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TMS320TCI100BCLZ6

Texas Instruments

TMS320TCI100BCLZ6 by Texas Instruments

TMS320TCI100BCLZ6 by Texas Instruments is a 32-bit DSP with 262144 RAM words, 64-bit external data bus width, and 75.19 MHz max clock frequency. Ideal for digital signal processing applications requiring low power mode, it operates b/w 0-90°C with a supply voltage range of 1.05-1.16 V.

Median Price

$11.260

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 147 parts In-Stock

1+ parts

-

100+ parts

$9.750

1k+ parts

$8.720

10k+ parts

$8.210

147

-

$9.750

$8.720

$8.210

DigiKey

USA . 147 parts In-Stock

1+ parts

-

100+ parts

$11.260

1k+ parts

-

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147

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$11.260

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Verical

USA . 147 parts In-Stock

1+ parts

-

100+ parts

$12.188

1k+ parts

$10.900

10k+ parts

$10.262

147

-

$12.188

$10.900

$10.262

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,802 parts In-Stock

1+ parts

$10.288

100+ parts

-

1k+ parts

-

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1,802

$10.288

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-

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Vyrian

USA . 4,597 parts In-Stock

1+ parts

-

100+ parts

-

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4,597

-

-

-

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DigiKey Marketplace

USA . 147 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

147

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 580 parts In-Stock

1+ parts

$9.660

100+ parts

-

1k+ parts

-

10k+ parts

-

580

$9.660

-

-

-

Corphita

USA . 1,008 parts In-Stock

1+ parts

$9.747

100+ parts

-

1k+ parts

-

10k+ parts

-

1,008

$9.747

-

-

-

Microchip USA

USA . 225 parts In-Stock

1+ parts

$31.530

100+ parts

$31.080

1k+ parts

$30.850

10k+ parts

$30.630

225

$31.530

$31.080

$30.850

$30.630

Parana Technologies

USA . 1,347 parts In-Stock

1+ parts

$55.411

100+ parts

-

1k+ parts

-

10k+ parts

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1,347

$55.411

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DigiPath Technology Company

USA . 1,530 parts In-Stock

1+ parts

$61.014

100+ parts

$56.133

1k+ parts

-

10k+ parts

-

1,530

$61.014

$56.133

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-

ChromeModa Solutions

Germany . 5,786 parts In-Stock

1+ parts

$62.259

100+ parts

$51.052

1k+ parts

-

10k+ parts

-

5,786

$62.259

$51.052

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-

IDEA Electronic Components Group

UK . 819 parts In-Stock

1+ parts

$62.259

100+ parts

$59.146

1k+ parts

$56.033

10k+ parts

-

819

$62.259

$59.146

$56.033

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Overview

Experience the power of cutting-edge technology with the TMS320TCI100BCLZ6 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality digital signal processors that are designed to elevate performance and efficiency. Perfect for a wide range of applications, this DSP offers unparalleled value with its advanced features and reliable operation. Whether you're looking to enhance your audio systems or streamline your communication devices, the TMS320TCI100BCLZ6 provides the benefits and advantages you need to stay ahead in today's competitive market. Elevate your projects with Texas Instruments and experience the difference quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides good physical protection for the internal components of the DSP, ensuring long-term durability.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation of the DSP on circuit boards, making it suitable for mass production and compact designs.

Maximum Supply Voltage: 1.16 V

The ability to handle a maximum supply voltage of 1.16 V allows for a wide range of power input options, offering flexibility in various applications.

Address Bus Width: 23

A 23-bit address bus width enables efficient memory addressing and data transfer, supporting complex signal processing tasks and high-speed operations.

Package Shape: SQUARE

The square package shape helps in easy integration with other components on the circuit board, optimizing space utilization and facilitating efficient PCB layout.

Bit Size: 32

With a 32-bit processing capability, the DSP can handle large amounts of data with precision and accuracy, making it suitable for advanced signal processing applications.

