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TPIC2101N

Texas Instruments

TPIC2101N by Texas Instruments

TPIC2101N by Texas Instruments is a Motion Control IC with 12V nominal voltage, 14 terminals, and 0.05A max output current. Ideal for industrial applications requiring brush DC motor control, it operates b/w -40 to 105 °C with a package style of IN-LINE.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,990 parts In-Stock

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Bristol Electronics

USA . 2,784 parts In-Stock

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Digiode

USA . 1,448 parts In-Stock

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LittleDiode

UK . 9 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 8 parts In-Stock

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One Stop Electronics

USA . 414 parts In-Stock

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$7.500

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414

$7.500

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Parana Technologies

USA . 1,652 parts In-Stock

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$8.819

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$9.505

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$8.819

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DigiPath Technology Company

USA . 1,600 parts In-Stock

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$9.711

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$8.934

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$9.711

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ChromeModa Solutions

Germany . 6,964 parts In-Stock

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$9.909

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$8.125

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IDEA Electronic Components Group

UK . 1,631 parts In-Stock

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$9.909

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$9.414

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$8.918

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$8.918

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AZTECH Wire

Italy . 770 parts In-Stock

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$12.640

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Lixinc

USA . 14,649 parts In-Stock

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Kepictronics

USA . 8,000 parts In-Stock

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Corphita

USA . 464 parts In-Stock

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Microchip USA

USA . 270 parts In-Stock

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Overview

Enhance your motion control applications with the TPIC2101N by Texas Instruments. Crafted with precision and quality, this IC offers reliability and efficiency like no other. Whether you're looking to optimize your brush DC motor controller or seeking industrial-grade performance, this product delivers outstanding value and benefits. Trust in Texas Instruments for cutting-edge technology that meets your needs. Elevate your projects with the TPIC2101N today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides excellent protection for the internal components of the Motion Control IC, ensuring durability and reliability.

Nominal Supply Voltage (Vsup): 12 V

Operating at a nominal supply voltage of 12V ensures compatibility with a wide range of systems and applications, making this Motion Control IC versatile.

No. of Terminals: 14

Having 14 terminals allows for a sufficient number of connections to external devices, enabling greater control and functionality within the motion control system.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this Motion Control IC can function effectively in harsh environments or temperature fluctuations.

Maximum Output Current: 0.05 A

The maximum output current of 0.05 A indicates that this Motion Control IC can support moderate power requirements, making it suitable for driving various types of motors efficiently.

Technical Specifications

Motion Control ICs TPIC2101N attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDIP-T14

Length:

19.305 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.05 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

8/16

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

10 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

TPIC2101N Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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