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TMS32C6416EZLZ6E3

Texas Instruments

TMS32C6416EZLZ6E3 by Texas Instruments

TMS32C6416EZLZ6E3 by Texas Instruments is a 32-bit DSP with integrated cache, operating at a max clock frequency of 75.18 MHz. It features an external data bus width of 64 bits and is suitable for applications requiring high-speed signal processing such as audio and video processing in consumer electronics.

Median Price

$139.989

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 570 parts In-Stock

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$132.170

100+ parts

$129.540

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$126.890

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570

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$126.890

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Avnet

USA . 19 parts In-Stock

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$147.808

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$133.210

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Vyrian

USA . 7,892 parts In-Stock

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Digiode

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ACDS - Activité Composants Distribution Service

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Chip Stock

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Resion

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Distributors (Availability)

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AZTECH Wire

Italy . 344 parts In-Stock

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$19.249

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One Stop Electronics

USA . 887 parts In-Stock

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$27.000

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Parana Technologies

USA . 133 parts In-Stock

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$55.588

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DigiPath Technology Company

USA . 576 parts In-Stock

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Corohmni

South Africa . 2,928 parts In-Stock

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ChromeModa Solutions

Germany . 5,614 parts In-Stock

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$62.458

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$51.216

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IDEA Electronic Components Group

UK . 1,873 parts In-Stock

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$62.458

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$59.335

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$56.212

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Microchip USA

USA . 2,849 parts In-Stock

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$158.620

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$154.390

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$152.270

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$150.160

2,849

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$154.390

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$150.160

Corphita

USA . 1,283 parts In-Stock

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Authorized Procurement Solutions

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Component Stockers USA

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Overview

Unleash the power of cutting-edge technology with the TMS32C6416EZLZ6E3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Digital Signal Processors (DSPs) that excel in performance and reliability. Ideal for a wide range of applications, this product offers customers unparalleled value, benefits, and advantages. With integrated cache, multiple power supplies, and an extensive terminal finish, the TMS32C6416EZLZ6E3 is a game-changer in the world of digital processing. Upgrade your devices with the ultimate DSP solution from Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and protection for the internal components of the DSP, ensuring durability and reliability.

Integrated Cache: YES

Integrated cache helps improve processing speed by storing frequently accessed data, enhancing the overall performance of the DSP.

Maximum Supply Voltage: 1.44 V

Operating within a maximum supply voltage of 1.44 V ensures efficient power consumption and prevents damage to the DSP.

Address Bus Width: 32

With a wide address bus width of 32, the DSP can access a large memory space, enabling it to handle complex calculations and data efficiently.

Bit Size: 32

Having a bit size of 32 allows the DSP to process data in chunks of 32 bits, improving computational speed and accuracy.

Power Supplies (V): 1.4,3.3

Supporting multiple power supply voltages allows flexibility in system design and optimization for power efficiency.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of Tin/Silver/Copper as terminal finish provides good conductivity and corrosion resistance, ensuring stable connections in the system.

Maximum Clock Frequency: 75.18 MHz

A high maximum clock frequency of 75.18 MHz enables fast processing and response times, making the DSP suitable for real-time applications.

Technology: CMOS

Being CMOS technology-based helps in reducing power consumption and heat generation, making the DSP energy-efficient and suitable for portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6416EZLZ6E3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3VI/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.18 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

125 mA

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS32C6416EZLZ6E3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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