Power Supplies (V): 1.1,3.3

Support for multiple power supply voltages (1.1V and 3.3V) allows for compatibility with different power sources and enhances the overall versatility of the DSP.

No. of Terminals: 532

Having 532 terminals provides ample connectivity options for interfacing with other devices and components, enabling seamless integration into complex electronic systems.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style offers high-density mounting, improving signal integrity and thermal performance, ideal for high-speed data processing applications.

Minimum Supply Voltage: 1.05 V

With a minimum supply voltage of 1.05 V, the DSP can operate efficiently even at lower power levels, enhancing energy efficiency and reducing power consumption.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature of 90°C ensures reliable performance even in harsh environmental conditions, making the DSP suitable for various industrial applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows the DSP to function smoothly in colder environments, adding to its versatility in diverse operating conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper offers excellent conductivity and corrosion resistance, ensuring reliable connections and long-term performance of the DSP.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and mounting on the PCB, simplifying the assembly process and improving overall reliability of the electronic system.

Maximum Seated Height: 3.3 mm

The maximum seated height of 3.3 mm allows for a compact and low-profile design, enabling the DSP to be used in space-constrained applications without compromising performance.

RAM Words: 262144

With a large capacity of 262144 RAM words, the DSP can efficiently store and process data, supporting complex algorithms and calculations in real-time signal processing tasks.

Width: 23 mm

The width of 23 mm ensures a compact form factor for the DSP, facilitating easy integration into various electronic systems and devices with limited space availability.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the DSP during production and maintenance, ensuring high-quality performance and reliability of the final product.

External Data Bus Width: 64

A wide external data bus width of 64 bits allows for fast data transfer and processing, enhancing the overall performance and efficiency of the DSP in handling complex computations.

Maximum Clock Frequency: 75.19 MHz

With a high maximum clock frequency of 75.19 MHz, the DSP can process data at a rapid pace, making it suitable for applications that require real-time signal processing and analysis.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures proper soldering and bonding of the DSP to the PCB during assembly, contributing to the overall reliability of the electronic system.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient and reliable soldering of the DSP on the PCB, ensuring secure connections and long-term performance stability.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture facilitates parallel processing and efficient data flow within the DSP, enhancing performance and enabling complex signal processing tasks to be carried out seamlessly.

Length: 23 mm

The length of 23 mm contributes to the overall compact size of the DSP, making it suitable for applications where space is limited and optimizing the layout of the electronic system.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor and supporting other peripheral IC types, the DSP is capable of handling a wide range of signal processing tasks and interfacing with various external devices, making it a versatile solution for diverse applications.

Technology: CMOS

The CMOS technology used in the DSP ensures low power consumption, high noise immunity, and fast operation, making it energy-efficient and reliable for a wide range of digital signal processing applications.

Terminal Form: BALL

The terminal form of ball offers reliable solder connections and easy mounting on the PCB, enhancing the overall durability and performance of the DSP in various operating conditions.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage of 1.1 V provides stable and reliable power input to the DSP, ensuring consistent performance and efficient operation in various electronic systems.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8 mm, the DSP allows for precise and compact soldering connections on the PCB, facilitating efficient assembly and minimizing signal interference in high-speed data processing applications.

Format: FIXED POINT

The fixed-point format used in the DSP allows for efficient and precise numerical calculations, enhancing the accuracy and reliability of signal processing operations in various applications.

Moisture Sensitivity Level (MSL): 4

Having a moisture sensitivity level of 4 ensures that the DSP can withstand typical reflow soldering processes without the risk of moisture-related damage, guaranteeing reliable performance in manufacturing environments.

Low Power Mode: YES

The low power mode feature allows the DSP to operate in a power-efficient state when not processing intensive tasks, reducing power consumption and extending battery life in portable and energy-sensitive applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320TCI100BCLZ6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.19 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

532

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,3.3

Qualification:

Not Qualified

RAM Words:

262144

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.16 V

Minimum Supply Voltage:

1.05 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320TCI100BCLZ6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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