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TMSC6727BZDH300TAN

Texas Instruments

TMSC6727BZDH300TAN by Texas Instruments

TMSC6727BZDH300TAN by Texas Instruments is a CMOS DSP with TIN SILVER COPPER finish. It can withstand 30s at 260°C peak reflow temp. Ideal for digital signal processing applications due to its MSL level of 3.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,436 parts In-Stock

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3,436

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Vyrian

USA . 3,307 parts In-Stock

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3,307

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 761 parts In-Stock

1+ parts

$8.000

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-

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761

$8.000

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AZTECH Wire

Italy . 548 parts In-Stock

1+ parts

$15.480

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548

$15.480

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Corohmni

South Africa . 903 parts In-Stock

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$33.429

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903

$33.429

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Parana Technologies

USA . 609 parts In-Stock

1+ parts

$38.913

100+ parts

$3,613.706

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$35.022

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609

$38.913

$3,613.706

$35.022

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DigiPath Technology Company

USA . 327 parts In-Stock

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$42.849

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327

$42.849

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IDEA Electronic Components Group

UK . 1,261 parts In-Stock

1+ parts

$43.723

100+ parts

$41.537

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$39.351

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1,261

$43.723

$41.537

$39.351

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ChromeModa Solutions

Germany . 1,248 parts In-Stock

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$43.723

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$35.853

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$43.723

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Corphita

USA . 3,648 parts In-Stock

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Overview

Unlock the power of digital signal processing with the TMSC6727BZDH300TAN by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments sets the standard in the industry. This DSP offers unparalleled performance and versatility, making it ideal for a wide range of applications. Whether you're working on audio processing, sensor data analysis, or telecommunications, this DSP delivers outstanding value and performance. Upgrade your projects with the TMSC6727BZDH300TAN and experience the difference Texas Instruments can make.

Feature Benefit Bullets

Terminal Finish: TIN

Tin terminal finish provides excellent solderability and corrosion resistance, ensuring reliable connections in various applications.

Terminal Finish: SILVER

Silver terminal finish offers high conductivity and superior electrical performance, enhancing signal transmission efficiency in the DSP.

Terminal Finish: COPPER

Copper terminal finish provides good thermal conductivity, improving heat dissipation in the DSP for enhanced performance and longevity.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time of 30 seconds reduces the risk of thermal stress or damage to the DSP during assembly, ensuring product reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures proper solder melting and joint formation, leading to robust connections in the DSP.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Peripheral IC type specifies the DSP's core functionality, indicating it is designed for digital signal processing tasks and other related functions.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, making the DSP energy-efficient and capable of handling complex signal processing tasks efficiently.

Moisture Sensitivity Level (MSL): 3

MSL level of 3 indicates the DSP can withstand exposure to moderate humidity levels during manufacturing, storage, and operation without compromising performance.

Technical Specifications

Digital Signal Processors (DSPs) TMSC6727BZDH300TAN attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TMSC6727BZDH300TAN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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