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TMS320VC549GGU-100

Texas Instruments

TMS320VC549GGU-100 by Texas Instruments

TMS320VC549GGU-100 by Texas Instruments is a 16-bit DSP with 23-bit address bus, operating at max 20 MHz. Ideal for industrial applications, it features low power mode, barrel shifter, and 32K RAM words for efficient digital signal processing tasks.

Median Price

$55.192

Lifecycle Status

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12

In-Stock Inventory

1k+

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Avnet

USA . 960 parts In-Stock

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Rochester

USA . 885 parts In-Stock

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$49.060

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$43.890

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$41.310

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DigiKey

USA . 885 parts In-Stock

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Verical

USA . 222 parts In-Stock

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$61.325

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$54.862

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$51.638

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$51.638

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Flip Electronics

USA . 960 parts In-Stock

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Digiode

USA . 1,744 parts In-Stock

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Vyrian

USA . 5,617 parts In-Stock

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DigiKey Marketplace

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Bristol Electronics

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Resion

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Prism Electronics

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PC Components Company LLC

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Parana Technologies

USA . 598 parts In-Stock

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$48.932

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Corphita

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DigiPath Technology Company

USA . 1,234 parts In-Stock

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$53.880

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ChromeModa Solutions

Germany . 6,305 parts In-Stock

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IDEA Electronic Components Group

UK . 629 parts In-Stock

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$52.231

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$49.482

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Corohmni

South Africa . 2,858 parts In-Stock

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Kepictronics

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Microchip USA

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Overview

Experience superior signal processing performance with the TMS320VC549GGU-100 by Texas Instruments, a leader in digital signal processors (DSPs). This innovative product offers unparalleled value and benefits in various applications. With advanced technology and high-quality materials, this DSP delivers exceptional results with low power consumption and a wide operating temperature range. Trust Texas Instruments for cutting-edge solutions that enhance your projects' efficiency and performance. Elevate your designs with the TMS320VC549GGU-100 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on circuit boards, saving time and cost.

Maximum Supply Voltage: 2.75 V

The low maximum supply voltage helps in reducing power consumption and heat generation.

Address Bus Width: 23

Having a wide address bus width enables efficient memory addressing and processing capabilities.

Package Shape: SQUARE

Square package shape allows for efficient use of space on circuit boards and better heat dissipation.

Bit Size: 16

A 16-bit architecture provides a good balance between processing power and cost-effectiveness.

Power Supplies (V): 2.5/3.3

Compatibility with multiple power supply voltages allows for flexibility in different application scenarios.

No. of Terminals: 144

Having a high number of terminals allows for connectivity to various external components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high density mounting, low profile design, and fine pitch for compact and efficient board layout.

Minimum Supply Voltage: 2.4 V

The low minimum supply voltage ensures stable operation even under low power conditions.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliable performance in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures allows for use in extreme temperature environments.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good solderability and reliable electrical connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB layout and assembly.

Maximum Seated Height: 1.4 mm

Low seated height helps in maintaining a slim profile of the overall product design.

RAM Words: 32768

Having a large RAM capacity enables efficient data storage and processing capabilities.

Width: 12 mm

Compact width size allows for easy integration into various electronic devices and systems.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the product during production and maintenance.

External Data Bus Width: 16

Having a wide external data bus width allows for fast data transfer and processing speeds.

Maximum Clock Frequency: 20 MHz

High clock frequency enables fast processing speeds and efficient real-time signal processing.

Maximum Time At Peak Reflow Temperature (s): 20

This short reflow time helps in preventing damage to the product during assembly processes.

Peak Reflow Temperature °C: 220

High peak reflow temperature ensures a reliable soldering process and strong mechanical connections.

Internal Bus Architecture: MULTIPLE

Utilizing multiple internal bus architecture enhances data flow and processing efficiency within the product.

Length: 12 mm

Compact length size allows for space-saving integration and versatile placement in electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in demanding industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor, this product is specialized in efficient signal processing tasks for various applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of applications.

Terminal Form: BALL

Ball terminal form provides good electrical connections and ease of assembly on circuit boards.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage ensures consistent and stable operation under typical operating conditions.

Terminal Pitch: 0.8 mm

Having a tight terminal pitch allows for high-density mounting and efficient use of PCB space.

Format: FIXED POINT

Fixed-point format offers efficient arithmetic operations and precise calculations in signal processing tasks.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the product has moderate moisture sensitivity, ensuring reliable performance in normal operating conditions.

Low Power Mode: YES

Having a low power mode option helps in reducing power consumption and extending battery life in portable devices.

Barrel Shifter: YES

Inclusion of a barrel shifter allows for efficient shifting and rotating operations in data processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC549GGU-100 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e0

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

144

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,13X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

2.75 V

Minimum Supply Voltage:

2.4 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320VC549GGU-100 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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