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TPA5050RSAT

Texas Instruments

TPA5050RSAT by Texas Instruments

TPA5050RSAT by Texas Instruments is a 16-terminal IC with 3V power supply, operating b/w -40 to 85°C. It features no-lead terminal form, quad position, and 0.65mm pitch. Ideal for consumer circuits in industrial applications due to its compact square chip carrier package.

Median Price

$5.498

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 29,871 parts In-Stock

1+ parts

$5.559

100+ parts

$4.532

1k+ parts

$3.021

10k+ parts

-

29,871

$5.559

$4.532

$3.021

-

Mouser Electronics

USA . 133 parts In-Stock

1+ parts

$8.060

100+ parts

$5.790

1k+ parts

$4.700

10k+ parts

-

133

$8.060

$5.790

$4.700

-

Rochester

USA . 7,400 parts In-Stock

1+ parts

-

100+ parts

$4.350

1k+ parts

$3.890

10k+ parts

$3.660

7,400

-

$4.350

$3.890

$3.660

DigiKey

USA . 7,400 parts In-Stock

1+ parts

-

100+ parts

$5.730

1k+ parts

-

10k+ parts

-

7,400

-

$5.730

-

-

Verical

USA . 7,400 parts In-Stock

1+ parts

-

100+ parts

$5.438

1k+ parts

$4.862

10k+ parts

$4.575

7,400

-

$5.438

$4.862

$4.575

Arrow

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.845

10k+ parts

$3.735

250

-

-

$3.845

$3.735

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,522 parts In-Stock

1+ parts

$3.902

100+ parts

-

1k+ parts

-

10k+ parts

-

4,522

$3.902

-

-

-

Digiode

USA . 2,583 parts In-Stock

1+ parts

$3.990

100+ parts

-

1k+ parts

-

10k+ parts

-

2,583

$3.990

-

-

-

DF Sales Co.

USA . 250 parts In-Stock

1+ parts

$4.200

100+ parts

-

1k+ parts

-

10k+ parts

-

250

$4.200

-

-

-

DF Sales Co.

USA . 250 parts In-Stock

1+ parts

$4.200

100+ parts

-

1k+ parts

-

10k+ parts

-

250

$4.200

-

-

-

ACDS - Activité Composants Distribution Service

France . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 327 parts In-Stock

1+ parts

$0.837

100+ parts

-

1k+ parts

$1.798

10k+ parts

-

327

$0.837

-

$1.798

-

DigiPath Technology Company

USA . 1,625 parts In-Stock

1+ parts

$0.922

100+ parts

$0.848

1k+ parts

-

10k+ parts

-

1,625

$0.922

$0.848

-

-

ChromeModa Solutions

Germany . 6,964 parts In-Stock

1+ parts

$0.941

100+ parts

$0.772

1k+ parts

-

10k+ parts

-

6,964

$0.941

$0.772

-

-

IDEA Electronic Components Group

UK . 2,330 parts In-Stock

1+ parts

$0.941

100+ parts

-

1k+ parts

$0.847

10k+ parts

-

2,330

$0.941

-

$0.847

-

Corphita

USA . 1,314 parts In-Stock

1+ parts

$3.780

100+ parts

-

1k+ parts

-

10k+ parts

-

1,314

$3.780

-

-

-

Component Stockers USA

USA . 40,168 parts In-Stock

1+ parts

$4.360

100+ parts

$4.090

1k+ parts

$3.280

10k+ parts

$3.280

40,168

$4.360

$4.090

$3.280

$3.280

Lixinc

USA . 19,591 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

19,591

-

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Perfect Parts

USA . 3,067 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,067

-

-

-

-

A-Z Elektronik GmbH

Germany . 803 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

803

-

-

-

-

Overview

Discover the cutting-edge TPA5050RSAT from Texas Instruments, a top-tier manufacturer known for producing high-quality consumer ICs. This versatile chip carrier offers a wide range of applications, making it ideal for various consumer circuit needs. With a robust construction and an industrial temperature grade, this innovative product ensures reliable performance in any environment. Experience the unmatched value and benefits that Texas Instruments brings to the table with the TPA5050RSAT, providing customers with superior quality and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy and convenient installation onto circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Optimal shape for efficient use of space on the circuit board, making the product suitable for compact designs.

Power Supplies (V): 3

Operates on a standard voltage supply, making it compatible with a wide range of applications.

No. of Terminals: 16

Offers multiple connection points for versatile connectivity options, increasing the functionality of the product.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring reliable performance even in demanding operating environments.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold conditions, making the product versatile and resilient in various climates.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and excellent conductivity for stable connections and signal transmission.

Terminal Position: QUAD

Facilitates easy installation and secure positioning on the circuit board, enhancing the product's reliability.

Maximum Seated Height: 1 mm

Low profile design allows for compact installation and efficient use of space in electronic devices.

Width: 4 mm

Compact size enables versatile placement options within electronic devices, contributing to a sleek and space-efficient design.

Minimum Supply Voltage (Vsup): 3 V

Operates efficiently at a low supply voltage, conserving energy and reducing power consumption.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during assembly processes, ensuring reliable solder joints and component connections.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where durability, reliability, and consistent performance are essential.

Terminal Form: NO LEAD

Lead-free terminals adhere to environmental regulations and reduce the risk of harmful substances in electronic devices.

Terminal Pitch: 0.65 mm

Fine pitch allows for high-density packaging and precise connection points, ideal for compact electronic designs.

Moisture Sensitivity Level (MSL): 2

Moderate sensitivity to moisture ensures the product's reliability and performance in varying humidity conditions.

Maximum Supply Voltage (Vsup): 3.6 V

Supports a higher supply voltage range for flexibility in power input, accommodating various applications and usage scenarios.

Technical Specifications

Other Function Consumer ICs TPA5050RSAT attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

TPA5050RSAT General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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