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TMS320VC5470GHKA

Texas Instruments

TMS320VC5470GHKA by Texas Instruments

TMS320VC5470GHKA by Texas Instruments is a 16-bit DSP with 32-bit external data bus, operating at max 50 MHz. Ideal for industrial applications, it features low power mode, 1.8-3.3V supplies, and -40 to 85°C temp range.

Median Price

$22.620

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 699 parts In-Stock

1+ parts

$22.620

100+ parts

$21.260

1k+ parts

$19.230

10k+ parts

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699

$22.620

$21.260

$19.230

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Distributors (In-Stock)

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Digiode

USA . 2,577 parts In-Stock

1+ parts

$21.489

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2,577

$21.489

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Vyrian

USA . 3,064 parts In-Stock

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3,064

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NexGen Digital

USA . 2,983 parts In-Stock

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2,983

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Distributors (Availability)

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AZTECH Wire

Italy . 65 parts In-Stock

1+ parts

$18.920

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65

$18.920

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Ampacity Inc.

Singapore . 514 parts In-Stock

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$19.230

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514

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Corphita

USA . 197 parts In-Stock

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$20.358

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197

$20.358

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Component Stockers USA

USA . 2,038 parts In-Stock

1+ parts

$22.380

100+ parts

$21.040

1k+ parts

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2,038

$22.380

$21.040

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Corohmni

South Africa . 2,982 parts In-Stock

1+ parts

$29.520

100+ parts

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2,982

$29.520

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Parana Technologies

USA . 1,223 parts In-Stock

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$50.658

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DigiPath Technology Company

USA . 2,200 parts In-Stock

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$55.781

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$55.781

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IDEA Electronic Components Group

UK . 1,543 parts In-Stock

1+ parts

$56.919

100+ parts

$54.073

1k+ parts

$51.227

10k+ parts

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1,543

$56.919

$54.073

$51.227

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ChromeModa Solutions

Germany . 1,167 parts In-Stock

1+ parts

$56.919

100+ parts

$46.674

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1,167

$56.919

$46.674

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Microchip USA

USA . 330 parts In-Stock

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Overview

Unlock unparalleled performance and efficiency with the TMS320VC5470GHKA by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers cutting-edge technology that revolutionizes industries such as telecommunications, multimedia, and consumer electronics. The TMS320VC5470GHKA offers customers unmatched value with its high-quality design and advanced features, providing seamless integration into any application. Experience the benefits of this powerful DSP and elevate your products to new heights of innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components as it provides good insulation and protection for the internal components, making the DSP more reliable and durable.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the DSP onto circuit boards, saving time and effort during the manufacturing process.

Maximum Supply Voltage: 1.95 V

The higher maximum supply voltage allows for flexibility in power input options, making it compatible with a wider range of systems and applications.

Address Bus Width: 23

A wider address bus allows for larger memory addressing capability, enabling the DSP to handle more complex algorithms and process larger amounts of data efficiently.

Package Shape: SQUARE

The square package shape is space-efficient and allows for easy placement onto circuit boards, optimizing the overall layout and design of the system.

Bit Size: 16

With a 16-bit architecture, the DSP can perform calculations with higher precision and accuracy, making it suitable for applications that require high performance and reliability.

Power Supplies (V): 1.8,3.3

Having multiple power supply options allows for greater flexibility in system design and compatibility with different voltage requirements, making the DSP versatile and adaptable to various environments.

No. of Terminals: 257

Having a higher number of terminals provides more connectivity options and enables the DSP to interface with a wide range of external devices and peripherals, enhancing its functionality and usability.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers compactness, reliability, and efficient heat dissipation, making the DSP suitable for space-constrained and high-performance applications.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures efficient power consumption and extends the battery life of portable devices utilizing the DSP, making it an energy-efficient choice.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature allows the DSP to reliably operate in harsh environmental conditions without compromising performance, ensuring consistent and stable operation in various applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the DSP can function in cold environments without performance degradation, making it suitable for a wide range of temperature conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides corrosion resistance and reliable solder joints, ensuring long-term durability and stability of the connections, making the DSP a reliable choice for long-term use.

Terminal Position: BOTTOM

The bottom terminal position simplifies the routing of connections on the circuit board and reduces the overall footprint of the DSP, optimizing space utilization and enhancing design flexibility.

Maximum Seated Height: 1.4 mm

The low maximum seated height contributes to a slim and compact design of the DSP, enabling it to be used in space-constrained applications and ensuring easy integration into various systems.

RAM Words: 16384

With a large RAM capacity, the DSP can efficiently process and store a significant amount of data, enabling it to handle complex algorithms and perform tasks requiring extensive memory usage.

Width: 16 mm

The compact width of the DSP facilitates easy integration into systems with limited space, allowing for efficient placement and layout optimization in electronic devices.

Boundary Scan: YES

The presence of boundary scan capability allows for enhanced testing and debugging of the DSP during the manufacturing process, ensuring high quality and reliability of the final product.

External Data Bus Width: 32

A wider external data bus width enables faster data transfer and communication between the DSP and external devices, improving overall system performance and responsiveness in data-intensive applications.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency allows the DSP to execute instructions at a rapid pace, enabling it to process tasks quickly and efficiently, making it suitable for real-time processing applications.

Maximum Time At Peak Reflow Temperature (s): 20

The short maximum time at peak reflow temperature reduces the risk of thermal damage to the DSP during assembly processes, ensuring the integrity and reliability of the component in manufacturing environments.

Peak Reflow Temperature °C: 220

The high peak reflow temperature tolerance allows the DSP to undergo soldering processes at elevated temperatures without degradation, ensuring secure and robust connections for long-term performance.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures enhances data processing efficiency and parallelism within the DSP, enabling faster and more scalable performance in multitasking and parallel computing applications.

Length: 16 mm

The compact length of the DSP contributes to a space-efficient design, allowing for flexible placement and layout options in electronic systems, optimizing space utilization and facilitating compact device designs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the DSP can withstand harsh operating conditions in industrial environments, providing reliable performance and durability in demanding applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

The combination of digital signal processing and mixed-signal capabilities in the peripheral IC type enhances the DSP's versatility and functionality, enabling it to perform a wide range of signal processing tasks and interface with various analog devices.

Technology: CMOS

Using CMOS technology offers low power consumption, high-speed operation, and reduced noise in the DSP, making it suitable for energy-efficient and high-performance applications requiring reliable digital signal processing capabilities.

Terminal Form: BALL

The ball terminal form ensures reliable connections and simplifies the soldering process during assembly, enhancing the durability and performance of the DSP in various electronic systems.

Nominal Supply Voltage: 1.8 V

The 1.8V nominal supply voltage provides a standard operating voltage for the DSP, ensuring compatibility with a wide range of power sources and simplifying system integration in different applications.

Terminal Pitch: 0.8 mm

The small terminal pitch allows for compact layout design and efficient space utilization on the circuit board, enabling high-density integration of the DSP in electronic devices with limited space availability.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and facilitates efficient processing of integer-based data in the DSP, making it suitable for applications where precise numerical calculations are required.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the DSP is less sensitive to moisture during storage and handling, reducing the risk of moisture-related damage and ensuring long-term reliability in various environmental conditions.

Low Power Mode: YES

The low power mode feature allows the DSP to operate in a power-efficient state when not performing intensive tasks, reducing energy consumption and extending battery life in portable devices powered by the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5470GHKA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B257

JESD-609 Code:

e0

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

257

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA257,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5470GHKA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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