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TMS320DM6437ZWT6

Texas Instruments

TMS320DM6437ZWT6 by Texas Instruments

TMS320DM6437ZWT6 by Texas Instruments is a 32-bit DSP with integrated cache, 32-bit address bus width, and 27 MHz max clock frequency. Ideal for digital signal processing applications requiring low power mode, it features 1.8V nominal voltage and 72 DMA channels for efficient data transfer.

Median Price

$43.290

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 17,730 parts In-Stock

1+ parts

$36.327

100+ parts

$32.290

1k+ parts

$23.743

10k+ parts

-

17,730

$36.327

$32.290

$23.743

-

Mouser Electronics

USA . 20 parts In-Stock

1+ parts

$59.240

100+ parts

$43.550

1k+ parts

-

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20

$59.240

$43.550

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DigiKey

USA . 89 parts In-Stock

1+ parts

$59.340

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-

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89

$59.340

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Rochester

USA . 180 parts In-Stock

1+ parts

-

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$38.480

1k+ parts

$34.430

10k+ parts

$32.400

180

-

$38.480

$34.430

$32.400

Verical

USA . 180 parts In-Stock

1+ parts

-

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$48.100

1k+ parts

$43.038

10k+ parts

$40.500

180

-

$48.100

$43.038

$40.500

Avnet

USA . 105 parts In-Stock

1+ parts

-

100+ parts

$33.482

1k+ parts

$30.048

10k+ parts

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105

-

$33.482

$30.048

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 190 parts In-Stock

1+ parts

$31.331

100+ parts

-

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190

$31.331

-

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Vyrian

USA . 3,502 parts In-Stock

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3,502

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Chip Stock

USA . 299 parts In-Stock

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299

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EZ Electronic Parts

Israel . 50 parts In-Stock

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50

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Elcom Components

USA . 36 parts In-Stock

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36

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LIBRA Elektronik GmbH

Germany . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,356 parts In-Stock

1+ parts

$29.682

100+ parts

-

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4,356

$29.682

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Corohmni

South Africa . 4,885 parts In-Stock

1+ parts

$36.211

100+ parts

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4,885

$36.211

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Parana Technologies

USA . 2,230 parts In-Stock

1+ parts

$48.179

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$48.179

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DigiPath Technology Company

USA . 131 parts In-Stock

1+ parts

$53.051

100+ parts

$48.807

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131

$53.051

$48.807

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ChromeModa Solutions

Germany . 3,455 parts In-Stock

1+ parts

$54.134

100+ parts

$44.390

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3,455

$54.134

$44.390

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IDEA Electronic Components Group

UK . 492 parts In-Stock

1+ parts

$54.134

100+ parts

$51.427

1k+ parts

$48.721

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-

492

$54.134

$51.427

$48.721

-

Microchip USA

USA . 464 parts In-Stock

1+ parts

$93.170

100+ parts

$91.550

1k+ parts

$90.740

10k+ parts

$89.930

464

$93.170

$91.550

$90.740

$89.930

GreenTree Electronics

Israel . 19,350 parts In-Stock

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19,350

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Lixinc

USA . 8,942 parts In-Stock

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8,942

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A-Z Elektronik GmbH

Germany . 4,665 parts In-Stock

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4,665

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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S.R.D Solutions

India . 3,000 parts In-Stock

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3,000

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Epart123

USA . 1,350 parts In-Stock

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$75.000

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$75.000

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Perfect Parts

USA . 566 parts In-Stock

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Kepictronics

USA . 50 parts In-Stock

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Overview

Experience the power of Texas Instruments with the TMS320DM6437ZWT6 Digital Signal Processor. This cutting-edge device offers unmatched performance and reliability in a compact package, making it ideal for a wide range of applications. With integrated cache and multiple power supplies, this DSP delivers exceptional speed and efficiency. Whether you're working on audio processing, image recognition, or telecommunications, the TMS320DM6437ZWT6 has you covered. Trust Texas Instruments to provide superior quality and innovation in every product they create. Elevate your projects with the TMS320DM6437ZWT6 and discover the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and reliability for the product, making it suitable for various environmental conditions.

Integrated Cache: YES

Integrated cache improves the processing speed and efficiency of the product by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 1.89 V

Higher maximum supply voltage ensures stable operation and compatibility with various power sources.

