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TMS320DM641AGDK5

Texas Instruments

TMS320DM641AGDK5 by Texas Instruments

TMS320DM641AGDK5 by Texas Instruments is a 32-bit DSP with 23-bit address bus width, 32-bit external data bus width, and max clock frequency of 75 MHz. It is used in digital signal processing applications requiring high computational power and low power consumption.

Median Price

$38.532

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 441 parts In-Stock

1+ parts

-

100+ parts

$34.250

1k+ parts

$30.640

10k+ parts

$28.840

441

-

$34.250

$30.640

$28.840

DigiKey

USA . 441 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

441

-

-

-

-

Verical

USA . 274 parts In-Stock

1+ parts

-

100+ parts

$42.813

1k+ parts

$38.300

10k+ parts

$36.050

274

-

$42.813

$38.300

$36.050

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,553 parts In-Stock

1+ parts

$36.157

100+ parts

-

1k+ parts

-

10k+ parts

-

4,553

$36.157

-

-

-

DigiKey Marketplace

USA . 441 parts In-Stock

1+ parts

$39.580

100+ parts

-

1k+ parts

-

10k+ parts

-

441

$39.580

-

-

-

Vyrian

USA . 3,106 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,106

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 169 parts In-Stock

1+ parts

$32.350

100+ parts

-

1k+ parts

-

10k+ parts

-

169

$32.350

-

-

-

Parana Technologies

USA . 686 parts In-Stock

1+ parts

$34.209

100+ parts

$3,176.818

1k+ parts

$30.788

10k+ parts

-

686

$34.209

$3,176.818

$30.788

-

Corphita

USA . 1,354 parts In-Stock

1+ parts

$34.254

100+ parts

-

1k+ parts

-

10k+ parts

-

1,354

$34.254

-

-

-

DigiPath Technology Company

USA . 101 parts In-Stock

1+ parts

$37.668

100+ parts

-

1k+ parts

-

10k+ parts

-

101

$37.668

-

-

-

ChromeModa Solutions

Germany . 6,241 parts In-Stock

1+ parts

$38.437

100+ parts

$31.518

1k+ parts

-

10k+ parts

-

6,241

$38.437

$31.518

-

-

IDEA Electronic Components Group

UK . 1,256 parts In-Stock

1+ parts

$38.437

100+ parts

$36.515

1k+ parts

$34.593

10k+ parts

-

1,256

$38.437

$36.515

$34.593

-

Corohmni

South Africa . 645 parts In-Stock

1+ parts

$82.544

100+ parts

-

1k+ parts

-

10k+ parts

-

645

$82.544

-

-

-

Microchip USA

USA . 2,468 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,468

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the TMS320DM641AGDK5 by Texas Instruments, a top-of-the-line Digital Signal Processor that delivers unmatched performance and reliability. Manufactured by industry leader Texas Instruments, this DSP is perfect for a wide range of applications, from telecommunications to audio processing. With a sleek package body material and advanced features like boundary scan and low power mode, this product offers exceptional value and benefits to customers looking for high-quality solutions. Upgrade your projects with the TMS320DM641AGDK5 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP.

Surface Mount: YES

Allows for easy and efficient installation on PCBs.

Maximum Supply Voltage: 1.26 V

Ensures safe operation within specified voltage limits.

Address Bus Width: 23

Provides sufficient address lines for data access and memory management.

Bit Size: 32

Enables processing of data in chunks of 32 bits for efficiency.

Power Supplies (V): 1.4, 3.3

Compatible with multiple power supply options for flexibility in system design.

No. of Terminals: 548

Offers a high number of terminals for connecting to various external components.

Package Style (Meter): GRID ARRAY, FINE PITCH

Facilitates compact design and efficient signal routing on PCBs.

Minimum Supply Voltage: 1.14 V

Sets a lower limit for safe operation, ensuring stability and reliability.

Terminal Finish: TIN LEAD

Provides good conductivity and solderability for reliable connections.

Terminal Position: BOTTOM

Allows for easy PCB mounting and efficient heat dissipation.

Maximum Seated Height: 2.8 mm

Enables installation in slim devices without occupying much space.

RAM Words: 16384

Offers a large memory capacity for data storage and processing.

Width: 23 mm

Compact size for easy integration into various electronic devices.

Boundary Scan: YES

Facilitates testing and debugging of the DSP during manufacturing.

External Data Bus Width: 32

Efficient data transfer between the DSP and external components.

Maximum Clock Frequency: 75 MHz

High clock frequency for fast data processing and system responsiveness.

Maximum Time At Peak Reflow Temperature (s): 20

Ensures proper soldering during manufacturing process.

Peak Reflow Temperature °C: 220

Specifies optimal temperature for soldering the DSP onto PCBs.

Internal Bus Architecture: MULTIPLE

Enhanced data pathways for efficient data flow within the DSP.

Length: 23 mm

Compact size for space-saving integration in electronic devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile functionality for a wide range of signal processing applications.

Technology: CMOS

Ensures low power consumption and high-speed operation.

Terminal Form: BALL

SMT technology for reliable and compact soldering connections.

Nominal Supply Voltage: 1.2 V

Standard voltage level for efficient and stable operation.

Terminal Pitch: 0.8 mm

Fine pitch for high-density and space-saving PCB designs.

Format: FIXED POINT

Specific data format for accurate and efficient signal processing.

Moisture Sensitivity Level (MSL): 4

Indicates the level of protection needed during storage and handling.

Low Power Mode: YES

Enables energy-efficient operation for extended battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM641AGDK5 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

548

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA548,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM641AGDK5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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