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TMS320F2808ZGMS

Texas Instruments

TMS320F2808ZGMS by Texas Instruments

TMS320F2808ZGMS by Texas Instruments is a 32-bit DSP with 100 terminals, operating at max 100 MHz. Ideal for automotive applications due to AEC-Q100 screening, it features 16-bit on-chip RAM and flash ROM programmability. With low power mode and multiple PWM channels, it offers high performance in a compact package.

Median Price

$16.870

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 294 parts In-Stock

1+ parts

$13.100

100+ parts

$12.840

1k+ parts

$12.580

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294

$13.100

$12.840

$12.580

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DigiKey

USA . 286 parts In-Stock

1+ parts

$20.640

100+ parts

-

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$14.760

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286

$20.640

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$14.760

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Distributors (In-Stock)

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Vyrian

USA . 2,976 parts In-Stock

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Digiode

USA . 1,152 parts In-Stock

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New Tech Sourcing

USA . 500 parts In-Stock

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Zilex Electronics Inc.

Canada . 10 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 246 parts In-Stock

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$11.943

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$11.943

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One Stop Electronics

USA . 1,124 parts In-Stock

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$18.000

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Ampacity Inc.

Singapore . 381 parts In-Stock

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$26.000

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Parana Technologies

USA . 912 parts In-Stock

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$35.957

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IDEA Electronic Components Group

UK . 988 parts In-Stock

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$40.401

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$38.381

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$36.361

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988

$40.401

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$36.361

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ChromeModa Solutions

Germany . 947 parts In-Stock

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$40.401

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$33.129

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Corohmni

South Africa . 615 parts In-Stock

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$66.317

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Lixinc

USA . 14,804 parts In-Stock

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Corphita

USA . 4,581 parts In-Stock

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DigiPath Technology Company

USA . 1,953 parts In-Stock

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$36.426

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Microchip USA

USA . 258 parts In-Stock

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Assy Fe

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Overview

Unleash the power of cutting-edge technology with the TMS320F2808ZGMS by Texas Instruments. This top-of-the-line Digital Signal Processor (DSP) offers unparalleled quality and reliability, making it the ideal choice for a wide range of applications. From automotive to industrial automation, this product provides high performance and efficiency, ensuring seamless operation in any environment. Experience the value and benefits of Texas Instruments' expertise in semiconductor manufacturing with the TMS320F2808ZGMS. Elevate your projects with this innovative solution that delivers unmatched advantages and superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability of the product, making it a suitable choice for long-term use.

Surface Mount: YES

The surface mount design simplifies the installation process and allows for compact assembly, making it ideal for space-constrained applications.

Maximum Supply Voltage: 1.89 V

The maximum supply voltage of 1.89 V ensures efficient power consumption, making the product energy-efficient.

On Chip Data RAM Width: 16

The 16-bit data RAM width allows for fast and efficient data processing, enhancing the overall performance of the product.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures that the product meets automotive industry standards for reliability and quality, making it a reliable choice for automotive applications.

Package Shape: SQUARE

The square package shape facilitates easy handling and installation, making it convenient for integration into various systems.

Bit Size: 32

The 32-bit architecture allows for high-speed processing and complex calculations, making the product suitable for demanding signal processing tasks.

Power Supplies (V): 1.8,3.3

Support for power supplies of 1.8V and 3.3V offers flexibility in power options, making the product versatile and compatible with a wide range of systems.

No. of Terminals: 100

The 100 terminals provide ample connectivity options, allowing for versatile integration and compatibility with various external devices.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style ensures space-saving design and efficient thermal performance, making it suitable for compact and high-performance applications.

Minimum Supply Voltage: 1.71 V

The minimum supply voltage of 1.71 V ensures reliable operation even under low power conditions, making the product suitable for energy-efficient applications.

Maximum Operating Temperature: 125 °C

The maximum operating temperature of 125°C allows the product to function reliably in high-temperature environments, making it suitable for industrial and automotive applications.

CPU Family: C28X

The C28X CPU family offers high performance and efficiency, making the product a reliable choice for demanding signal processing tasks.

No. of External Interrupts: 3

The 3 external interrupts allow for efficient handling of external events, enhancing the responsiveness and functionality of the product in real-time applications.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures reliable performance in harsh environmental conditions, making the product suitable for industrial and automotive applications.

Terminal Finish: TIN SILVER COPPER

The tin silver copper terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and durability of the product.

Terminal Position: BOTTOM

The bottom terminal position simplifies the installation process and enhances the overall functionality of the product in compact systems.

Maximum Seated Height: 1.4 mm

The low maximum seated height of 1.4 mm allows for slim and compact designs, making it suitable for space-constrained applications.

RAM Words: 18432

The large RAM capacity of 18432 words enables efficient data storage and processing, enhancing the performance and versatility of the product in signal processing tasks.

Width: 10 mm

The compact width of 10 mm allows for easy integration into various systems, making the product suitable for applications where space is limited.

Boundary Scan: YES

The boundary scan feature allows for efficient testing and debugging of the product, ensuring high reliability and easy maintenance.

Maximum Clock Frequency: 100 MHz

The maximum clock frequency of 100 MHz enables high-speed data processing and real-time signal processing, making the product suitable for demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures reliable soldering and assembly, making the product suitable for mass production and high-temperature processes.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures efficient soldering and assembly, making the product suitable for high-temperature manufacturing processes.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture allows for efficient data transfer and communication within the product, enhancing overall performance and speed.

Length: 10 mm

The compact length of 10 mm facilitates easy integration and installation, making the product suitable for space-constrained applications.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures reliable operation in extreme temperature conditions, making the product suitable for automotive applications where temperature variations are common.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The digital signal processor peripheral IC type enhances the product's signal processing capabilities, making it suitable for a wide range of digital signal processing tasks.

No. of Timers: 10

The 10 timers provide versatile timing and scheduling options, enhancing the product's functionality and performance in various time-sensitive applications.

RAM Bytes: 36864

The large RAM capacity of 36864 bytes allows for efficient data storage and processing, enhancing the overall performance and versatility of the product.

Technology: CMOS

The CMOS technology offers high speed and low power consumption, making the product energy-efficient and suitable for battery-powered applications.

Terminal Form: BALL

The ball terminal form provides reliable connectivity and soldering, ensuring long-term durability and performance of the product.

Maximum Supply Current: 230 mA

The maximum supply current of 230 mA ensures efficient power consumption and low heat dissipation, making the product suitable for energy-efficient applications.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V ensures stable and efficient power delivery, making the product reliable and suitable for a wide range of applications.

PWM Channels: YES

The presence of PWM channels allows for precise control of analog signals, making the product suitable for applications that require accurate signal modulation.

ROM Programmability: FLASH

The ROM programmability using flash memory allows for easy and quick updates to the program code, enhancing the flexibility and versatility of the product.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch allows for precise soldering and assembly, ensuring reliable connectivity and performance of the product.

Format: FIXED POINT

The fixed-point format offers efficient data processing and calculation, making the product suitable for applications that require high-speed processing and accuracy.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 ensures safe handling and storage of the product, making it suitable for environments with varying humidity levels.

Low Power Mode: YES

The availability of a low-power mode enhances energy efficiency and prolongs battery life, making the product suitable for portable and battery-powered applications.

On Chip Program ROM Width: 16

The 16-bit program ROM width allows for efficient storage and execution of program code, enhancing the overall performance and reliability of the product.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2808ZGMS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of Terminals:

100

No. of Timers:

10

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

36864

RAM Words:

18432

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320F2808ZGMS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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