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TMS320VC5470ZHKA

Texas Instruments

TMS320VC5470ZHKA by Texas Instruments

TMS320VC5470ZHKA by Texas Instruments is a 16-bit DSP with 32-bit external data bus, operating at 50 MHz. It features 8192 RAM words and low power mode, suitable for industrial applications requiring digital signal processing capabilities. The package style is grid array with a terminal pitch of 0.8 mm, making it ideal for compact designs in harsh environments.

Median Price

$17.100

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 360 parts In-Stock

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$17.100

100+ parts

$16.760

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$16.420

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360

$17.100

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$16.420

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Vyrian

USA . 8,901 parts In-Stock

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Digiode

USA . 705 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 261 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 345 parts In-Stock

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$7.000

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345

$7.000

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AZTECH Wire

Italy . 397 parts In-Stock

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$11.141

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397

$11.141

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Parana Technologies

USA . 775 parts In-Stock

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$52.652

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775

$52.652

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DigiPath Technology Company

USA . 2,010 parts In-Stock

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$57.976

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$53.338

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2,010

$57.976

$53.338

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ChromeModa Solutions

Germany . 6,990 parts In-Stock

1+ parts

$59.159

100+ parts

$48.510

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6,990

$59.159

$48.510

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IDEA Electronic Components Group

UK . 1,651 parts In-Stock

1+ parts

$59.159

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$56.201

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$53.243

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1,651

$59.159

$56.201

$53.243

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Corohmni

South Africa . 655 parts In-Stock

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$60.366

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655

$60.366

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QUARKTWIN TECHNOLOGY LTD

USA . 26,904 parts In-Stock

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Microchip USA

USA . 4,836 parts In-Stock

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Corphita

USA . 3,104 parts In-Stock

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Metaverse IC Inc.

Canada . 2,000 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 261 parts In-Stock

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Overview

Unlock a world of endless possibilities with the TMS320VC5470ZHKA by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers unparalleled quality and reliability in every product. The TMS320VC5470ZHKA offers customers the value of cutting-edge technology and unmatched performance in a wide range of applications. Experience the benefits of superior processing power, low power consumption, and high-speed data processing, all in a compact and versatile package. Elevate your projects to new heights with the TMS320VC5470ZHKA and discover the true potential of innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the DSP, making it suitable for various environments and handling.

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly onto circuit boards, reducing overall manufacturing costs.

Maximum Supply Voltage: 1.95 V

Operating within a low maximum supply voltage range ensures energy efficiency and prevents overheating, contributing to the longevity of the product.

Address Bus Width: 23

A wider address bus allows for larger memory addressability, enabling the DSP to handle more data efficiently.

Package Shape: SQUARE

The square package shape provides uniformity in design, simplifying placement on circuit boards and optimizing space utilization.

Bit Size: 16

A 16-bit architecture allows for high-speed processing and accuracy in signal manipulation, making this DSP suitable for complex digital signal processing tasks.

Power Supplies (V): 1.8,3.3

Support for multiple power supply voltages offers flexibility in system design and compatibility with various power sources.

No. of Terminals: 257

Having a high number of terminals enables connectivity to other components in the system, facilitating data transfer and integration.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style enhances the overall compactness of the DSP, making it ideal for space-constrained applications.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage requirement ensures efficient power consumption and reliable operation under varying voltage conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this DSP can perform reliably in demanding industrial environments without overheating.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the DSP to function effectively in both extreme cold and hot conditions, ensuring consistent performance.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides corrosion resistance and ensures secure connections, enhancing the overall reliability of the product.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies installation and maintenance of the DSP, streamlining the overall assembly process.

Maximum Seated Height: 1.4 mm

The low maximum seated height of the DSP reduces the overall profile of the component, making it suitable for compact electronic devices.

RAM Words: 8192

The large RAM capacity of 8192 words enables the DSP to store and process a significant amount of data, enhancing its performance in signal processing applications.

Width: 16 mm

The compact width of 16 mm allows for easy integration into densely populated circuit boards, maximizing space efficiency in electronic systems.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the DSP during manufacturing, ensuring high quality and reliability of the final product.

External Data Bus Width: 32

A wide external data bus width of 32 bits facilitates fast data transfer between the DSP and external devices, enhancing overall system performance.

Maximum Clock Frequency: 50 MHz

With a high maximum clock frequency of 50 MHz, this DSP can handle complex signal processing tasks quickly and efficiently, making it suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds prevents overheating and thermal damage during soldering, ensuring the longevity of the DSP.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature of 260°C, the DSP can withstand the soldering process without compromising its structural integrity and performance.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture allows for parallel processing of data within the DSP, enhancing its computational capabilities and efficiency.

Length: 16 mm

The compact length of 16 mm enables the DSP to fit seamlessly into various electronic designs, contributing to the overall flexibility and versatility of the product.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions, making this DSP suitable for rugged industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

Support for both digital signal processing and mixed-signal applications broadens the range of tasks that this DSP can perform, making it a versatile choice for diverse applications.

Technology: CMOS

CMOS technology offers low power consumption and high integration capabilities, making this DSP energy-efficient and suitable for battery-powered devices.

Terminal Form: BALL

The ball terminal form provides secure connections and simplifies the soldering process, ensuring reliable electrical contact in the DSP's operation.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8V ensures stable and efficient operation of the DSP, contributing to its overall reliability and performance.

Terminal Pitch: 0.8 mm

A fine terminal pitch of 0.8 mm allows for compact packaging and efficient routing of connections, enhancing the overall form factor of the DSP.

Format: FIXED POINT

Support for fixed-point format optimizes the DSP's computational efficiency in handling integer-based signal processing tasks, making it suitable for a wide range of applications.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates the level of protection required during storage and handling, ensuring the longevity and reliability of the DSP in humid environments.

Low Power Mode: YES

An integrated low power mode enhances energy efficiency and extends battery life in portable electronic devices, making this DSP an ideal choice for power-sensitive applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5470ZHKA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B257

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

257

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA257,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5470ZHKA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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