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TMS320VC5421PGE200

Texas Instruments

TMS320VC5421PGE200 by Texas Instruments

TMS320VC5421PGE200 by Texas Instruments is a 32-bit DSP with 19-bit address bus, 16-bit external data bus, and 50 MHz clock frequency. Ideal for digital signal processing applications requiring low power mode, it features a max supply voltage of 1.98 V and operates b/w -40 to +85°C temperature range.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,515 parts In-Stock

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Digiode

USA . 1,994 parts In-Stock

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Prism Electronics

USA . 9 parts In-Stock

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AZTECH Wire

Italy . 449 parts In-Stock

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$5.976

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One Stop Electronics

USA . 909 parts In-Stock

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$10.000

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909

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Corohmni

South Africa . 73 parts In-Stock

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$23.746

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Parana Technologies

USA . 2,263 parts In-Stock

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$30.015

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$66.005

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DigiPath Technology Company

USA . 437 parts In-Stock

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$33.050

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$30.406

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ChromeModa Solutions

Germany . 6,037 parts In-Stock

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$33.725

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$27.654

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IDEA Electronic Components Group

UK . 1,436 parts In-Stock

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$33.725

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$32.039

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$30.352

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Kepictronics

USA . 8,000 parts In-Stock

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Corphita

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Microchip USA

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Overview

Experience unparalleled performance and efficiency with the TMS320VC5421PGE200 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality digital signal processors that excel in a wide range of applications. The TMS320VC5421PGE200 is designed to provide customers with exceptional value, benefits, and advantages, making it the ideal choice for your next project. Upgrade to the TMS320VC5421PGE200 and unlock a world of possibilities in digital signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the components inside the package, ensuring long-term reliability of the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, making the product suitable for mass production and streamlined manufacturing processes.

Maximum Supply Voltage: 1.98 V

With a maximum supply voltage of 1.98 V, this DSP offers efficient power consumption while still delivering high performance.

Address Bus Width: 19

The wide address bus width of 19 allows for efficient memory addressing and data processing capabilities, making the product suitable for complex algorithms and computations.

Bit Size: 32

The 32-bit architecture enables the DSP to handle large amounts of data and complex calculations with precision and speed, making it suitable for high-performance applications.

Power Supplies (V): 1.8,3.3

The availability of multiple power supply options (1.8 V and 3.3 V) allows for flexibility in designing and powering different parts of the system, making the product versatile and adaptable to various use cases.

No. of Terminals: 144

The high number of terminals (144) provides ample connectivity options for peripheral devices and external components, making the product suitable for diverse system integration requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures the DSP can withstand rigorous operating conditions without compromising performance, making it reliable in harsh environments.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enables efficient data transfer and communication between different components within the DSP, optimizing overall system performance and responsiveness.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The inclusion of various peripheral IC types enhances the versatility and functionality of the DSP, making it suitable for a wide range of applications and integration scenarios.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5421PGE200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

19

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.75 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5421PGE200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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