17

$8.889

-

-

-

ChromeModa Solutions

Germany . 2,643 parts In-Stock

1+ parts

$9.070

100+ parts

$7.437

1k+ parts

-

10k+ parts

-

2,643

$9.070

$7.437

-

-

IDEA Electronic Components Group

UK . 2,223 parts In-Stock

1+ parts

$9.070

100+ parts

$8.616

1k+ parts

$8.163

10k+ parts

-

2,223

$9.070

$8.616

$8.163

-

Corohmni

South Africa . 78 parts In-Stock

1+ parts

$21.752

100+ parts

-

1k+ parts

-

10k+ parts

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78

$21.752

-

-

-

Microchip USA

USA . 1,635 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,635

-

-

-

-

Perfect Parts

USA . 32 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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32

-

-

-

-

Overview

Enhance the performance of your power management systems with the TPS2041BDGNG4 from Texas Instruments. Designed with top-quality materials and advanced technology, this Power Management IC provides reliable protection and efficient power distribution for a wide range of applications. With its compact size and versatile features, this product offers exceptional value and benefits to customers looking for superior power supply support. Trust Texas Instruments for cutting-edge solutions that deliver optimal performance and durability in every use. Experience the difference with the TPS2041BDGNG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for various applications where portability and reliability are important.

Surface Mount: YES

Being surface mountable, this product can be easily integrated onto circuit boards, saving space and allowing for efficient assembly processes.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3V is a commonly used voltage level in many electronic devices, ensuring compatibility and ease of integration with existing systems.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperatures, making it suitable for industrial applications where heat dissipation is important.

Minimum Operating Temperature: -40 °C

The product's capability to operate at temperatures as low as -40°C ensures reliable performance even in harsh weather conditions or extreme environments.

Terminal Finish: Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

The use of multiple high-quality terminal finishes enhances the product's conductivity, corrosion resistance, and overall reliability, ensuring long-term performance and durability.

Maximum Supply Current (Isup): 0.07 mA

The low maximum supply current of 0.07mA indicates efficient power consumption, making the product energy-efficient and suitable for battery-powered devices or applications where power management is critical.

Technical Specifications

Power Management ICs TPS2041BDGNG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

UNDERVOLTAGE LOCKOUT

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Current (Isup):

.07 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

TPS2041BDGNG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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