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TMS320F2808GBAS

Texas Instruments

TMS320F2808GBAS by Texas Instruments

TMS320F2808GBAS by Texas Instruments is a 32-bit DSP with 100 terminals, operating at max 100 MHz. Ideal for automotive applications, it features 3 timers, PWM channels, and on-chip Flash ROM programmability. With low power mode and multiple internal bus architecture, it offers high performance in a compact package.

Median Price

$25.708

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 359 parts In-Stock

1+ parts

$19.575

100+ parts

$17.098

1k+ parts

$11.792

10k+ parts

-

359

$19.575

$17.098

$11.792

-

Mouser Electronics

USA . 184 parts In-Stock

1+ parts

$31.840

100+ parts

$22.680

1k+ parts

$21.690

10k+ parts

-

184

$31.840

$22.680

$21.690

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,330 parts In-Stock

1+ parts

$18.596

100+ parts

-

1k+ parts

-

10k+ parts

-

4,330

$18.596

-

-

-

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$20.510

100+ parts

-

1k+ parts

-

10k+ parts

-

650

$20.510

-

-

-

Vyrian

USA . 8,762 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,762

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 828 parts In-Stock

1+ parts

$8.954

100+ parts

-

1k+ parts

-

10k+ parts

-

828

$8.954

-

-

-

Ampacity Inc.

Singapore . 272 parts In-Stock

1+ parts

$16.640

100+ parts

-

1k+ parts

-

10k+ parts

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272

$16.640

-

-

-

Corphita

USA . 1,455 parts In-Stock

1+ parts

$17.618

100+ parts

-

1k+ parts

-

10k+ parts

-

1,455

$17.618

-

-

-

Continental Prestige Electronics

USA . 6,702 parts In-Stock

1+ parts

$20.510

100+ parts

-

1k+ parts

-

10k+ parts

$20.100

6,702

$20.510

-

-

$20.100

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$20.510

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

$20.510

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-

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Microchip USA

USA . 1,685 parts In-Stock

1+ parts

$50.690

100+ parts

$49.960

1k+ parts

$49.600

10k+ parts

$49.240

1,685

$50.690

$49.960

$49.600

$49.240

Parana Technologies

USA . 1,534 parts In-Stock

1+ parts

$56.829

100+ parts

-

1k+ parts

-

10k+ parts

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1,534

$56.829

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-

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ChromeModa Solutions

Germany . 971 parts In-Stock

1+ parts

$63.853

100+ parts

$52.359

1k+ parts

-

10k+ parts

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971

$63.853

$52.359

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IDEA Electronic Components Group

UK . 156 parts In-Stock

1+ parts

$63.853

100+ parts

$60.660

1k+ parts

$57.468

10k+ parts

-

156

$63.853

$60.660

$57.468

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Corohmni

South Africa . 653 parts In-Stock

1+ parts

$75.256

100+ parts

-

1k+ parts

-

10k+ parts

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653

$75.256

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Argo Parts USA

USA . 952 parts In-Stock

1+ parts

-

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952

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DigiPath Technology Company

USA . 240 parts In-Stock

1+ parts

-

100+ parts

$57.570

1k+ parts

-

10k+ parts

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240

-

$57.570

-

-

Overview

Experience the power of cutting-edge technology with the TMS320F2808GBAS from Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers high-quality products that are designed to meet the demands of various applications. The TMS320F2808GBAS offers customers unparalleled value and benefits, providing advanced features such as low power mode, PWM channels, and onboard ADC channels. With its innovative design and top-notch performance, this DSP is the perfect solution for automotive and other applications where precision and efficiency are crucial. Elevate your projects with the TMS320F2808GBAS and experience the difference that Texas Instruments can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, ensuring longevity and reliability.

Surface Mount: YES

Being surface mountable makes it easier to integrate into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.89 V

Allows for flexibility in power supply options while staying within a safe operating range.

On Chip Data RAM Width: 16

Having a wider data RAM width allows for efficient data processing and storage capabilities.

Package Shape: SQUARE

The square shape helps in efficient layout and placement on circuit boards, optimizing space usage.

Bit Size: 32

The 32-bit size enhances the processing power and capability of the DSP for handling complex algorithms and tasks.

No. of Terminals: 100

Having a large number of terminals provides versatility in connection options and peripherals that can be integrated.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers high density integration with a low profile, making it suitable for compact electronic devices.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures efficient power consumption and operation at lower power levels.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the DSP to perform reliably even in elevated temperature environments.

CPU Family: C28X

Part of the C28X CPU family which is known for its performance and reliability in digital signal processing applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2808GBAS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e0

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

0

No. of External Interrupts:

3

No. of Terminals:

100

No. of Timers:

3

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

RAM Bytes:

36864

RAM Words:

18432

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320F2808GBAS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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