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TMS320LC541BPZ-66

Texas Instruments

TMS320LC541BPZ-66 by Texas Instruments

TMS320LC541BPZ-66 by Texas Instruments is a 16-bit DSP with 5120 RAM words, operating at max 20 MHz clock frequency. Ideal for digital signal processing applications, it features low power mode and barrel shifter for efficient performance in various electronic systems.

Median Price

$18.040

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 99 parts In-Stock

1+ parts

-

100+ parts

$15.610

1k+ parts

$13.970

10k+ parts

$13.140

99

-

$15.610

$13.970

$13.140

DigiKey

USA . 99 parts In-Stock

1+ parts

-

100+ parts

$18.040

1k+ parts

-

10k+ parts

-

99

-

$18.040

-

-

Verical

USA . 90 parts In-Stock

1+ parts

-

100+ parts

$19.512

1k+ parts

$17.462

10k+ parts

$16.425

90

-

$19.512

$17.462

$16.425

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,318 parts In-Stock

1+ parts

$16.482

100+ parts

-

1k+ parts

-

10k+ parts

-

3,318

$16.482

-

-

-

Vyrian

USA . 4,062 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,062

-

-

-

-

DigiKey Marketplace

USA . 99 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

99

-

-

-

-

Cyclops Electronics Ltd

UK . 3 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,869 parts In-Stock

1+ parts

$15.615

100+ parts

-

1k+ parts

-

10k+ parts

-

2,869

$15.615

-

-

-

Microchip USA

USA . 396 parts In-Stock

1+ parts

$46.620

100+ parts

$45.950

1k+ parts

$45.620

10k+ parts

$45.290

396

$46.620

$45.950

$45.620

$45.290

Corohmni

South Africa . 387 parts In-Stock

1+ parts

$52.986

100+ parts

-

1k+ parts

-

10k+ parts

-

387

$52.986

-

-

-

Parana Technologies

USA . 610 parts In-Stock

1+ parts

$73.236

100+ parts

-

1k+ parts

-

10k+ parts

-

610

$73.236

-

-

-

DigiPath Technology Company

USA . 569 parts In-Stock

1+ parts

$80.642

100+ parts

$74.191

1k+ parts

-

10k+ parts

-

569

$80.642

$74.191

-

-

ChromeModa Solutions

Germany . 5,542 parts In-Stock

1+ parts

$82.288

100+ parts

$67.476

1k+ parts

-

10k+ parts

-

5,542

$82.288

$67.476

-

-

IDEA Electronic Components Group

UK . 1,762 parts In-Stock

1+ parts

$82.288

100+ parts

$78.174

1k+ parts

$74.059

10k+ parts

-

1,762

$82.288

$78.174

$74.059

-

Overview

Unleash the power of cutting-edge technology with the TMS320LC541BPZ-66 by Texas Instruments. Crafted with precision and expertise, this Digital Signal Processor (DSP) offers unparalleled performance and reliability. Ideal for a wide range of applications, from audio processing to telecommunications, this product delivers exceptional value and benefits to customers. Experience seamless operation and enhanced efficiency with the TMS320LC541BPZ-66, setting new standards in digital signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and lightweight, making the product suitable for portable devices.

Surface Mount: YES

Surface mount technology allows for easier and quicker assembly, reducing production time and costs.

Maximum Supply Voltage: 3.6 V

Supports a high maximum supply voltage, providing flexibility in power input options.

Address Bus Width: 16

A wider address bus allows for efficient communication and processing of data between components.

Package Shape: SQUARE

Square shape helps in efficient packaging and layout design, maximizing use of space on a circuit board.

Bit Size: 16

16-bit processing capability enables the product to handle complex calculations and data manipulation tasks.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures reliable and consistent performance of the DSP.

No. of Terminals: 100

A higher number of terminals allow for more connectivity options, facilitating versatile integration into different systems.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack design with low profile and fine pitch terminals enhances thermal performance and signal integrity.

Minimum Supply Voltage: 3 V

Support for a low minimum supply voltage enables efficient power consumption and operation in battery-powered devices.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: QUAD

Quad terminal position allows for secure and stable connections, reducing the risk of signal interference or disconnection.

Maximum Seated Height: 1.6 mm

Low profile with a maximum seated height of 1.6mm enables space-saving installation in compact electronic devices.

RAM Words: 5120

Large RAM capacity of 5120 words facilitates efficient storage and processing of data during signal processing tasks.

Width: 14 mm

Compact width of 14mm allows for easy integration into various system designs with limited space.

Boundary Scan: YES

Boundary scan capability aids in testing, debugging, and diagnosing circuit board connections for improved product quality.

External Data Bus Width: 16

Wide external data bus width of 16 bits supports high-speed data transfer and processing capabilities.

Maximum Clock Frequency: 20 MHz

High maximum clock frequency of 20 MHz enables fast execution of instructions and efficient signal processing.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient reflow soldering process with a maximum time of 30 seconds at peak temperature, ensuring proper component attachment.

Peak Reflow Temperature °C: 260

Supports high peak reflow temperature of 260°C for reliable soldering and durability under extreme thermal conditions.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture improves data throughput and processing speed, enhancing overall performance.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type supports various digital signal processing tasks and functions, expanding application possibilities.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability, making the product energy-efficient and durable.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and easy soldering, ensuring secure connections for robust performance.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V ensures consistent and reliable operation of the DSP in various applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for compact layout design and high-density packaging on circuit boards.

Format: FIXED POINT

Fixed-point format simplifies arithmetic calculations and reduces computational complexity, enhancing processing efficiency.

Low Power Mode: YES

Low power mode option improves energy efficiency and extends battery life in portable devices, reducing power consumption.

Barrel Shifter: YES

Inclusion of a barrel shifter enables efficient data manipulation and shifting operations, enhancing processing capabilities.

Technical Specifications

Digital Signal Processors (DSPs) TMS320LC541BPZ-66 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

100

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

5120

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS320LC541BPZ-66 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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