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TPA6166A2YFF

Texas Instruments

TPA6166A2YFF by Texas Instruments

TPA6166A2YFF by Texas Instruments is a consumer IC with 25 terminals in a square grid array package. It operates b/w -25°C to 85°C, with Vsup ranging from 1.7V to 1.9V. This IC is ideal for applications requiring a very thin profile and fine pitch design, such as consumer circuits in compact electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,104 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,104

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-

-

-

Digiode

USA . 2,947 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,947

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,658 parts In-Stock

1+ parts

$1.081

100+ parts

-

1k+ parts

$1.928

10k+ parts

-

1,658

$1.081

-

$1.928

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IDEA Electronic Components Group

UK . 2,285 parts In-Stock

1+ parts

$1.215

100+ parts

-

1k+ parts

$1.094

10k+ parts

-

2,285

$1.215

-

$1.094

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ChromeModa Solutions

Germany . 1,059 parts In-Stock

1+ parts

$1.215

100+ parts

$0.996

1k+ parts

-

10k+ parts

-

1,059

$1.215

$0.996

-

-

AZTECH Wire

Italy . 198 parts In-Stock

1+ parts

$11.313

100+ parts

-

1k+ parts

-

10k+ parts

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198

$11.313

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-

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One Stop Electronics

USA . 1,202 parts In-Stock

1+ parts

$12.800

100+ parts

-

1k+ parts

-

10k+ parts

-

1,202

$12.800

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-

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DigiPath Technology Company

USA . 1,517 parts In-Stock

1+ parts

-

100+ parts

$1.095

1k+ parts

-

10k+ parts

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1,517

-

$1.095

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-

Corphita

USA . 637 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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637

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Overview

Experience top-notch audio quality with the TPA6166A2YFF by Texas Instruments. Known for their superior manufacturing standards, Texas Instruments has crafted this consumer circuit IC with precision and expertise. Perfect for a wide range of applications, this surface mount IC offers exceptional value and benefits to customers. Whether you're looking to enhance your audio experience in consumer electronics or other functions, the TPA6166A2YFF delivers unparalleled performance in a compact and reliable package. Elevate your audio experience today with Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, making this product suitable for automated manufacturing processes.

Package Shape: SQUARE

Square package shape provides a compact design, saving space on the circuit board and enabling denser integration of components.

General IC Type: CONSUMER CIRCUIT

Designed specifically for consumer applications, this IC meets the requirements for various consumer electronic devices and ensures optimal performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can withstand elevated temperatures, making it suitable for applications where heat dissipation is a concern.

Minimum Operating Temperature: -25 °C

The low minimum operating temperature ensures reliable performance even in cold environments, making this IC versatile and suitable for various operating conditions.

Width: 2.44 mm

Narrow width of the IC allows for tight spacing on the circuit board, enabling compact design and efficient use of available space.

Minimum Supply Voltage (Vsup): 1.7 V

Low minimum supply voltage requirement allows for operation in energy-efficient devices and ensures compatibility with a wide range of power sources.

Maximum Supply Voltage (Vsup): 1.9 V

The maximum supply voltage of 1.9 V provides a safe operating range for the IC, protecting it from potential overvoltage conditions and enhancing its reliability.

Technical Specifications

Other Function Consumer ICs TPA6166A2YFF attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-XBGA-B25

Length:

2.44 mm

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Width:

2.44 mm

Trade Compliance

TPA6166A2YFF General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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