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TMS320VC549PGER-80

Texas Instruments

TMS320VC549PGER-80 by Texas Instruments

TMS320VC549PGER-80 by Texas Instruments is a 16-bit DSP with 23-bit address bus, operating at max 20 MHz clock frequency. Ideal for industrial applications, it features low power mode, barrel shifter, and 65536 RAM words for efficient signal processing tasks.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,446 parts In-Stock

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4,446

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Vyrian

USA . 4,022 parts In-Stock

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4,022

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Zilex Electronics Inc.

Canada . 1,500 parts In-Stock

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1,500

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ACDS - Activité Composants Distribution Service

France . 280 parts In-Stock

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280

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Distributors (Availability)

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AZTECH Wire

Italy . 403 parts In-Stock

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$5.365

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403

$5.365

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One Stop Electronics

USA . 1,072 parts In-Stock

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$8.000

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1,072

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Parana Technologies

USA . 777 parts In-Stock

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$59.973

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777

$59.973

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Corohmni

South Africa . 2,195 parts In-Stock

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$62.601

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$62.601

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DigiPath Technology Company

USA . 2,347 parts In-Stock

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$66.037

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$66.037

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ChromeModa Solutions

Germany . 5,481 parts In-Stock

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$67.385

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$55.256

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IDEA Electronic Components Group

UK . 709 parts In-Stock

1+ parts

$67.385

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$64.016

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$60.646

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709

$67.385

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$60.646

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Corphita

USA . 1,675 parts In-Stock

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Microchip USA

USA . 360 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the TMS320VC549PGER-80 by Texas Instruments. As a leading manufacturer in the field of Digital Signal Processors (DSPs), Texas Instruments ensures top-notch quality and reliability in every product. This versatile DSP offers unparalleled performance and efficiency, making it ideal for a wide range of applications. Experience seamless operation and exceptional results with the TMS320VC549PGER-80, delivering value and benefits that exceed expectations. Elevate your projects to the next level with this innovative solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort.

Maximum Supply Voltage: 2.75 V

Operates efficiently within a range of 2.4V to 2.75V, making it suitable for low power applications.

Address Bus Width: 23

A wider address bus allows for increased memory addressing capacity, enabling more complex processing tasks.

Package Shape: SQUARE

Square package shape provides an efficient use of space on a PCB layout, optimizing board real estate.

Bit Size: 16

16-bit processing capability enables high-performance computing and efficient data manipulation.

Power Supplies (V): 2.5,3.3

Supports multiple power supply options, offering flexibility in design and compatibility with different power sources.

No. of Terminals: 144

Ample number of terminals allow for versatile connectivity options and peripheral interfaces.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Various package styles provide options for different assembly requirements and space constraints in designs.

Minimum Supply Voltage: 2.4 V

Maintaining stable operation at a minimum supply voltage of 2.4V ensures reliability in low power scenarios.

Maximum Operating Temperature: 100 °C

Capable of operating at high temperatures up to 100°C, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Operates reliably in cold temperatures as low as -40°C, ensuring functionality in harsh conditions.

Terminal Position: QUAD

Quad terminal position provides efficient connectivity layout and ease of PCB design.

Maximum Seated Height: 1.6 mm

Low profile design with a maximum seated height of 1.6mm saves space and allows for compact device integration.

RAM Words: 65536

Large RAM capacity of 65536 words enables efficient storage and retrieval of data during processing tasks.

Width: 20 mm

Compact width of 20mm allows for space-efficient placement on a PCB and compact device design.

Boundary Scan: YES

Boundary scan capability facilitates testing, debugging, and verification of the device during production and maintenance.

External Data Bus Width: 16

16-bit external data bus width supports high-speed data transfer and processing capabilities.

Maximum Clock Frequency: 20 MHz

Operating at a maximum clock frequency of 20MHz enables fast and efficient processing of signals and data.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and processing efficiency within the device.

Length: 20 mm

Compact length of 20mm complements the width and seated height, providing a small footprint for space-constrained designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in demanding industrial environments with varying temperature ranges.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supports digital signal processing tasks along with other peripheral functions, offering versatile functionality.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology ensures low power consumption and high-speed performance.

Terminal Form: GULL WING

Gull-wing terminal form provides secure and reliable connection points during PCB assembly and operation.

Nominal Supply Voltage: 2.5 V

Nominal supply voltage of 2.5V indicates the standard operating voltage for efficient performance and power management.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables precise and compact layout of terminals for reliable connectivity.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and enhances computational efficiency in signal processing tasks.

Low Power Mode: YES

Low power mode feature allows for energy-efficient operation, extending battery life in portable devices.

Barrel Shifter: YES

Incorporation of barrel shifter enables efficient shifting operations in data manipulation tasks, enhancing processing speed.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC549PGER-80 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

YES

No. of Terminals:

144

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320VC549PGER-80 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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