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TMS320VC5402AGWS16

Texas Instruments

TMS320VC5402AGWS16 by Texas Instruments

TMS320VC5402AGWS16 by Texas Instruments is a 16-bit DSP with 23-bit address bus width, 16384 RAM words, and max clock frequency of 20 MHz. Ideal for industrial applications requiring fixed-point format processing, it features low power mode and barrel shifter for efficient signal processing tasks.

Median Price

$20.330

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 141 parts In-Stock

1+ parts

$20.330

100+ parts

$15.130

1k+ parts

$14.980

10k+ parts

$13.030

141

$20.330

$15.130

$14.980

$13.030

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,897 parts In-Stock

1+ parts

$19.314

100+ parts

-

1k+ parts

-

10k+ parts

-

4,897

$19.314

-

-

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Vyrian

USA . 2,165 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,165

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,732 parts In-Stock

1+ parts

$18.297

100+ parts

-

1k+ parts

-

10k+ parts

-

3,732

$18.297

-

-

-

Parana Technologies

USA . 1,210 parts In-Stock

1+ parts

$28.706

100+ parts

-

1k+ parts

$50.799

10k+ parts

-

1,210

$28.706

-

$50.799

-

DigiPath Technology Company

USA . 931 parts In-Stock

1+ parts

$31.609

100+ parts

$29.080

1k+ parts

-

10k+ parts

-

931

$31.609

$29.080

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-

ChromeModa Solutions

Germany . 4,427 parts In-Stock

1+ parts

$32.254

100+ parts

$26.448

1k+ parts

-

10k+ parts

-

4,427

$32.254

$26.448

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IDEA Electronic Components Group

UK . 558 parts In-Stock

1+ parts

$32.254

100+ parts

$30.641

1k+ parts

$29.029

10k+ parts

-

558

$32.254

$30.641

$29.029

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Corohmni

South Africa . 1,145 parts In-Stock

1+ parts

$52.113

100+ parts

-

1k+ parts

-

10k+ parts

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1,145

$52.113

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Microchip USA

USA . 2,168 parts In-Stock

1+ parts

$143.470

100+ parts

$140.980

1k+ parts

$139.730

10k+ parts

$138.480

2,168

$143.470

$140.980

$139.730

$138.480

Authorized Procurement Solutions

USA . 1,500 parts In-Stock

1+ parts

-

100+ parts

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1,500

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Overview

Experience high-quality signal processing with the TMS320VC5402AGWS16 by Texas Instruments. This DSP offers unparalleled performance and reliability in a compact package, making it ideal for a wide range of applications. From audio processing to communications, this versatile device provides value and benefits that exceed expectations. Trust Texas Instruments for cutting-edge technology and unlock the potential of your projects with the TMS320VC5402AGWS16.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the internal components of the DSP, ensuring durability and reliability.

Maximum Supply Voltage: 1.65 V

Allows for a higher performance capability and flexibility in power supply options.

Address Bus Width: 23

Wide address bus allows for efficient handling of memory addressing, supporting complex digital signal processing tasks.

Bit Size: 16

Suitable for processing data in digital signals with moderate complexity, balancing speed and precision.

Maximum Operating Temperature: 100 °C

Allows for operation in a wide range of environmental conditions, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption, improved noise immunity, and higher speed operation, enhancing overall performance.

No. of DMA Channels: 6

Multiple DMA channels enable efficient data transfer between peripherals and memory, improving system responsiveness.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5402AGWS16 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PBGA-B144

JESD-609 Code:

e0

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

4

No. of Terminals:

144

No. of Timers:

2

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA144,13X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

RAM Words:

16384

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Maximum Supply Current:

.8 mA

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.55 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5402AGWS16 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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