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TPIC0107BDWP

Texas Instruments

TPIC0107BDWP by Texas Instruments

TPIC0107BDWP by Texas Instruments is a Motion Control IC with 20 terminals, operating voltage of 6-13.2V, and max output current of 7.5A. Ideal for automotive applications due to its BICMOS technology and compact size (12.825mm x 7.52mm x 2.65mm).

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,681 parts In-Stock

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Digiode

USA . 3,088 parts In-Stock

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Ashlea Components Ltd

UK . 3 parts In-Stock

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Parana Technologies

USA . 1,633 parts In-Stock

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$2.381

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$2.879

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1,633

$2.381

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$2.879

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DigiPath Technology Company

USA . 1,557 parts In-Stock

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$2.622

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$2.412

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1,557

$2.622

$2.412

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ChromeModa Solutions

Germany . 5,823 parts In-Stock

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$2.675

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$2.194

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5,823

$2.675

$2.194

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IDEA Electronic Components Group

UK . 139 parts In-Stock

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$2.675

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$2.408

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139

$2.675

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$2.408

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One Stop Electronics

USA . 1,308 parts In-Stock

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$5.500

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1,308

$5.500

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AZTECH Wire

Italy . 345 parts In-Stock

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$14.519

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345

$14.519

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Corphita

USA . 1,206 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 400 parts In-Stock

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Microchip USA

USA . 131 parts In-Stock

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Overview

Enhance the performance of your motion control applications with the TPIC0107BDWP by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality products that guarantee reliability and durability. The TPIC0107BDWP is a versatile motion control IC that offers seamless integration and precise control for brush DC motor applications. With its compact design and wide operating temperature range, this IC provides exceptional value and efficiency for your projects. Upgrade your motion control systems today with the TPIC0107BDWP and experience the difference in performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides excellent durability and resistance to external elements, making this product suitable for a wide range of applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient integration of the motion control IC into electronic systems, saving space and simplifying assembly processes.

Nominal Supply Voltage (Vsup): 13.2 V

The nominal supply voltage of 13.2 V ensures stable and reliable operation of the motion control IC within a specified voltage range, offering consistent performance.

Maximum Output Current: 7.5 A

With a maximum output current of 7.5 A, this motion control IC is capable of driving high-current loads, making it suitable for applications requiring robust and efficient motor control.

Technology: BICMOS

The BICMOS technology used in this motion control IC combines the advantages of both bipolar and CMOS technologies, offering high-speed operation, low power consumption, and enhanced reliability.

Technical Specifications

Motion Control ICs TPIC0107BDWP attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G20

Length:

12.825 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

7.5 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5/6

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

6 V

Nominal Supply Voltage (Vsup):

13.2 V

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.52 mm

Trade Compliance

TPIC0107BDWP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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