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TPIC2101DG4

Texas Instruments

TPIC2101DG4 by Texas Instruments

TPIC2101DG4 by Texas Instruments is a Motion Control IC with 14 terminals, operating voltage range of 8-16V, and max output current of 0.05A. It is designed for automotive applications requiring precise control over brush DC motors in a compact small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,093 parts In-Stock

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3,093

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Digiode

USA . 3,040 parts In-Stock

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3,040

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Distributors (Availability)

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Semicontronic

India . 1,330 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

10k+ parts

-

1,330

$3.500

$3.412

$3.395

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One Stop Electronics

USA . 989 parts In-Stock

1+ parts

$6.500

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989

$6.500

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Ampacity Inc.

Singapore . 1,101 parts In-Stock

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$7.500

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1,101

$7.500

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AZTECH Wire

Italy . 409 parts In-Stock

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$9.577

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409

$9.577

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Parana Technologies

USA . 1,546 parts In-Stock

1+ parts

$20.475

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$20.536

10k+ parts

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1,546

$20.475

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$20.536

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DigiPath Technology Company

USA . 1,612 parts In-Stock

1+ parts

$22.546

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1,612

$22.546

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ChromeModa Solutions

Germany . 3,369 parts In-Stock

1+ parts

$23.006

100+ parts

$18.865

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3,369

$23.006

$18.865

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IDEA Electronic Components Group

UK . 2,189 parts In-Stock

1+ parts

$23.006

100+ parts

$21.856

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$20.705

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2,189

$23.006

$21.856

$20.705

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Corphita

USA . 2,632 parts In-Stock

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2,632

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Perfect Parts

USA . 560 parts In-Stock

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560

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Microchip USA

USA . 252 parts In-Stock

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252

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Corohmni

South Africa . 127 parts In-Stock

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Overview

Unlock the power of precise motion control with the TPIC2101DG4 by Texas Instruments. Crafted with quality materials and advanced technology, this motion control IC offers unparalleled performance in a compact package. Ideal for automotive applications and brush DC motor controllers, this versatile IC provides value and reliability to customers seeking seamless operation and efficiency. Elevate your projects with the TPIC2101DG4 and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability enables easy and efficient assembly onto PCBs, saving space and reducing overall product size.

Nominal Supply Voltage (Vsup): 12 V

Operating at a nominal supply voltage of 12V provides compatibility with a wide range of power sources and ensures reliable performance.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, the IC can withstand harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows the IC to function in cold environments without issues.

Maximum Seated Height: 1.75 mm

The compact maximum seated height of 1.75mm makes the IC suitable for applications with limited space constraints.

Maximum Output Current: 0.05 A

The high maximum output current of 0.05A allows the IC to drive motors and other loads efficiently.

Technical Specifications

Motion Control ICs TPIC2101DG4 attributes and parameters. Explore more Motion Control ICs devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.05 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

8/16

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

10 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

TPIC2101DG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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