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TMS320VC5506ZAYR

Texas Instruments

TMS320VC5506ZAYR by Texas Instruments

TMS320VC5506ZAYR by Texas Instruments is a 16-bit DSP with 179 terminals, operating at max 20 MHz. Ideal for industrial applications, it features 65536 RAM words, boundary scan support, and low power mode for efficient processing.

Median Price

$10.890

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,464 parts In-Stock

1+ parts

$10.890

100+ parts

$9.512

1k+ parts

$6.560

10k+ parts

-

3,464

$10.890

$9.512

$6.560

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,104 parts In-Stock

1+ parts

$10.346

100+ parts

-

1k+ parts

-

10k+ parts

-

3,104

$10.346

-

-

-

Vyrian

USA . 5,786 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,786

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 774 parts In-Stock

1+ parts

$9.801

100+ parts

-

1k+ parts

-

10k+ parts

-

774

$9.801

-

-

-

AZTECH Wire

Italy . 79 parts In-Stock

1+ parts

$10.730

100+ parts

-

1k+ parts

-

10k+ parts

-

79

$10.730

-

-

-

Parana Technologies

USA . 1,413 parts In-Stock

1+ parts

$40.022

100+ parts

-

1k+ parts

-

10k+ parts

-

1,413

$40.022

-

-

-

DigiPath Technology Company

USA . 316 parts In-Stock

1+ parts

$44.069

100+ parts

$40.543

1k+ parts

-

10k+ parts

-

316

$44.069

$40.543

-

-

ChromeModa Solutions

Germany . 3,402 parts In-Stock

1+ parts

$44.968

100+ parts

$36.874

1k+ parts

-

10k+ parts

-

3,402

$44.968

$36.874

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-

IDEA Electronic Components Group

UK . 402 parts In-Stock

1+ parts

$44.968

100+ parts

$42.720

1k+ parts

$40.471

10k+ parts

-

402

$44.968

$42.720

$40.471

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Corohmni

South Africa . 507 parts In-Stock

1+ parts

$72.221

100+ parts

-

1k+ parts

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10k+ parts

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507

$72.221

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QUARKTWIN TECHNOLOGY LTD

USA . 22,495 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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22,495

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Overview

Unlock the power of digital signal processing with the TMS320VC5506ZAYR by Texas Instruments. Renowned for their high-quality products, Texas Instruments delivers cutting-edge technology with this digital signal processor, opening up a world of possibilities for applications in various industries. With its advanced features and reliable performance, this DSP offers unparalleled value, benefits, and advantages to customers looking to enhance their projects with top-notch processing capabilities. Experience the difference with Texas Instruments and take your designs to the next level with the TMS320VC5506ZAYR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to external factors, ensuring a longer lifespan for the product.

Surface Mount: YES

Enables easy and secure mounting on circuit boards, making installation and assembly more convenient.

Maximum Supply Voltage: 1.26 V

Allows for efficient power management while providing sufficient voltage for optimal performance.

On Chip Data RAM Width: 16

A wider data RAM width allows for faster data processing and smoother operation of the DSP.

Address Bus Width: 21

A wider address bus width allows for handling larger memory addresses and more efficient data retrieval.

Package Shape: SQUARE

Square shape packaging is space-efficient and facilitates easier placement within electronic devices.

Bit Size: 16

A 16-bit architecture enables higher precision computation and better overall performance.

No. of Terminals: 179

Having a higher number of terminals allows for more versatile connectivity options and integration with external components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high density mounting, low profile design, and fine pitch dimensions, making it suitable for compact applications.

Minimum Supply Voltage: 1.14 V

Even at the minimum supply voltage, the DSP can maintain stable performance, ensuring reliability in various operating conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the DSP can function effectively in demanding environments without overheating.

No. of External Interrupts: 5

Having multiple external interrupts allows the DSP to react quickly to external events, enhancing its responsiveness.

Minimum Operating Temperature: -40 °C

The DSP can operate efficiently even in extremely low temperatures, making it suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: BOTTOM

Bottom terminal position simplifies the soldering process during installation and promotes a neater circuit board layout.

Maximum Seated Height: 1.4 mm

The low maximum seated height contributes to the compact design of the DSP, suitable for space-constrained applications.

RAM Words: 65536

A large RAM capacity allows for efficient data storage and manipulation, enhancing the DSP's processing capabilities.

Width: 12 mm

With a moderate width, the DSP can be easily integrated into various electronic devices without occupying excessive space.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging of the DSP during the manufacturing process, ensuring quality control.

External Data Bus Width: 16

The wider external data bus width enables faster data transfer between the DSP and external devices, improving overall performance.

Maximum Clock Frequency: 20 MHz

A high maximum clock frequency allows the DSP to execute instructions quickly, enhancing processing speed and efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

With a sufficient time at peak reflow temperature, the soldering process can be completed effectively without compromising component integrity.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures secure solder joints and reliable connections for the DSP.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data communication within the DSP, improving efficiency and reducing bottlenecks.

Length: 12 mm

A moderate length allows for flexible placement options and compatibility with various device designs.

Temperature Grade: INDUSTRIAL

Designed for industrial environments, this temperature grade ensures the DSP's reliability and performance in harsh conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The versatile peripheral IC type enables the DSP to interface with different devices and systems, expanding its application capabilities.

No. of Timers: 2

Having multiple timers allows for efficient time management and scheduling tasks, contributing to the DSP's functionality.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the DSP's energy efficiency and reliability.

Terminal Form: BALL

Ball terminal form facilitates easy soldering and secure connections, ensuring the overall integrity of the DSP.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage provides a stable power source for the DSP, supporting consistent performance and operation.

No. of DMA Channels: 6

Multiple DMA channels enable efficient data transfer and processing, optimizing the DSP's performance in demanding applications.

ROM Programmability: MROM

Mask ROM (MROM) enables secure and permanent storage of essential firmware and programs, ensuring data integrity and reliability.

Terminal Pitch: 0.8 mm

A fine terminal pitch allows for precise connections and compact packaging, enhancing the DSP's overall design and functionality.

Format: FIXED POINT

Being a fixed-point format, the DSP can perform integer arithmetic efficiently, suitable for applications requiring accurate and fast calculations.

Moisture Sensitivity Level (MSL): 3

With MSL level 3, the DSP can withstand moderate exposure to moisture during storage and handling, maintaining its performance and reliability.

Low Power Mode: YES

The low power mode feature helps conserve energy and prolong battery life, making the DSP an energy-efficient choice for portable devices.

On Chip Program ROM Width: 8

An 8-bit width for on-chip program ROM enables efficient storage and execution of programs, contributing to the DSP's overall performance.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5506ZAYR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

21

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

5

No. of Terminals:

179

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

65536

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5506ZAYR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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