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TMS320LBC57PBK80

Texas Instruments

TMS320LBC57PBK80 by Texas Instruments

TMS320LBC57PBK80 by Texas Instruments is a 16-bit DSP with 512 RAM words, operating at 80 MHz. Ideal for digital signal processing applications, it features low power mode and barrel shifter for efficient performance. With a max supply voltage of 3.47 V and temperature range of 0-70°C, it offers high-speed processing in a compact square package.

Median Price

$101.250

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 327 parts In-Stock

1+ parts

-

100+ parts

$90.000

1k+ parts

$80.530

10k+ parts

$75.790

327

-

$90.000

$80.530

$75.790

DigiKey

USA . 327 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

327

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-

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Verical

USA . 210 parts In-Stock

1+ parts

-

100+ parts

$112.500

1k+ parts

$100.662

10k+ parts

$94.737

210

-

$112.500

$100.662

$94.737

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DF Sales Co.

USA . 9 parts In-Stock

1+ parts

$63.000

100+ parts

-

1k+ parts

-

10k+ parts

-

9

$63.000

-

-

-

DF Sales Co.

USA . 9 parts In-Stock

1+ parts

$63.000

100+ parts

-

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-

10k+ parts

-

9

$63.000

-

-

-

Bristol Electronics

USA . 110 parts In-Stock

1+ parts

$90.000

100+ parts

$73.800

1k+ parts

-

10k+ parts

-

110

$90.000

$73.800

-

-

Digiode

USA . 1,090 parts In-Stock

1+ parts

$95.000

100+ parts

-

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-

10k+ parts

-

1,090

$95.000

-

-

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Vyrian

USA . 6,904 parts In-Stock

1+ parts

-

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6,904

-

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Microfarads

USA . 106 parts In-Stock

1+ parts

-

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106

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-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 5,242 parts In-Stock

1+ parts

$17.186

100+ parts

-

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-

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5,242

$17.186

-

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Parana Technologies

USA . 1,041 parts In-Stock

1+ parts

$58.697

100+ parts

-

1k+ parts

-

10k+ parts

-

1,041

$58.697

-

-

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ChromeModa Solutions

Germany . 5,102 parts In-Stock

1+ parts

$65.952

100+ parts

$54.081

1k+ parts

-

10k+ parts

-

5,102

$65.952

$54.081

-

-

IDEA Electronic Components Group

UK . 450 parts In-Stock

1+ parts

$65.952

100+ parts

$62.654

1k+ parts

$59.357

10k+ parts

-

450

$65.952

$62.654

$59.357

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Corphita

USA . 4,879 parts In-Stock

1+ parts

$90.000

100+ parts

-

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-

10k+ parts

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4,879

$90.000

-

-

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Component Stockers USA

USA . 599 parts In-Stock

1+ parts

$103.020

100+ parts

$96.830

1k+ parts

-

10k+ parts

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599

$103.020

$96.830

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-

Microchip USA

USA . 372 parts In-Stock

1+ parts

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372

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DigiPath Technology Company

USA . 49 parts In-Stock

1+ parts

-

100+ parts

$59.462

1k+ parts

-

10k+ parts

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49

-

$59.462

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-

Overview

Unlock the power of digital signal processing with the TMS320LBC57PBK80 by Texas Instruments. Designed with precision and quality, this DSP offers unmatched performance in a compact package. Ideal for a wide range of applications, from audio processing to telecommunications, this device delivers exceptional value and benefits to customers. Experience seamless operation and reliable results with the TMS320LBC57PBK80, setting a new standard in digital signal processing technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between cost-effectiveness and durability, making the product suitable for a wide range of applications.

Maximum Supply Voltage: 3.47 V

The high maximum supply voltage allows for flexibility in power input, accommodating various power sources.

Address Bus Width: 16

A wide address bus width enables efficient data processing and handling, improving overall performance.

Bit Size: 16

The 16-bit size allows for processing of larger chunks of data at a time, enhancing speed and efficiency.

Maximum Clock Frequency: 80 MHz

The high clock frequency enables fast data processing and operation, making the product suitable for demanding applications.

RAM Words: 512

With a large RAM capacity, the product can store and access a significant amount of data quickly, enhancing performance.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The inclusion of additional peripheral IC types expands the product's functionality and versatility.

Technology: CMOS

CMOS technology offers lower power consumption and higher noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Digital Signal Processors (DSPs) TMS320LBC57PBK80 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

6K WORDS DATA/PROG RAM

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

80 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G128

Length:

14 mm

Low Power Mode:

YES

No. of Terminals:

128

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.64SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

512

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

3.47 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS320LBC57PBK80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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