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TPA6166A2YFFR

Texas Instruments

TPA6166A2YFFR by Texas Instruments

TPA6166A2YFFR by Texas Instruments is a consumer IC with 25 terminals in a square grid array package. It operates b/w -40 to 85°C, delivering 0.03W nominal output power at 1.7-1.9V supply voltage for industrial applications requiring compact design and fine pitch terminal connections.

Median Price

$1.285

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,500 parts In-Stock

1+ parts

$1.070

100+ parts

$0.823

1k+ parts

$0.433

10k+ parts

-

8,500

$1.070

$0.823

$0.433

-

Mouser Electronics

USA . 258 parts In-Stock

1+ parts

$1.500

100+ parts

$1.280

1k+ parts

$0.924

10k+ parts

$0.677

258

$1.500

$1.280

$0.924

$0.677

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,214 parts In-Stock

1+ parts

$1.016

100+ parts

-

1k+ parts

-

10k+ parts

-

3,214

$1.016

-

-

-

Chip Stock

USA . 77,811 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

77,811

-

-

-

-

Vyrian

USA . 5,557 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,557

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,313 parts In-Stock

1+ parts

$0.963

100+ parts

-

1k+ parts

-

10k+ parts

-

2,313

$0.963

-

-

-

Component Stockers USA

USA . 355 parts In-Stock

1+ parts

$1.530

100+ parts

$1.070

1k+ parts

-

10k+ parts

-

355

$1.530

$1.070

-

-

Parana Technologies

USA . 1,374 parts In-Stock

1+ parts

$2.128

100+ parts

-

1k+ parts

$2.641

10k+ parts

-

1,374

$2.128

-

$2.641

-

ChromeModa Solutions

Germany . 4,554 parts In-Stock

1+ parts

$2.391

100+ parts

$1.961

1k+ parts

-

10k+ parts

-

4,554

$2.391

$1.961

-

-

IDEA Electronic Components Group

UK . 858 parts In-Stock

1+ parts

$2.391

100+ parts

-

1k+ parts

$2.152

10k+ parts

-

858

$2.391

-

$2.152

-

Microchip USA

USA . 4,344 parts In-Stock

1+ parts

$4.508

100+ parts

-

1k+ parts

-

10k+ parts

-

4,344

$4.508

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

-

Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,000

-

-

-

-

DigiPath Technology Company

USA . 387 parts In-Stock

1+ parts

-

100+ parts

$2.156

1k+ parts

-

10k+ parts

-

387

-

$2.156

-

-

Overview

Upgrade your consumer electronics with the TPA6166A2YFFR by Texas Instruments, a top-notch manufacturer known for quality and innovation. This versatile IC offers exceptional performance in a compact package, perfect for a wide range of applications. With a nominal output power of 0.03 W and a minimum supply voltage of 1.7 V, this product delivers reliable results while maintaining a low profile design. Trust Texas Instruments to provide the cutting-edge technology you need to enhance your devices and stay ahead of the competition.

Feature Benefit Bullets

Surface Mount: YES

Enables easy and efficient installation on circuit boards.

Package Shape: SQUARE

Provides a compact form factor for space-constrained applications.

General IC Type: CONSUMER CIRCUIT

Specifically designed for consumer electronics applications.

No. of Terminals: 25

Sufficient number of terminals for versatile connectivity options.

Maximum Operating Temperature: 85 °C

Ensures reliable operation in various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range for versatile usage scenarios.

Nominal Output Power: 0.03 W

Efficient power output for consumer electronic devices.

Peak Reflow Temperature °C: 260

Withstands high temperature soldering processes for robust assembly.

Width: 2.44 mm

Compact width for space-saving designs.

Terminal Pitch: 0.4 mm

Fine pitch for high-density PCB designs.

Technical Specifications

Other Function Consumer ICs TPA6166A2YFFR attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-XBGA-B25

JESD-609 Code:

e1

Length:

2.44 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.03 W

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.44 mm

Trade Compliance

TPA6166A2YFFR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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