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TPS2011APWPRG4

Texas Instruments

TPS2011APWPRG4 by Texas Instruments

TPS2011APWPRG4 by Texas Instruments is a Power Management IC with 14 terminals and a supply voltage range of 2.7V to 5.5V. It operates in industrial temperatures from -40°C to 85°C, making it suitable for power supply support circuits in various applications. The compact rectangular package with gull wing terminals and small outline design ensures easy surface mount installation.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,766 parts In-Stock

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Digiode

USA . 4,795 parts In-Stock

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4,795

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Distributors (Availability)

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Semicontronic

India . 981 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

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981

$1.500

$1.462

$1.455

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One Stop Electronics

USA . 1,558 parts In-Stock

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$3.500

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1,558

$3.500

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Ampacity Inc.

Singapore . 211 parts In-Stock

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$6.500

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211

$6.500

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AZTECH Wire

Italy . 794 parts In-Stock

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$7.025

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794

$7.025

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Parana Technologies

USA . 1,758 parts In-Stock

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$15.808

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$16.168

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1,758

$15.808

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$16.168

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ChromeModa Solutions

Germany . 5,684 parts In-Stock

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$17.762

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$14.565

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5,684

$17.762

$14.565

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IDEA Electronic Components Group

UK . 564 parts In-Stock

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$17.762

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$16.874

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$15.986

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564

$17.762

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$15.986

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Component Stockers USA

USA . 755 parts In-Stock

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$99.990

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755

$99.990

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Corphita

USA . 4,443 parts In-Stock

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4,443

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DigiPath Technology Company

USA . 824 parts In-Stock

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$16.014

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Microchip USA

USA . 488 parts In-Stock

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Corohmni

South Africa . 181 parts In-Stock

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Overview

Enhance the performance and efficiency of your power management systems with the TPS2011APWPRG4 by Texas Instruments. With a reputation for excellence in manufacturing, this Power Management IC offers unparalleled reliability and durability. Ideal for a wide range of applications, this product provides a seamless integration into your systems, delivering optimal results every time. Experience the value and benefits of Texas Instruments' cutting-edge technology with the TPS2011APWPRG4, where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness, making the product reliable and affordable.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly, saving time and resources.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3 V is common and widely supported, making it compatible with many systems and devices.

No. of Terminals: 14

Having 14 terminals allows for multiple connections and functionalities, offering versatility in power management.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliability and performance under demanding conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures functionality in a wide range of environments, including extreme cold.

Width (mm): 4.4 mm

The compact width of 4.4 mm allows for space-saving installation and integration in tight PCB layouts.

Minimum Supply Voltage (Vsup): 2.7 V

The minimum supply voltage of 2.7 V accommodates lower power requirements, enhancing energy efficiency.

Technical Specifications

Power Management ICs TPS2011APWPRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G14

Length:

5 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

4.4 mm

Trade Compliance

TPS2011APWPRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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