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TMS320VC5510AGBC1

Texas Instruments

TMS320VC5510AGBC1 by Texas Instruments

TMS320VC5510AGBC1 by Texas Instruments is a 16-bit DSP with integrated cache, 32-bit external data bus width, and 50 MHz max clock frequency. Ideal for digital signal processing applications requiring low power mode and fixed-point format.

Median Price

$28.477

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,180 parts In-Stock

1+ parts

$23.424

100+ parts

$20.461

1k+ parts

$14.111

10k+ parts

-

1,180

$23.424

$20.461

$14.111

-

Mouser Electronics

USA . 125 parts In-Stock

1+ parts

$33.530

100+ parts

$24.920

1k+ parts

$23.150

10k+ parts

-

125

$33.530

$24.920

$23.150

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,536 parts In-Stock

1+ parts

$22.253

100+ parts

-

1k+ parts

-

10k+ parts

-

3,536

$22.253

-

-

-

Vyrian

USA . 7,301 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,301

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,121 parts In-Stock

1+ parts

$21.082

100+ parts

-

1k+ parts

-

10k+ parts

-

1,121

$21.082

-

-

-

Parana Technologies

USA . 980 parts In-Stock

1+ parts

$21.659

100+ parts

-

1k+ parts

$22.076

10k+ parts

-

980

$21.659

-

$22.076

-

DigiPath Technology Company

USA . 2,144 parts In-Stock

1+ parts

$23.849

100+ parts

-

1k+ parts

-

10k+ parts

-

2,144

$23.849

-

-

-

ChromeModa Solutions

Germany . 1,985 parts In-Stock

1+ parts

$24.336

100+ parts

$19.956

1k+ parts

-

10k+ parts

-

1,985

$24.336

$19.956

-

-

IDEA Electronic Components Group

UK . 325 parts In-Stock

1+ parts

$24.336

100+ parts

$23.119

1k+ parts

$21.902

10k+ parts

-

325

$24.336

$23.119

$21.902

-

Microchip USA

USA . 2,196 parts In-Stock

1+ parts

$49.830

100+ parts

$48.960

1k+ parts

$48.530

10k+ parts

$48.090

2,196

$49.830

$48.960

$48.530

$48.090

Corohmni

South Africa . 911 parts In-Stock

1+ parts

$75.771

100+ parts

-

1k+ parts

-

10k+ parts

-

911

$75.771

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 15,204 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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15,204

-

-

-

-

Overview

Unlock the power of digital signal processing with the TMS320VC5510AGBC1 by Texas Instruments. Designed for high performance and reliability, this DSP offers seamless integration and versatile applications in various industries. With Texas Instruments' reputation for quality and innovation, you can trust that this product delivers exceptional value and benefits to customers. Whether you're looking to enhance audio systems, improve image processing, or optimize communication networks, the TMS320VC5510AGBC1 is the perfect solution for your next project. Experience the advantages of cutting-edge technology with this top-of-the-line digital signal processor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Integrated Cache: YES

Improves processing speed and efficiency by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 1.65 V

Allows for higher power input without risking damage to the processor.

On Chip Data RAM Width: 16

Enables faster data processing and manipulation capabilities.

Address Bus Width: 22

Supports the handling of larger memory addresses, allowing for more complex data processing tasks.

Package Shape: SQUARE

Facilitates efficient and compact PCB design, saving space in electronic devices.

Bit Size: 16

Optimized for processing operations involving 16-bit data chunks.

No. of Terminals: 240

Provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enhances the overall performance and reliability of the DSP, making it suitable for demanding applications.

Minimum Supply Voltage: 1.55 V

Ensures stable operation even at lower power input levels.

Maximum Operating Temperature: 85 °C

Allows for operation in a wide range of environmental conditions without overheating.

No. of External Interrupts: 6

Supports multi-tasking and real-time processing by handling multiple external events simultaneously.

Minimum Operating Temperature: 0 °C

Capable of functioning in colder environments without performance degradation.

Terminal Finish: TIN LEAD

Provides a reliable and conductive surface for electrical connections.

Terminal Position: BOTTOM

Facilitates easy PCB layout and soldering during assembly.

RAM Words: 163840

Offers ample memory storage for data processing and storage requirements.

Width: 15 mm

Compact form factor suitable for integration into a wide range of electronic devices.

Boundary Scan: YES

Simplifies testing and debugging of the DSP for improved reliability.

External Data Bus Width: 32

Enables high-speed data transfer between the DSP and external components.

Maximum Clock Frequency: 50 MHz

Provides fast processing speeds for handling complex algorithms and real-time data processing.

Maximum Time At Peak Reflow Temperature (s): 20

Ensures proper soldering of the component during PCB assembly.

Peak Reflow Temperature °C: 220

High reflow temperature tolerance for robust soldering processes.

Internal Bus Architecture: MULTIPLE

Enhances data throughput and processing efficiency within the DSP.

Length: 15 mm

Compact size for versatile integration in various electronic applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile functionality for diverse signal processing and control applications.

No. of Timers: 2

Facilitates precise timing and scheduling for time-sensitive operations.

Technology: CMOS

Low power consumption and high noise immunity for efficient and reliable operation.

Terminal Form: BALL

Facilitates reliable connections and soldering during PCB assembly.

Nominal Supply Voltage: 1.6 V

Provides a stable operating voltage for optimal performance.

No. of DMA Channels: 6

Supports high-speed data transfer and processing capabilities.

ROM Programmability: MROM

Offers permanent and secure program storage for critical functions.

Terminal Pitch: 0.8 mm

Optimal spacing for reliable electrical connections and PCB layout.

Format: FIXED POINT

Ideal for precise and efficient mathematical computations in signal processing.

Moisture Sensitivity Level (MSL): 3

Suitable for handling moderate moisture exposure during storage and operation.

Low Power Mode: YES

Provides power-saving options for energy-efficient operation.

On Chip Program ROM Width: 16

Offers ample storage for program instructions, enabling efficient operation and execution.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5510AGBC1 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B240

JESD-609 Code:

e0

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

6

No. of Terminals:

240

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA240,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

RAM Words:

163840

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

15 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5510AGBC1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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