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TPA5050RSATG4

Texas Instruments

TPA5050RSATG4 by Texas Instruments

TPA5050RSATG4 by Texas Instruments is a 16-terminal consumer IC with a supply voltage range of 3-3.6V. Operating temperature ranges from -40 to 85°C, making it suitable for industrial applications. This square-shaped chip carrier has a compact size of 4x4mm and low power consumption at 3mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,198 parts In-Stock

1+ parts

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4,198

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Vyrian

USA . 2,092 parts In-Stock

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2,092

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Bristol Electronics

USA . 117 parts In-Stock

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117

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 947 parts In-Stock

1+ parts

$1.383

100+ parts

-

1k+ parts

$2.097

10k+ parts

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947

$1.383

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$2.097

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DigiPath Technology Company

USA . 2,124 parts In-Stock

1+ parts

$1.523

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2,124

$1.523

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ChromeModa Solutions

Germany . 6,652 parts In-Stock

1+ parts

$1.554

100+ parts

$1.274

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6,652

$1.554

$1.274

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IDEA Electronic Components Group

UK . 1,070 parts In-Stock

1+ parts

$1.554

100+ parts

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$1.399

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1,070

$1.554

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$1.399

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One Stop Electronics

USA . 276 parts In-Stock

1+ parts

$9.800

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276

$9.800

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AZTECH Wire

Italy . 541 parts In-Stock

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$10.664

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541

$10.664

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Corphita

USA . 745 parts In-Stock

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745

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Overview

Discover the innovative TPA5050RSATG4 by Texas Instruments, a high-quality consumer circuit designed to enhance your electronic projects. With Texas Instruments' reputation for excellence in manufacturing, this chip carrier offers a wide range of applications and benefits. From its very thin profile to its robust temperature tolerance, this IC delivers reliability and performance. Upgrade your designs with the TPA5050RSATG4 and experience the superior quality and value that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the product resistant to physical damage during handling and installation.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, reducing assembly time and cost.

Package Shape: SQUARE

The square package shape optimizes space utilization on the circuit board, making it suitable for compact electronic devices.

Power Supplies (V): 3

The 3V power supply ensures compatibility with a wide range of consumer electronic devices, providing stable performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand high temperature environments, enhancing reliability.

Minimum Operating Temperature: -40 °C

The product can operate efficiently in low temperature conditions down to -40°C, ensuring functionality in various environments.

Width: 4 mm

The compact 4mm width allows for space-saving integration in tight layouts, making it suitable for small electronic devices.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm enables high-density mounting on circuit boards, improving overall system performance.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V provides a safety margin for potential voltage fluctuations, ensuring stable operation.

Technical Specifications

Other Function Consumer ICs TPA5050RSATG4 attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQCC-N16

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

TPA5050RSATG4 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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