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TMS320VC5409AZGU16

Texas Instruments

TMS320VC5409AZGU16 by Texas Instruments

TMS320VC5409AZGU16 by Texas Instruments is a 16-bit DSP with 23-bit address bus, 1.65V max supply voltage, and 20MHz clock frequency. Ideal for industrial applications requiring low power consumption and fixed-point format processing.

Median Price

$20.005

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 23 parts In-Stock

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-

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$20.005

10k+ parts

$19.645

23

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$20.005

$19.645

Distributors (In-Stock)

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Vyrian

USA . 5,623 parts In-Stock

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5,623

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Sensible Micro Corp

USA . 1,424 parts In-Stock

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Digiode

USA . 1,193 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 325 parts In-Stock

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$7.500

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$7.500

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One Stop Electronics

USA . 900 parts In-Stock

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$10.000

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900

$10.000

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Corohmni

South Africa . 1,996 parts In-Stock

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$38.861

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$38.861

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Parana Technologies

USA . 60 parts In-Stock

1+ parts

$64.200

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60

$64.200

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ChromeModa Solutions

Germany . 6,773 parts In-Stock

1+ parts

$72.135

100+ parts

$59.151

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6,773

$72.135

$59.151

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IDEA Electronic Components Group

UK . 1,802 parts In-Stock

1+ parts

$72.135

100+ parts

$68.528

1k+ parts

$64.922

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1,802

$72.135

$68.528

$64.922

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Corphita

USA . 3,686 parts In-Stock

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Perfect Parts

USA . 2,677 parts In-Stock

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2,677

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DigiPath Technology Company

USA . 1,167 parts In-Stock

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$65.037

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1,167

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Kepictronics

USA . 325 parts In-Stock

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325

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Microchip USA

USA . 244 parts In-Stock

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Overview

Experience superior performance and reliability with the Texas Instruments TMS320VC5409AZGU16 Digital Signal Processor. As a leader in the industry, Texas Instruments delivers cutting-edge technology that is trusted by professionals worldwide. This DSP is perfect for a wide range of applications, offering unmatched efficiency and precision. Unlock the full potential of your projects with this high-quality product that provides exceptional value and benefits to customers looking to elevate their work to the next level. Trust Texas Instruments for all your DSP needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and protection of internal components.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort.

Maximum Supply Voltage: 1.65 V

Efficient power usage and reduced risk of damage due to over-voltage.

On Chip Data RAM Width: 16

Wide data RAM width allows for fast processing and storage of data.

Address Bus Width: 23

Wide address bus width enables access to a large memory space for complex computations.

Bit Size: 16

Optimal bit size for digital signal processing applications, balancing performance and power efficiency.

Minimum Operating Temperature: -40 °C

Operates efficiently in cold temperatures, suitable for industrial environments.

Maximum Clock Frequency: 20 MHz

High clock frequency allows for fast processing of signals, enhancing overall performance.

ROM Programmability: MROM

Mask-programmable ROM provides secure and reliable storage of essential firmware.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5409AZGU16 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

4

No. of Terminals:

144

No. of Timers:

1

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144(UNSPEC)

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.6,3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5409AZGU16 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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