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TMS320VC5510AGGWA1

Texas Instruments

TMS320VC5510AGGWA1 by Texas Instruments

TMS320VC5510AGGWA1 by Texas Instruments is a 16-bit DSP with integrated cache, 32-bit external data bus width, and 50 MHz max clock frequency. Ideal for industrial applications requiring low power consumption and fixed-point format processing.

Median Price

$27.390

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4 parts In-Stock

1+ parts

-

100+ parts

$27.390

1k+ parts

$24.510

10k+ parts

$23.060

4

-

$27.390

$24.510

$23.060

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 501 parts In-Stock

1+ parts

$24.643

100+ parts

-

1k+ parts

-

10k+ parts

-

501

$24.643

-

-

-

Vyrian

USA . 7,343 parts In-Stock

1+ parts

-

100+ parts

-

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-

7,343

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 850 parts In-Stock

1+ parts

$15.074

100+ parts

$14.923

1k+ parts

$14.320

10k+ parts

-

850

$15.074

$14.923

$14.320

-

AZTECH Wire

Italy . 758 parts In-Stock

1+ parts

$20.560

100+ parts

-

1k+ parts

-

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758

$20.560

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-

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Corphita

USA . 4,273 parts In-Stock

1+ parts

$23.346

100+ parts

-

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4,273

$23.346

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-

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Parana Technologies

USA . 2,088 parts In-Stock

1+ parts

$24.689

100+ parts

-

1k+ parts

$25.356

10k+ parts

-

2,088

$24.689

-

$25.356

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IDEA Electronic Components Group

UK . 1,109 parts In-Stock

1+ parts

$27.741

100+ parts

$26.354

1k+ parts

$24.967

10k+ parts

-

1,109

$27.741

$26.354

$24.967

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ChromeModa Solutions

Germany . 821 parts In-Stock

1+ parts

$27.741

100+ parts

$22.748

1k+ parts

-

10k+ parts

-

821

$27.741

$22.748

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Corohmni

South Africa . 2,201 parts In-Stock

1+ parts

$40.056

100+ parts

-

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2,201

$40.056

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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10,000

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A-Z Elektronik GmbH

Germany . 6,000 parts In-Stock

1+ parts

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100+ parts

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6,000

-

-

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DigiPath Technology Company

USA . 1,378 parts In-Stock

1+ parts

-

100+ parts

$25.011

1k+ parts

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10k+ parts

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1,378

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$25.011

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Microchip USA

USA . 332 parts In-Stock

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332

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Overview

Unlock the power of digital signal processing with the TMS320VC5510AGGWA1 by Texas Instruments. Designed with quality and precision, this DSP offers unparalleled performance in a compact package. Whether you're working on audio processing, telecommunications, or industrial control applications, this versatile product delivers exceptional value with its integrated cache, low power mode, and multiple timers. Trust Texas Instruments for cutting-edge technology that empowers your innovation. Elevate your projects with the TMS320VC5510AGGWA1 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for a variety of applications while keeping it cost-effective.

Integrated Cache: YES

Having an integrated cache helps in improving the processor's speed and efficiency by storing frequently used data closer to the CPU.

Maximum Supply Voltage: 1.65 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the product energy-efficient.

Address Bus Width: 22

A wider address bus allows for accessing a larger memory space, enhancing the overall processing capabilities of the DSP.

Bit Size: 16

A 16-bit processor can handle data in 16-bit pieces, providing a good balance between speed and memory efficiency for various applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the DSP can function reliably even in harsh environmental conditions.

No. of DMA Channels: 6

Having multiple DMA channels allows for efficient data transfer without involving the CPU, resulting in improved performance and reduced latency.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5510AGGWA1 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B240

JESD-609 Code:

e0

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

6

No. of Terminals:

240

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA240,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.6,3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

15 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5510AGGWA1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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