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TPS2013D

Texas Instruments

TPS2013D by Texas Instruments

TPS2013D by Texas Instruments is a Power Management IC with 8 terminals, operating voltage range of 2.7V to 5.5V, and temperature range of -40°C to 85°C. It is designed for industrial applications requiring power supply support circuits in a small outline package.

Median Price

$2.478

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 25,692 parts In-Stock

1+ parts

-

100+ parts

$2.030

1k+ parts

$1.820

10k+ parts

$1.710

25,692

-

$2.030

$1.820

$1.710

DigiKey

USA . 25,692 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.680

10k+ parts

-

25,692

-

-

$2.680

-

Verical

USA . 974 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.275

10k+ parts

$2.138

974

-

-

$2.275

$2.138

Chip1Stop

Japan . 75 parts In-Stock

1+ parts

-

100+ parts

$2.731

1k+ parts

-

10k+ parts

-

75

-

$2.731

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 511 parts In-Stock

1+ parts

$1.852

100+ parts

-

1k+ parts

-

10k+ parts

-

511

$1.852

-

-

-

TME

Poland . 70 parts In-Stock

1+ parts

$4.450

100+ parts

$2.920

1k+ parts

$2.770

10k+ parts

-

70

$4.450

$2.920

$2.770

-

Vyrian

USA . 5,101 parts In-Stock

1+ parts

-

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-

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5,101

-

-

-

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ECAB

Sweden . 375 parts In-Stock

1+ parts

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375

-

-

-

-

Electronics Depot

USA . 314 parts In-Stock

1+ parts

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314

-

-

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-

Mentor Electronics Marketing, LLC

USA . 99 parts In-Stock

1+ parts

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100+ parts

-

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99

-

-

-

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Bristol Electronics

USA . 57 parts In-Stock

1+ parts

-

100+ parts

$1.406

1k+ parts

-

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57

-

$1.406

-

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EMSNET

USA . 48 parts In-Stock

1+ parts

-

100+ parts

-

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48

-

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-

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 48 parts In-Stock

1+ parts

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48

-

-

-

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Prism Electronics

USA . 45 parts In-Stock

1+ parts

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45

-

-

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Resion

USA . 31 parts In-Stock

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31

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R&J Components

USA . 25 parts In-Stock

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25

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 819 parts In-Stock

1+ parts

$1.755

100+ parts

-

1k+ parts

-

10k+ parts

-

819

$1.755

-

-

-

Component Stockers USA

USA . 239 parts In-Stock

1+ parts

$3.670

100+ parts

$2.700

1k+ parts

$1.980

10k+ parts

$1.980

239

$3.670

$2.700

$1.980

$1.980

Parana Technologies

USA . 703 parts In-Stock

1+ parts

$12.260

100+ parts

-

1k+ parts

$12.685

10k+ parts

-

703

$12.260

-

$12.685

-

DigiPath Technology Company

USA . 1,904 parts In-Stock

1+ parts

$13.500

100+ parts

$12.420

1k+ parts

-

10k+ parts

-

1,904

$13.500

$12.420

-

-

ChromeModa Solutions

Germany . 5,741 parts In-Stock

1+ parts

$13.775

100+ parts

$11.296

1k+ parts

-

10k+ parts

-

5,741

$13.775

$11.296

-

-

IDEA Electronic Components Group

UK . 1,458 parts In-Stock

1+ parts

$13.775

100+ parts

$13.086

1k+ parts

$12.398

10k+ parts

-

1,458

$13.775

$13.086

$12.398

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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10,000

-

-

-

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A-Z Elektronik GmbH

Germany . 5,252 parts In-Stock

1+ parts

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1k+ parts

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5,252

-

-

-

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Perfect Parts

USA . 170 parts In-Stock

1+ parts

-

100+ parts

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170

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-

Overview

Enhance your power management solutions with the TPS2013D by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge Power Management ICs that cater to a wide range of applications. The TPS2013D, with its small outline package and dual terminal position, offers customers exceptional value and benefits. With a nominal supply voltage of 3V and a wide operating temperature range, this power supply support circuit is perfect for industrial-grade applications. Trust Texas Instruments to provide you with the best power management solutions on the market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and resilience, making the product suitable for various environments and conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in production.

Nominal Supply Voltage (Vsup): 3 V

The 3V supply voltage is commonly used in many electronic devices, ensuring compatibility and reliable performance.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, the product can withstand demanding conditions and maintain stability.

Minimum Supply Voltage (Vsup): 2.7 V

The minimum supply voltage of 2.7V allows for flexibility in power requirements and compatibility with various systems.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and durability.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments, making the product ideal for industrial applications.

Maximum Supply Current (Isup): 0.1 mA

Low supply current of 0.1mA helps in reducing power consumption and improving energy efficiency of the overall system.

Technical Specifications

Power Management ICs TPS2013D attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Current (Isup):

.1 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3.9 mm

Trade Compliance

TPS2013D Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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