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TMS320DM640ZDK400

Texas Instruments

TMS320DM640ZDK400 by Texas Instruments

TMS320DM640ZDK400 by Texas Instruments is a 32-bit DSP with 20-bit address bus, 32-bit external data bus, and 75 MHz clock frequency. It is used in digital signal processing applications requiring high-speed computation and multiple internal bus architecture.

Median Price

$17.063

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 904 parts In-Stock

1+ parts

-

100+ parts

$13.650

1k+ parts

$12.210

10k+ parts

$11.500

904

-

$13.650

$12.210

$11.500

DigiKey

USA . 904 parts In-Stock

1+ parts

-

100+ parts

$17.960

1k+ parts

-

10k+ parts

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904

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$17.960

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Verical

USA . 904 parts In-Stock

1+ parts

-

100+ parts

$17.063

1k+ parts

$15.262

10k+ parts

$14.375

904

-

$17.063

$15.262

$14.375

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$13.540

100+ parts

-

1k+ parts

-

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100

$13.540

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-

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Digiode

USA . 3,672 parts In-Stock

1+ parts

$14.412

100+ parts

-

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-

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3,672

$14.412

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Vyrian

USA . 8,177 parts In-Stock

1+ parts

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8,177

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DigiKey Marketplace

USA . 904 parts In-Stock

1+ parts

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100+ parts

-

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904

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 899 parts In-Stock

1+ parts

$12.890

100+ parts

-

1k+ parts

-

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899

$12.890

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-

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Netroflash

USA . 100 parts In-Stock

1+ parts

$13.540

100+ parts

-

1k+ parts

$12.863

10k+ parts

$12.592

100

$13.540

-

$12.863

$12.592

Corphita

USA . 3,964 parts In-Stock

1+ parts

$13.653

100+ parts

-

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-

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3,964

$13.653

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Corohmni

South Africa . 416 parts In-Stock

1+ parts

$27.175

100+ parts

-

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416

$27.175

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Parana Technologies

USA . 645 parts In-Stock

1+ parts

$57.023

100+ parts

-

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-

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645

$57.023

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DigiPath Technology Company

USA . 406 parts In-Stock

1+ parts

$62.790

100+ parts

$57.766

1k+ parts

-

10k+ parts

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406

$62.790

$57.766

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ChromeModa Solutions

Germany . 5,345 parts In-Stock

1+ parts

$64.071

100+ parts

$52.538

1k+ parts

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10k+ parts

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5,345

$64.071

$52.538

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IDEA Electronic Components Group

UK . 982 parts In-Stock

1+ parts

$64.071

100+ parts

$60.867

1k+ parts

$57.664

10k+ parts

-

982

$64.071

$60.867

$57.664

-

Overview

Unlock the power of advanced signal processing with the TMS320DM640ZDK400 by Texas Instruments. As a trusted leader in the industry, Texas Instruments delivers top-quality digital signal processors that are perfect for a wide range of applications. From audio processing to industrial automation, this versatile DSP offers unparalleled performance and reliability. With its cutting-edge technology and innovative design, customers can expect superior results and seamless integration. Experience the difference with Texas Instruments and take your projects to the next level with the TMS320DM640ZDK400.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material that protects the internal components of the DSP.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 1.26 V

Efficient power consumption and operating within safe voltage limits.

Address Bus Width: 20

Allows for efficient addressing of memory locations, improving overall performance.

Package Shape: SQUARE

Space-saving design that can fit into compact electronic devices.

Bit Size: 32

High processing power and capability for complex signal processing tasks.

Power Supplies (V): 1.2,3.3

Compatibility with various power sources for flexibility in system design.

No. of Terminals: 548

Sufficient connectivity options for interfacing with other components in the system.

Package Style (Meter): GRID ARRAY, FINE PITCH

Enhanced reliability and signal integrity due to fine pitch design.

Minimum Supply Voltage: 1.14 V

Ensures stable operation even under lower voltage conditions.

Terminal Position: BOTTOM

Facilitates easy soldering and board connections during assembly.

Maximum Seated Height: 2.5 mm

Low profile design for slim devices or tight spaces.

RAM Words: 16384

Sufficient memory capacity for storing and processing data in real-time applications.

Width: 23 mm

Compact form factor for integration into various electronic systems.

Boundary Scan: YES

Allows for easy testing and debugging during manufacturing or maintenance.

External Data Bus Width: 32

High-speed data transfer capability for efficient communication with external devices.

Maximum Clock Frequency: 75 MHz

Fast processing speed for real-time data processing and signal analysis.

Internal Bus Architecture: MULTIPLE

Efficient data flow within the DSP for parallel processing tasks.

Length: 23 mm

Compact dimensions for versatile mounting options in electronic devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile functionality for various signal processing applications.

Technology: CMOS

Low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Secure and reliable electrical connections with other components.

Nominal Supply Voltage: 1.2 V

Stable and optimal voltage level for consistent performance.

Terminal Pitch: 0.8 mm

Fine pitch design for high-density board layouts and signal integrity.

Format: FIXED POINT

Precise data representation and processing for accuracy in signal analysis and control.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM640ZDK400 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

Length:

23 mm

Low Power Mode:

NO

No. of Terminals:

548

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA548,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

2.5 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM640ZDK400 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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