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TPS16416DRCR

Texas Instruments

TPS16416DRCR by Texas Instruments

TPS16416DRCR by Texas Instruments is a Power Management IC with 10 terminals, suitable for power supply support circuits. It operates b/w -40 to 125°C, with Vsup ranging from 2.7V to 60V. The small outline square package has a very thin profile and is surface-mountable.

Median Price

$1.456

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 12,272 parts In-Stock

1+ parts

$1.456

100+ parts

$1.203

1k+ parts

$0.650

10k+ parts

-

12,272

$1.456

$1.203

$0.650

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,321 parts In-Stock

1+ parts

$1.383

100+ parts

-

1k+ parts

-

10k+ parts

-

2,321

$1.383

-

-

-

Vyrian

USA . 6,525 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

-

6,525

-

-

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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100

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 6,639 parts In-Stock

1+ parts

$1.240

100+ parts

-

1k+ parts

-

10k+ parts

-

6,639

$1.240

-

-

-

Corphita

USA . 2,671 parts In-Stock

1+ parts

$1.310

100+ parts

-

1k+ parts

-

10k+ parts

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2,671

$1.310

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-

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Aranea Global

USA . 500 parts In-Stock

1+ parts

-

100+ parts

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500

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Overview

Discover the TPS16416DRCR by Texas Instruments, a top-of-the-line Power Management IC that sets the standard for quality and reliability. With a reputation for excellence, Texas Instruments delivers trusted products that excel in various applications. The TPS16416DRCR offers unmatched value with its advanced features and benefits, providing customers with a cutting-edge solution for their power management needs. Trust in Texas Instruments to provide you with a superior product that exceeds expectations and elevates your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various operating conditions.

Surface Mount: YES

Being surface mountable makes installation quick and easy, saving time and effort.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and better heat dissipation.

Nominal Supply Voltage (Vsup): 24 V

The 24V supply voltage provides a stable power source for consistent performance.

No. of Terminals: 10

With 10 terminals, this IC offers multiple connection options for flexibility in circuit design.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

This package style combines compact size with effective heat dissipation, ideal for space-constrained applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance under extreme conditions.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this IC can function in cold environments without issues.

Terminal Position: DUAL

The dual terminal position allows for easy and secure connections in the circuit.

Maximum Seated Height: 1 mm

A low seated height makes this IC suitable for compact designs with height restrictions.

Technical Specifications

Power Management ICs TPS16416DRCR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N10

Length:

3 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC10,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

60 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.53V

Width (mm):

3 mm

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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