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TMS32C6415DGLZ7E3

Texas Instruments

TMS32C6415DGLZ7E3 by Texas Instruments

TMS32C6415DGLZ7E3 by Texas Instruments is a 32-bit DSP with 64-bit external data bus, clocked at 75.18 MHz. It features 16384 RAM words and operates on supply voltages of 1.36V to 1.44V. Ideal for digital signal processing applications requiring high-speed performance in a compact form factor.

Median Price

$95.108

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 622 parts In-Stock

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Rochester

USA . 601 parts In-Stock

1+ parts

-

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$84.540

1k+ parts

$75.640

10k+ parts

$71.190

601

-

$84.540

$75.640

$71.190

Verical

USA . 601 parts In-Stock

1+ parts

-

100+ parts

$105.675

1k+ parts

$94.550

10k+ parts

$88.987

601

-

$105.675

$94.550

$88.987

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,306 parts In-Stock

1+ parts

$89.234

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4,306

$89.234

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DigiKey Marketplace

USA . 622 parts In-Stock

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$97.690

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622

$97.690

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Vyrian

USA . 3,334 parts In-Stock

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3,334

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Distributors (Availability)

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Parana Technologies

USA . 1,093 parts In-Stock

1+ parts

$20.144

100+ parts

-

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$20.086

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1,093

$20.144

-

$20.086

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DigiPath Technology Company

USA . 806 parts In-Stock

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$22.181

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806

$22.181

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IDEA Electronic Components Group

UK . 2,216 parts In-Stock

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$22.634

100+ parts

$21.502

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$20.371

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2,216

$22.634

$21.502

$20.371

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ChromeModa Solutions

Germany . 1,553 parts In-Stock

1+ parts

$22.634

100+ parts

$18.560

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1,553

$22.634

$18.560

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Corohmni

South Africa . 164 parts In-Stock

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$63.661

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164

$63.661

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Ampacity Inc.

Singapore . 310 parts In-Stock

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$79.840

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310

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Corphita

USA . 1,898 parts In-Stock

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$84.537

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1,898

$84.537

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Microchip USA

USA . 449 parts In-Stock

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449

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Overview

Experience top-notch performance with the TMS32C6415DGLZ7E3 by Texas Instruments, a leading manufacturer in the field of Digital Signal Processors. This cutting-edge product is designed for a wide range of applications, providing unparalleled speed and efficiency. With its advanced technology and innovative features, this DSP offers customers exceptional value, benefits, and advantages. Upgrade your system with the TMS32C6415DGLZ7E3 and unlock new possibilities in digital processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, making it suitable for a wide range of applications.

Maximum Supply Voltage: 1.44 V

The high maximum supply voltage allows for increased flexibility in power supply options and compatibility with different systems.

Bit Size: 32

A larger bit size of 32 allows for higher precision and accuracy in processing digital signals, making the product suitable for demanding applications.

Power Supplies (V): 1.4, 3.3

The availability of multiple power supply options allows for efficient power management and flexibility in designing power circuits for the product.

RAM Words: 16384

With a large RAM capacity of 16384 words, the product can handle and process a significant amount of data efficiently.

Maximum Clock Frequency: 75.18 MHz

The high maximum clock frequency enables fast and efficient signal processing, making the product suitable for high-speed applications.

Technology: CMOS

The CMOS technology used in the product allows for low power consumption and high performance, making it an energy-efficient choice.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6415DGLZ7E3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3VI/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.18 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

532

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS32C6415DGLZ7E3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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