Loading...

TMS320DM8167BCYG2

Texas Instruments

TMS320DM8167BCYG2 by Texas Instruments

TMS320DM8167BCYG2 by Texas Instruments is a 32-bit DSP with 16-bit external data bus width, operating at max clock frequency of 27 MHz. Ideal for digital signal processing applications due to its low power mode, floating point format, and multiple internal bus architecture.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,817 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,817

-

-

-

-

Vyrian

USA . 3,836 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,836

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 704 parts In-Stock

1+ parts

$14.664

100+ parts

-

1k+ parts

-

10k+ parts

-

704

$14.664

-

-

-

One Stop Electronics

USA . 199 parts In-Stock

1+ parts

$24.000

100+ parts

-

1k+ parts

-

10k+ parts

-

199

$24.000

-

-

-

Parana Technologies

USA . 950 parts In-Stock

1+ parts

$30.487

100+ parts

$2,831.176

1k+ parts

$27.438

10k+ parts

-

950

$30.487

$2,831.176

$27.438

-

DigiPath Technology Company

USA . 692 parts In-Stock

1+ parts

$33.570

100+ parts

-

1k+ parts

-

10k+ parts

-

692

$33.570

-

-

-

ChromeModa Solutions

Germany . 1,903 parts In-Stock

1+ parts

$34.255

100+ parts

$28.089

1k+ parts

-

10k+ parts

-

1,903

$34.255

$28.089

-

-

IDEA Electronic Components Group

UK . 1,853 parts In-Stock

1+ parts

$34.255

100+ parts

$32.542

1k+ parts

$30.830

10k+ parts

-

1,853

$34.255

$32.542

$30.830

-

Corohmni

South Africa . 2,696 parts In-Stock

1+ parts

$61.031

100+ parts

-

1k+ parts

-

10k+ parts

-

2,696

$61.031

-

-

-

Corphita

USA . 4,273 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,273

-

-

-

-

Microchip USA

USA . 197 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

197

-

-

-

-

Kepictronics

USA . 132 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

132

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the TMS320DM8167BCYG2 by Texas Instruments. As a leader in the industry, Texas Instruments delivers superior quality and unparalleled performance in their Digital Signal Processors (DSPs). This innovative product is perfect for a wide range of applications, offering customers value, benefits, and advantages that set it apart from the competition. Experience seamless operation and efficiency like never before with the TMS320DM8167BCYG2.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount technology allows for easy and efficient soldering of the DSP onto a circuit board.

Maximum Supply Voltage: 1.05 V

Operating within a low maximum supply voltage range makes the DSP energy efficient and suitable for portable devices.

Address Bus Width: 28

A wider address bus width allows for efficient memory addressing and data transfer within the DSP.

Package Shape: SQUARE

The square package shape allows for space-saving and easy integration into electronic devices.

Bit Size: 32

A 32-bit architecture provides high processing power and precision for complex signal processing tasks.

No. of Terminals: 1031

Having a large number of terminals enables versatile connectivity options for interfacing with other components.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array fine pitch package style enhances reliability and signal integrity in high-frequency applications.

Minimum Supply Voltage: 0.95 V

Operating at a low minimum supply voltage ensures compatibility with various power sources and energy efficiency.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: BOTTOM

Having terminals at the bottom allows for easier PCB layout and thermal management.

Maximum Seated Height: 3.31 mm

The low maximum seated height enables a compact and slim design for the overall product.

RAM Words: 16384

With a large RAM capacity, the DSP can efficiently store and process a significant amount of data.

Width: 25 mm

A compact width dimension allows for easy integration into tight spaces and PCB layouts.

Boundary Scan: YES

Boundary scan capability enables efficient testing and debugging of the DSP during production and maintenance.

External Data Bus Width: 16

The wide external data bus width facilitates high-speed data transfer between the DSP and external components.

Maximum Clock Frequency: 27 MHz

A high maximum clock frequency enables fast processing and response times for real-time signal processing applications.

Peak Reflow Temperature °C: 245

The high peak reflow temperature ensures reliable solder connections and product performance during manufacturing.

Internal Bus Architecture: MULTIPLE

A multiple internal bus architecture enhances data flow efficiency and processing speed within the DSP.

Length: 25 mm

A compact length dimension contributes to the overall small form factor and space-saving design of the product.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

The mixed peripheral IC type allows the DSP to interface with various analog and digital components for versatile signal processing capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient and reliable operation of the DSP.

Terminal Form: BALL

The ball terminal form provides reliable and robust connections for stable performance in challenging operating environments.

Nominal Supply Voltage: 1 V

Operating at a stable nominal supply voltage ensures consistent performance and reliability of the DSP.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density packaging and efficient PCB layout for space-constrained designs.

Format: FLOATING POINT

A floating-point format provides high precision and dynamic range for accurate signal processing and computation.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, the DSP is suitable for reflow soldering processes and moisture-resistant operation.

Low Power Mode: YES

The low power mode feature allows the DSP to conserve energy and extend battery life in power-sensitive applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM8167BCYG2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

28

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B1031

JESD-609 Code:

e1

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA1031,37X37,25

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.31 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

25 mm

Peripheral IC Type:

Trade Compliance

TMS320DM8167BCYG2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20