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TPA6166A2YFFT

Texas Instruments

TPA6166A2YFFT by Texas Instruments

TPA6166A2YFFT by Texas Instruments is a consumer circuit IC with 25 terminals in a square grid array package. It operates b/w -40 to 85°C, with a nominal output power of 0.03W. Ideal for industrial applications requiring a very thin profile and fine pitch design.

Median Price

$1.291

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,000 parts In-Stock

1+ parts

$1.643

100+ parts

$1.264

1k+ parts

$0.665

10k+ parts

-

1,000

$1.643

$1.264

$0.665

-

Rochester

USA . 6,748 parts In-Stock

1+ parts

-

100+ parts

$1.130

1k+ parts

$0.938

10k+ parts

$0.836

6,748

-

$1.130

$0.938

$0.836

DigiKey

USA . 6,748 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.410

10k+ parts

-

6,748

-

-

$1.410

-

Verical

USA . 6,748 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.172

10k+ parts

$1.045

6,748

-

-

$1.172

$1.045

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 293 parts In-Stock

1+ parts

$0.878

100+ parts

-

1k+ parts

-

10k+ parts

-

293

$0.878

-

-

-

Vyrian

USA . 531 parts In-Stock

1+ parts

$0.924

100+ parts

-

1k+ parts

-

10k+ parts

-

531

$0.924

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 496 parts In-Stock

1+ parts

$0.832

100+ parts

-

1k+ parts

-

10k+ parts

-

496

$0.832

-

-

-

Parana Technologies

USA . 1,780 parts In-Stock

1+ parts

$1.860

100+ parts

-

1k+ parts

$2.408

10k+ parts

-

1,780

$1.860

-

$2.408

-

DigiPath Technology Company

USA . 1,945 parts In-Stock

1+ parts

$2.048

100+ parts

$1.884

1k+ parts

-

10k+ parts

-

1,945

$2.048

$1.884

-

-

ChromeModa Solutions

Germany . 2,526 parts In-Stock

1+ parts

$2.090

100+ parts

$1.714

1k+ parts

-

10k+ parts

-

2,526

$2.090

$1.714

-

-

IDEA Electronic Components Group

UK . 1,068 parts In-Stock

1+ parts

$2.090

100+ parts

-

1k+ parts

$1.881

10k+ parts

-

1,068

$2.090

-

$1.881

-

Microchip USA

USA . 2,705 parts In-Stock

1+ parts

$8.731

100+ parts

-

1k+ parts

-

10k+ parts

-

2,705

$8.731

-

-

-

Perfect Parts

USA . 558 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

558

-

-

-

-

Overview

Discover the TPA6166A2YFFT by Texas Instruments, a top-tier manufacturer renowned for its high-quality consumer ICs. This innovative product offers a wide range of applications in the electronics industry, providing customers with exceptional value and benefits. With a compact square package shape and very thin profile, this IC delivers reliable performance and efficiency. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the TPA6166A2YFFT and experience the difference today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, making this product suitable for mass production and automated assembly processes.

Package Shape: SQUARE

The square package shape offers a compact footprint, maximizing space efficiency on the circuit board.

Terminal Position: BOTTOM

Bottom terminal position provides a clean and organized layout on the circuit board, simplifying connection and troubleshooting.

Nominal Output Power: 0.03 W

Despite its small size, the product offers a decent nominal output power, making it suitable for low-power consumer electronics applications.

Minimum Supply Voltage: 1.7 V

The low minimum supply voltage requirement allows for operation in energy-efficient systems or battery-powered devices.

Technical Specifications

Other Function Consumer ICs TPA6166A2YFFT attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-XBGA-B25

JESD-609 Code:

e1

Length:

2.44 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.03 W

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

1.9 V

Minimum Supply Voltage (Vsup):

1.7 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.44 mm

Trade Compliance

TPA6166A2YFFT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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