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TMS320VC5410AGWS12

Texas Instruments

TMS320VC5410AGWS12 by Texas Instruments

TMS320VC5410AGWS12 by Texas Instruments is a 16-bit DSP with 23-bit address bus, operating at max 20 MHz. Ideal for industrial applications, it features low power mode, barrel shifter, and on-chip data RAM of 65536 words.

Median Price

$30.774

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 735 parts In-Stock

1+ parts

$23.587

100+ parts

$20.603

1k+ parts

$14.209

10k+ parts

-

735

$23.587

$20.603

$14.209

-

Mouser Electronics

USA . 160 parts In-Stock

1+ parts

$37.960

100+ parts

$26.470

1k+ parts

$25.880

10k+ parts

-

160

$37.960

$26.470

$25.880

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,693 parts In-Stock

1+ parts

$22.408

100+ parts

-

1k+ parts

-

10k+ parts

-

2,693

$22.408

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-

-

Vyrian

USA . 5,188 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,188

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,214 parts In-Stock

1+ parts

$21.228

100+ parts

-

1k+ parts

-

10k+ parts

-

1,214

$21.228

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-

-

Parana Technologies

USA . 2,169 parts In-Stock

1+ parts

$31.154

100+ parts

-

1k+ parts

$73.568

10k+ parts

-

2,169

$31.154

-

$73.568

-

DigiPath Technology Company

USA . 130 parts In-Stock

1+ parts

$34.304

100+ parts

-

1k+ parts

-

10k+ parts

-

130

$34.304

-

-

-

ChromeModa Solutions

Germany . 6,030 parts In-Stock

1+ parts

$35.004

100+ parts

$28.703

1k+ parts

-

10k+ parts

-

6,030

$35.004

$28.703

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-

IDEA Electronic Components Group

UK . 2,146 parts In-Stock

1+ parts

$35.004

100+ parts

$33.254

1k+ parts

$31.504

10k+ parts

-

2,146

$35.004

$33.254

$31.504

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Corohmni

South Africa . 2,231 parts In-Stock

1+ parts

$84.449

100+ parts

-

1k+ parts

-

10k+ parts

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2,231

$84.449

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-

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Overview

Experience the power of Texas Instruments with the TMS320VC5410AGWS12 digital signal processor. Designed for high performance and reliability, this DSP offers exceptional value for a wide range of applications. Whether you're working on audio processing, telecommunications, or industrial automation, this versatile chip delivers superior processing capabilities with low power consumption. Trust in Texas Instruments to provide innovative solutions that meet your needs and exceed your expectations. Elevate your projects with the TMS320VC5410AGWS12 and unlock endless possibilities in the world of signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance of durability and cost-effectiveness, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and compact integration into various electronic devices.

Maximum Supply Voltage: 1.65 V

The higher maximum supply voltage allows for flexibility in power supply options.

On Chip Data RAM Width: 16

The 16-bit data RAM width enables efficient data processing and storage capabilities.

Address Bus Width: 23

The 23-bit address bus width enables access to a large memory address space for complex algorithms and applications.

Package Shape: SQUARE

The square package shape provides uniformity and ease of integration into electronic PCB designs.

Bit Size: 16

The 16-bit architecture allows for efficient processing of data and instructions.

No. of Terminals: 144

The high number of terminals allows for versatile connectivity options with other electronic components.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact design with high terminal density, suitable for space-constrained applications.

Minimum Supply Voltage: 1.42 V

The low minimum supply voltage helps in reducing power consumption and improving energy efficiency.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature range ensures reliable performance in diverse environmental conditions.

No. of External Interrupts: 4

The 4 external interrupts allow for immediate responses to external events, enhancing real-time processing capabilities.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range ensures functionality even in extreme cold environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish offers good solderability and reliability during assembly processes.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy PCB mounting and alignment.

Maximum Seated Height: 1.4 mm

The low maximum seated height allows for slim device designs and space-efficient layouts.

RAM Words: 65536

With a high number of RAM words, the product can store large amounts of data for processing complex algorithms.

Width: 12 mm

The compact width of 12 mm enables the product to be used in small form factor electronic devices.

Boundary Scan: YES

The boundary scan feature allows for efficient testing and debugging of the product during development and production.

External Data Bus Width: 16

The 16-bit external data bus width enables high-speed data transfer between the processor and external components.

Maximum Clock Frequency: 20 MHz

The high maximum clock frequency allows for fast data processing and real-time response in demanding applications.

Maximum Time At Peak Reflow Temperature (s): 20

With a short time at peak reflow temperature, the product can undergo soldering processes efficiently without overheating.

Peak Reflow Temperature °C: 220

The high peak reflow temperature ensures reliable solder joints and long-term durability during assembly.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data transfer efficiency and parallel processing capabilities.

Length: 12 mm

The compact length of 12 mm allows for flexible placement within electronic devices and PCB layouts.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions and industrial settings.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The digital signal processor with other peripheral IC types offers versatility in handling various signal processing tasks.

Technology: CMOS

The CMOS technology provides low power consumption and enables high-speed operation for efficient signal processing.

Terminal Form: BALL

The ball terminal form enhances electrical connectivity and reliability during assembly and operation.

Nominal Supply Voltage: 1.5 V

The 1.5 V nominal supply voltage provides a stable power source for consistent performance and energy efficiency.

No. of DMA Channels: 6

The 6 DMA channels allow for efficient data transfer and processing without CPU intervention, enhancing system performance.

ROM Programmability: MROM

The MROM programmability allows for secure and permanent storage of program instructions, ensuring data integrity and reliability.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8 mm enables high-density mounting and space-efficient PCB layouts.

Format: FIXED POINT

The fixed-point format provides accurate numerical representation and efficient arithmetic operations for signal processing applications.

Moisture Sensitivity Level (MSL): 3

The MSL level 3 indicates the product's resistance to moisture absorption, ensuring reliability in humid environments.

Low Power Mode: YES

The low power mode enables energy-saving operation and prolongs battery life in portable electronic devices.

Barrel Shifter: YES

The barrel shifter feature allows for efficient shift and rotate operations, enhancing data processing speed and flexibility.

On Chip Program ROM Width: 16

The 16-bit on-chip program ROM width provides ample space for storing program instructions, enabling complex algorithms and applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5410AGWS12 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e0

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

4

No. of Terminals:

144

No. of Timers:

1

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,13X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

RAM Words:

65536

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.42 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5410AGWS12 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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