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TPIC2101DR

Texas Instruments

TPIC2101DR by Texas Instruments

TPIC2101DR by Texas Instruments is a Motion Control IC with 14 terminals, operating voltage of 8-16V, and max output current of 0.05A. Ideal for brush DC motor control applications due to its industrial temperature grade and compact small outline package design.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,372 parts In-Stock

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6,372

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Digiode

USA . 3,501 parts In-Stock

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3,501

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Distributors (Availability)

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Semicontronic

India . 655 parts In-Stock

1+ parts

$4.500

100+ parts

$4.388

1k+ parts

$4.365

10k+ parts

-

655

$4.500

$4.388

$4.365

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AZTECH Wire

Italy . 561 parts In-Stock

1+ parts

$5.001

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561

$5.001

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Ampacity Inc.

Singapore . 483 parts In-Stock

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$5.500

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483

$5.500

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Parana Technologies

USA . 1,025 parts In-Stock

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$7.265

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$7.766

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1,025

$7.265

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$7.766

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One Stop Electronics

USA . 484 parts In-Stock

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$7.500

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484

$7.500

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DigiPath Technology Company

USA . 791 parts In-Stock

1+ parts

$8.000

100+ parts

$7.360

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791

$8.000

$7.360

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ChromeModa Solutions

Germany . 6,948 parts In-Stock

1+ parts

$8.163

100+ parts

$6.694

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6,948

$8.163

$6.694

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IDEA Electronic Components Group

UK . 412 parts In-Stock

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$8.163

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$7.347

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412

$8.163

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$7.347

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Corphita

USA . 4,142 parts In-Stock

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Corohmni

South Africa . 204 parts In-Stock

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Overview

Enhance your motion control applications with the TPIC2101DR by Texas Instruments, a high-quality IC designed for optimal performance. Manufactured by industry leader Texas Instruments, this versatile device offers unparalleled reliability and precision in a compact rectangular package. Ideal for brush DC motor controllers, this IC operates efficiently at temperatures ranging from -40 to 105°C. With a nominal supply voltage of 12V and dual terminal position, the TPIC2101DR provides customers with the value and benefits they need for seamless motion control solutions. Experience the advantages of Texas Instruments technology with this innovative product today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection, making the product suitable for various operating environments.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Nominal Supply Voltage (Vsup): 12 V

Operating at a nominal supply voltage of 12V ensures compatibility with standard power sources, making it versatile for different applications.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, increasing its reliability and longevity.

Technology: BIPOLAR

Utilizing bipolar technology provides a balance between efficiency and performance, making it a reliable choice for motion control applications.

Technical Specifications

Motion Control ICs TPIC2101DR attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.05 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

8/16

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

10 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width (mm):

3.9 mm

Trade Compliance

TPIC2101DR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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