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TMS320VC5502ZZZ200

Texas Instruments

TMS320VC5502ZZZ200 by Texas Instruments

TMS320VC5502ZZZ200 by Texas Instruments is a 16-bit DSP with integrated cache, 32-bit external data bus width, and max clock frequency of 50 MHz. Ideal for industrial applications requiring low power consumption and fixed-point format processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

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Vyrian

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Digiode

USA . 2,602 parts In-Stock

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Bristol Electronics

USA . 464 parts In-Stock

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Dan-Mar Components

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Rebound Electronics

UK . 126 parts In-Stock

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Carlin Systems, Inc.

USA . 115 parts In-Stock

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Electronics Depot

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First Choice Components Inc.

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Lantek

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Goldney Electronics S.L.

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Microfarads

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AZTECH Wire

Italy . 506 parts In-Stock

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One Stop Electronics

USA . 1,288 parts In-Stock

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Corohmni

South Africa . 3,181 parts In-Stock

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Parana Technologies

USA . 1,439 parts In-Stock

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DigiPath Technology Company

USA . 1,126 parts In-Stock

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ChromeModa Solutions

Germany . 1,636 parts In-Stock

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IDEA Electronic Components Group

UK . 1,591 parts In-Stock

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Component Stockers USA

USA . 215 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,683 parts In-Stock

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Corphita

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Overview

Experience the power of Texas Instruments with the TMS320VC5502ZZZ200 Digital Signal Processor. Ideal for a variety of applications, this high-quality DSP offers integrated cache and low power mode for efficient performance. With Texas Instruments' reputation for excellence, you can trust in the reliability and innovation of this product. Unlock the value and benefits of the TMS320VC5502ZZZ200 for your next project and elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and long-lasting.

Integrated Cache: YES

Having an integrated cache helps in improving the overall performance and efficiency of the DSP.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power input.

Address Bus Width: 20

A wider address bus allows for greater memory addressability, enabling the DSP to handle larger data sets.

Bit Size: 16

A 16-bit architecture offers a good balance between performance and power efficiency.

Power Supplies (V): 1.2, 3.3

Support for multiple power supply voltages enables compatibility with a variety of systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the DSP can operate effectively in challenging environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing the overall efficiency of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5502ZZZ200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B201

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

4

No. of Terminals:

201

No. of Timers:

4

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA201,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

239 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5502ZZZ200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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