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TMS320F2806PZQ

Texas Instruments

TMS320F2806PZQ by Texas Instruments

TMS320F2806PZQ by Texas Instruments is a 32-bit DSP with 100MHz clock frequency, 10 timers, and 3 external interrupts. Ideal for automotive applications due to AEC-Q100 screening level, low power mode, and flash ROM programmability. Package style: flatpack, low profile, fine pitch.

Median Price

$18.003

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 551 parts In-Stock

1+ parts

$18.003

100+ parts

$15.725

1k+ parts

$10.845

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551

$18.003

$15.725

$10.845

-

Distributors (In-Stock)

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Digiode

USA . 1,409 parts In-Stock

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$17.103

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1,409

$17.103

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Vyrian

USA . 8,781 parts In-Stock

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8,781

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Chip Stock

USA . 3,915 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 674 parts In-Stock

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674

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Greenchips

USA . 245 parts In-Stock

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SIE Connect GmbH - GreenChips

Germany . 245 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,478 parts In-Stock

1+ parts

$16.203

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2,478

$16.203

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AZTECH Wire

Italy . 207 parts In-Stock

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$16.930

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$16.930

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Parana Technologies

USA . 872 parts In-Stock

1+ parts

$17.231

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$17.446

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872

$17.231

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$17.446

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DigiPath Technology Company

USA . 165 parts In-Stock

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$18.974

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165

$18.974

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IDEA Electronic Components Group

UK . 1,781 parts In-Stock

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$19.361

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$18.393

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$17.425

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1,781

$19.361

$18.393

$17.425

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ChromeModa Solutions

Germany . 673 parts In-Stock

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$19.361

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$15.876

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673

$19.361

$15.876

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Microchip USA

USA . 1,206 parts In-Stock

1+ parts

$46.620

100+ parts

$45.950

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$45.620

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$45.290

1,206

$46.620

$45.950

$45.620

$45.290

Corohmni

South Africa . 37 parts In-Stock

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$54.490

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$54.490

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QUARKTWIN TECHNOLOGY LTD

USA . 15,809 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 674 parts In-Stock

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674

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Glotronic Ltd.

UK . 539 parts In-Stock

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Overview

Experience the cutting-edge performance of the TMS320F2806PZQ digital signal processor by Texas Instruments. With a reputation for top-quality products, Texas Instruments delivers unmatched reliability and innovation in the field of DSPs. Ideal for applications in automotive, industrial control, and power electronics, this processor offers customers unparalleled value with its high-speed processing capabilities and low power consumption. Stay ahead of the competition and elevate your projects with the superior features and benefits of the TMS320F2806PZQ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the DSP, making it suitable for various environmental conditions.

Surface Mount: YES

Easy installation on circuit boards, saving time and effort in assembly processes.

Maximum Supply Voltage: 1.89 V

Efficient power consumption and compatibility with a range of power sources.

On Chip Data RAM Width: 16

Enhanced data processing capabilities with a wider RAM width.

Screening Level: AEC-Q100

High reliability and quality standards, ideal for automotive applications where durability is essential.

Bit Size: 32

Higher precision and performance with a 32-bit architecture.

Power Supplies (V): 1.8, 3.3

Flexible power options for different applications, ensuring compatibility and efficiency.

No. of Terminals: 100

Sufficient connectivity options for interfacing with external devices and peripherals.

Minimum Supply Voltage: 1.71 V

Allows for operation at lower voltages, increasing energy efficiency.

Maximum Operating Temperature: 125 °C

Ability to withstand high temperatures, suitable for demanding operating environments.

CPU Family: C28X

Proven performance and optimization for digital signal processing tasks.

No. of External Interrupts: 3

Efficient handling of external events for interrupt-driven applications.

Minimum Operating Temperature: -40 °C

Operational reliability in extreme cold conditions, expanding the range of use.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Corrosion-resistant finish for longevity and stable electrical connections.

ADC Channels: YES

Analog-to-digital conversion capability for interfacing with analog sensors and inputs.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2806PZQ attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of External Interrupts:

3

No. of Terminals:

100

No. of Timers:

10

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

20480

RAM Words:

10240

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS320F2806PZQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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