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TPS16413DRCR

Texas Instruments

TPS16413DRCR by Texas Instruments

TPS16413DRCR by Texas Instruments is a power management IC with a nominal voltage of 24V and max output current of 1.8A. It is used as a power supply support circuit in various applications.

Median Price

$1.670

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 55,850 parts In-Stock

1+ parts

$1.456

100+ parts

$1.203

1k+ parts

$0.650

10k+ parts

-

55,850

$1.456

$1.203

$0.650

-

Mouser Electronics

USA . 3,210 parts In-Stock

1+ parts

$1.670

100+ parts

$1.370

1k+ parts

$1.240

10k+ parts

$1.060

3,210

$1.670

$1.370

$1.240

$1.060

DigiKey

USA . 273 parts In-Stock

1+ parts

$1.880

100+ parts

$1.370

1k+ parts

$1.208

10k+ parts

$1.092

273

$1.880

$1.370

$1.208

$1.092

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.762

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$0.762

-

-

-

Digiode

USA . 4,087 parts In-Stock

1+ parts

$1.383

100+ parts

-

1k+ parts

-

10k+ parts

-

4,087

$1.383

-

-

-

Vyrian

USA . 22,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

22,800

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 22,807 parts In-Stock

1+ parts

$0.700

100+ parts

-

1k+ parts

-

10k+ parts

-

22,807

$0.700

-

-

-

Continental Prestige Electronics

USA . 5,990 parts In-Stock

1+ parts

$0.762

100+ parts

-

1k+ parts

-

10k+ parts

$0.747

5,990

$0.762

-

-

$0.747

Argo Parts USA

USA . 3,825 parts In-Stock

1+ parts

$0.762

100+ parts

-

1k+ parts

-

10k+ parts

-

3,825

$0.762

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$0.762

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$0.762

-

-

-

Corphita

USA . 3,726 parts In-Stock

1+ parts

$1.310

100+ parts

-

1k+ parts

-

10k+ parts

-

3,726

$1.310

-

-

-

Overview

Discover the TPS16413DRCR by Texas Instruments, a top-quality Power Management IC that offers unparalleled performance and reliability. Manufactured by Texas Instruments, a renowned industry leader, this cutting-edge product is designed to meet the highest standards. The TPS16413DRCR provides exceptional efficiency and functionality, making it an ideal choice for a wide range of applications. With its compact size and advanced features, this power management IC delivers maximum value and convenience to customers. Experience the benefits of superior performance and reliability with the TPS16413DRCR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the product suitable for various environments.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

No. of Functions: 1

With a single function, this power management IC simplifies circuit design and integration, reducing complexity and potential errors.

Package Shape: SQUARE

The square shape optimizes space utilization on printed circuit boards, making it ideal for compact electronic devices.

Nominal Supply Voltage (Vsup): 24 V

The nominal supply voltage of 24V ensures compatibility with a wide range of power sources, enhancing versatility.

No. of Terminals: 10

With 10 terminals, this power management IC offers sufficient connectivity options for various components, promoting flexible circuit configurations.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style enables efficient heat dissipation and space-saving design, ensuring optimal performance and compact device integration.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable operation even in demanding conditions or applications with elevated heat levels.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40°C, this power management IC can operate in extreme cold environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish on the terminals provides excellent conductivity and corrosion resistance, contributing to long-term reliability and stable electrical connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexible mounting options, making it easier to integrate and connect the power management IC within various circuit layouts.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm enables compact device designs and facilitates efficient use of space, especially in slim-profile applications.

Width (mm): 3 mm

The narrow width of 3mm allows for space-efficient placement on circuit boards, enabling streamlined and compact electronic device designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This power management IC is specifically designed to support power supply circuits, providing effective voltage regulation, protection, and control functions.

Minimum Supply Voltage (Vsup): 2.7 V

The minimum supply voltage requirement of 2.7V allows for compatibility with low-power sources, making it suitable for energy-efficient applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures reliable solder joint formation during assembly processes, improving the overall product quality and durability.

Length: 3 mm

The compact length of 3mm facilitates space-efficient integration within various electronic device designs, enabling miniaturization and compactness.

Nominal Threshold Voltage (V): +1.53V

The nominal threshold voltage of +1.53V ensures accurate and reliable voltage detection or switching, enhancing the precision and performance of power management functions.

Maximum Output Current: 1.8 A

The high maximum output current capability of 1.8A allows for powering demanding loads or components, making it suitable for applications with higher power requirements.

No. of Channels: 1

With a single channel, this power management IC simplifies circuit designs and is suitable for applications where only a single power output or control is needed.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the need for traditional through-hole soldering, simplifying assembly processes and enabling more efficient production.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm enables high-density circuit integration, allowing for more compact and miniaturized electronic designs.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, this power management IC can withstand standard moisture exposure during assembly and storage, ensuring reliability and preventing damage.

Maximum Supply Voltage (Vsup): 60 V

The high maximum supply voltage of 60V grants compatibility with a wide range of power sources, expanding the areas of application for this power management IC.

Technical Specifications

Power Management ICs TPS16413DRCR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

1.8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC10,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

60 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+1.53V

Width (mm):

3 mm

Trade Compliance

TPS16413DRCR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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