On Chip Data RAM Width: 8

Wider on-chip data RAM width allows for better data manipulation and storage capabilities, enhancing overall performance.

Address Bus Width: 32

Wide address bus width enables efficient memory addressing, data transfer, and processing capabilities in the product.

Package Shape: SQUARE

Square package shape provides a compact and space-efficient design for the product, making it suitable for smaller electronic devices.

Bit Size: 32

32-bit architecture enables faster and more powerful processing capabilities, suitable for handling complex algorithms and calculations.

Power Supplies (V): 1.2, 1.8, 3.3

Support for multiple power supply voltages enhances versatility and compatibility with different power sources and electronic systems.

No. of Terminals: 361

High number of terminals allows for various connectivity options and interfaces, enhancing the product's integration capabilities.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array, low profile, and fine pitch package styles offer flexibility in mounting options and space-saving design features for the product.

Minimum Supply Voltage: 1.71 V

Lower minimum supply voltage ensures energy efficiency and power savings, making the product suitable for low-power applications.

Maximum Operating Temperature: 90 °C

High maximum operating temperature tolerance ensures reliable performance in demanding environmental conditions and temperature fluctuations.

Minimum Operating Temperature: 0 °C

Wide operating temperature range allows for reliable operation in various temperature environments, enhancing product reliability and durability.

Terminal Finish: TIN SILVER COPPER

Tin silver copper terminal finish provides good conductivity and corrosion resistance for stable and reliable connections in the product.

Terminal Position: BOTTOM

Bottom terminal position allows for easier and more convenient PCB mounting and soldering, simplifying the assembly process for the product.

Maximum Seated Height: 1.4 mm

Low maximum seated height enables a more compact and space-efficient design for the product, making it suitable for smaller electronic devices.

RAM Words: 81920

Large RAM capacity of 81920 words provides ample memory storage for data processing and manipulation, enhancing the product's computational capabilities.

Width: 16 mm

Compact width of 16mm allows for easy integration and installation of the product in various electronic systems and devices.

Boundary Scan: YES

Boundary scan feature allows for efficient testing and debugging of the product during development and production, ensuring product quality and reliability.

External Data Bus Width: 32

Wide external data bus width of 32 bits enables fast data transfer and processing, enhancing the product's overall performance and efficiency.

Maximum Clock Frequency: 27 MHz

High maximum clock frequency of 27 MHz provides fast processing speed and performance for real-time data processing and signal handling tasks.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature allows for reliable soldering and component mounting processes during product assembly, ensuring product quality.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance of 260°C ensures stable and robust soldering connections for the product, preventing damage and performance issues.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data communication and transfer speeds within the product, improving overall processing efficiency and performance.

Length: 16 mm

Compact length of 16mm allows for easy integration and installation of the product in various electronic systems and devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Digital signal processor and other peripheral IC types offer a wide range of functionality and capabilities for the product, making it versatile for different applications.

No. of Timers: 5

Multiple timers provide timing and synchronization functions for the product, enabling precise control and coordination of various operations and tasks.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the product energy-efficient and reliable for various applications.

Terminal Form: BALL

Ball terminal form allows for efficient soldering and connection with PCBs, ensuring reliable electrical connections and stable performance for the product.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage of 1.8V ensures consistent and reliable power delivery to the product, supporting its optimal performance and functionality.

No. of DMA Channels: 72

High number of DMA channels enables fast and efficient data transfers and processing, enhancing the product's performance in handling complex tasks and algorithms.

ROM Programmability: MROM

MROM programmability allows for non-volatile memory storage and easy reprogramming of the product, offering flexibility and customization options for different applications.

Terminal Pitch: 0.8 mm

Narrow terminal pitch of 0.8mm provides high-density mounting and space-saving design features for the product, suitable for compact electronic devices.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and enhances computational efficiency in the product, making it suitable for real-time signal processing tasks.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture exposure, requiring proper handling and storage to maintain product reliability and performance.

Low Power Mode: YES

Low power mode feature allows for energy-efficient operation and power savings, extending the product's battery life and reducing power consumption in standby mode.

On Chip Program ROM Width: 8

Wider on-chip program ROM width of 8 bits enables efficient storage and retrieval of program instructions, enhancing the product's processing speed and functionality.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM6437ZWT6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

361

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

81920

ROM Programmability:

MROM

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6437ZWT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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