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TMS320F2806ZGMA

Texas Instruments

TMS320F2806ZGMA by Texas Instruments

TMS320F2806ZGMA by Texas Instruments is a 32-bit DSP with 100MHz clock frequency, 10 timers, and 3 external interrupts. Ideal for industrial applications requiring low power consumption, it features flash ROM programmability, 20480 RAM bytes, and operates in an extended temperature range of -40 to 85°C.

Median Price

$9.380

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 22 parts In-Stock

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$9.380

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$9.190

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$9.000

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$9.000

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Distributors (In-Stock)

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Vyrian

USA . 8,970 parts In-Stock

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Digiode

USA . 4,980 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 35 parts In-Stock

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Holdelec - ElecDif-Pro

France . 35 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 35 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 570 parts In-Stock

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$6.403

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Ampacity Inc.

Singapore . 140 parts In-Stock

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$13.000

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One Stop Electronics

USA . 219 parts In-Stock

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$35.000

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Parana Technologies

USA . 590 parts In-Stock

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$53.118

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DigiPath Technology Company

USA . 1,512 parts In-Stock

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$58.489

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$53.810

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ChromeModa Solutions

Germany . 3,091 parts In-Stock

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$59.683

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$48.940

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$48.940

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IDEA Electronic Components Group

UK . 801 parts In-Stock

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$59.683

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$56.699

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$53.715

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$53.715

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Corohmni

South Africa . 4,898 parts In-Stock

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Corphita

USA . 1,676 parts In-Stock

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Perfect Parts

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Futuretech Components

Singapore . 348 parts In-Stock

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Microchip USA

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Overview

Unlock the power of cutting-edge technology with the TMS320F2806ZGMA DSP by Texas Instruments. Designed with precision and innovation, this digital signal processor offers unparalleled performance and reliability for a wide range of applications. From industrial automation to automotive systems, this product provides customers with the value and benefits they need to stay ahead in today's competitive market. Trust in Texas Instruments to deliver quality and excellence with the TMS320F2806ZGMA DSP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the DSP, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.89 V

Low maximum supply voltage helps in minimizing power consumption and heat dissipation.

On Chip Data RAM Width: 16

Wide data RAM width allows for efficient data processing and storage capabilities.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures high reliability and quality standards, making it suitable for automotive applications.

Bit Size: 32

32-bit processing capability enables fast and precise calculations, ideal for signal processing tasks.

Power Supplies (V): 1.8,3.3

Multiple power supply options provide flexibility in voltage selection for different applications.

No. of Terminals: 100

Ample terminals allow for connectivity with various external components, enhancing versatility.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Unique package style offers a compact design with high-density mounting capabilities, saving space on PCBs.

Minimum Supply Voltage: 1.71 V

Low minimum supply voltage ensures reliable operation even under low-power conditions.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for use in various environmental conditions.

CPU Family: C28X

C28X CPU family provides high performance and efficiency for processing digital signals quickly and accurately.

No. of External Interrupts: 3

Multiple external interrupt capabilities enable efficient handling of external events in real-time.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable operation even in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

Tin, silver, and copper terminal finish provides good conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position allows for easy access and soldering during assembly.

Maximum Seated Height: 1.4 mm

Low seated height enables compact design and integration in slim devices.

RAM Words: 10240

Large RAM capacity allows for storage and processing of a significant amount of data efficiently.

Width: 10 mm

Compact width makes it suitable for applications where space is limited.

Boundary Scan: YES

Boundary scan feature helps in testing and debugging the DSP during production, ensuring quality and reliability.

Maximum Clock Frequency: 100 MHz

High clock frequency enables fast data processing and response times, essential for real-time signal processing.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time at peak temperature ensures efficient soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature allows for reliable soldering joints for durability.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data transfer speeds and efficiency within the DSP.

Length: 10 mm

Compact length makes it suitable for applications with space constraints.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Dedicated peripheral IC type for digital signal processing tasks ensures efficient and optimized performance.

No. of Timers: 10

Multiple timer capabilities enable precise timing control in various applications.

RAM Bytes: 20480

Large RAM capacity in terms of bytes allows for extensive data storage and processing capabilities.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, ideal for DSP applications.

Terminal Form: BALL

Ball terminal form ensures reliable and secure connections on PCBs.

Maximum Supply Current: 230 mA

Low supply current consumption helps in conserving power and extending battery life in portable applications.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage ensures consistent and reliable operation of the DSP.

PWM Channels: YES

Pulse Width Modulation (PWM) channels enable precise control of analog signals, essential for various applications.

ROM Programmability: FLASH

Flash programmability of ROM allows for easy firmware updates and customization of the DSP.

Terminal Pitch: 0.8 mm

Narrow terminal pitch enables high-density mounting on PCBs, saving space and improving connectivity.

Format: FIXED POINT

Fixed-point format provides fast and efficient arithmetic operations for signal processing tasks.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates the level of protection against moisture, ensuring reliability in humid environments.

Low Power Mode: YES

Low power mode feature helps in reducing power consumption during idle or low-load periods, enhancing energy efficiency.

On Chip Program ROM Width: 16

Wide program ROM width allows for storage of program instructions for efficient execution by the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2806ZGMA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of Terminals:

100

No. of Timers:

10

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

20480

RAM Words:

10240

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320F2806ZGMA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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