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TMSC6727BZDH350TAN

Texas Instruments

TMSC6727BZDH350TAN by Texas Instruments

TMSC6727BZDH350TAN by Texas Instruments is a CMOS DSP with TIN SILVER COPPER finish. It can withstand 30s at 260°C peak reflow temperature. Ideal for applications requiring high-performance digital signal processing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,626 parts In-Stock

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Digiode

USA . 4,902 parts In-Stock

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4,902

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 981 parts In-Stock

1+ parts

$2.000

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-

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981

$2.000

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AZTECH Wire

Italy . 199 parts In-Stock

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$5.524

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199

$5.524

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Parana Technologies

USA . 296 parts In-Stock

1+ parts

$26.952

100+ parts

$2,502.890

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$24.257

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296

$26.952

$2,502.890

$24.257

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DigiPath Technology Company

USA . 312 parts In-Stock

1+ parts

$29.677

100+ parts

$27.303

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312

$29.677

$27.303

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ChromeModa Solutions

Germany . 577 parts In-Stock

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$30.283

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$24.832

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577

$30.283

$24.832

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IDEA Electronic Components Group

UK . 132 parts In-Stock

1+ parts

$30.283

100+ parts

$28.769

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$27.255

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132

$30.283

$28.769

$27.255

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Corohmni

South Africa . 5,205 parts In-Stock

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$67.100

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$67.100

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Corphita

USA . 2,853 parts In-Stock

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2,853

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Overview

Unleash the power of cutting-edge technology with the TMSC6727BZDH350TAN by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital Signal Processors that excel in a wide range of applications. From audio processing to industrial automation, this DSP offers unparalleled performance and efficiency. Experience seamless integration and superior signal processing capabilities with the TMSC6727BZDH350TAN, providing customers with exceptional value and unmatched benefits for their projects. Elevate your designs with Texas Instruments today!

Feature Benefit Bullets

Terminal Finish: TIN

The TIN terminal finish provides good solderability and reliability for the product, ensuring durable connections during usage.

Terminal Finish: SILVER

The SILVER terminal finish offers excellent conductivity and corrosion resistance, enhancing the overall performance and longevity of the product.

Terminal Finish: COPPER

The COPPER terminal finish provides high thermal conductivity and good electrical properties, improving the efficiency and reliability of the product.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time of 30 seconds ensures that the product undergoes proper soldering without damaging sensitive components, leading to a reliable end result.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C enables the product to withstand the reflow process effectively, ensuring proper soldering and strong mechanical bonds.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The use of DIGITAL SIGNAL PROCESSOR as the peripheral IC type ensures high-speed processing of digital signals, making the product suitable for applications requiring real-time data processing and analysis.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product energy efficient and reliable for various digital signal processing tasks.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates that the product has moderate sensitivity to moisture, requiring standard handling and storage practices to maintain its performance and reliability.

Technical Specifications

Digital Signal Processors (DSPs) TMSC6727BZDH350TAN attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TMSC6727BZDH350TAN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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