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TMS320DM640GDK400

Texas Instruments

TMS320DM640GDK400 by Texas Instruments

TMS320DM640GDK400 by Texas Instruments is a 32-bit DSP with 23-bit address bus, 32-bit external data bus, and max clock frequency of 75 MHz. Ideal for digital signal processing applications requiring low power mode, it features a package style of grid array with fine pitch and terminal finish of tin lead.

Median Price

$31.568

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,107 parts In-Stock

1+ parts

-

100+ parts

$28.060

1k+ parts

$25.110

10k+ parts

$23.630

2,107

-

$28.060

$25.110

$23.630

DigiKey

USA . 2,107 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2,107

-

-

-

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Verical

USA . 1,160 parts In-Stock

1+ parts

-

100+ parts

$35.075

1k+ parts

$31.387

10k+ parts

$29.538

1,160

-

$35.075

$31.387

$29.538

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,703 parts In-Stock

1+ parts

$29.621

100+ parts

-

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1,703

$29.621

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Vyrian

USA . 3,156 parts In-Stock

1+ parts

$31.180

100+ parts

-

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3,156

$31.180

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DigiKey Marketplace

USA . 2,107 parts In-Stock

1+ parts

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2,107

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 794 parts In-Stock

1+ parts

$26.293

100+ parts

-

1k+ parts

$26.894

10k+ parts

-

794

$26.293

-

$26.894

-

Ampacity Inc.

Singapore . 1,351 parts In-Stock

1+ parts

$26.500

100+ parts

-

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-

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1,351

$26.500

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Corphita

USA . 4,957 parts In-Stock

1+ parts

$28.062

100+ parts

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4,957

$28.062

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DigiPath Technology Company

USA . 682 parts In-Stock

1+ parts

$28.952

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682

$28.952

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ChromeModa Solutions

Germany . 2,151 parts In-Stock

1+ parts

$29.543

100+ parts

$24.225

1k+ parts

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2,151

$29.543

$24.225

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IDEA Electronic Components Group

UK . 2,088 parts In-Stock

1+ parts

$29.543

100+ parts

$28.066

1k+ parts

$26.589

10k+ parts

-

2,088

$29.543

$28.066

$26.589

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Component Stockers USA

USA . 6,162 parts In-Stock

1+ parts

$31.880

100+ parts

$29.970

1k+ parts

$27.100

10k+ parts

-

6,162

$31.880

$29.970

$27.100

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Corohmni

South Africa . 976 parts In-Stock

1+ parts

$62.369

100+ parts

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976

$62.369

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QUARKTWIN TECHNOLOGY LTD

USA . 29,476 parts In-Stock

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29,476

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Microchip USA

USA . 5,764 parts In-Stock

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5,764

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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GreenTree Electronics

Israel . 1,100 parts In-Stock

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1,100

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Overview

Unlock the power of advanced signal processing with the TMS320DM640GDK400 by Texas Instruments. Designed for demanding applications, this digital signal processor delivers superior performance and reliability. Texas Instruments, a trusted name in semiconductor manufacturing, ensures top-notch quality and unmatched expertise. Ideal for a wide range of applications, this DSP offers unparalleled value, benefits, and advantages to customers seeking cutting-edge technology solutions. Experience the difference with the TMS320DM640GDK400 and revolutionize your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product easy to handle and transport.

Surface Mount: YES

Surface mount technology allows for compact and efficient circuit board design, saving space in electronic devices.

Maximum Supply Voltage: 1.26 V

Operates efficiently at low supply voltages, reducing power consumption and heat generation.

Address Bus Width: 23

Wide address bus width allows for efficient data processing and handling of large memory addresses.

Bit Size: 32

32-bit processing capability enables high-speed and accurate signal processing tasks.

Power Supplies (V): 1.2,3.3

Supports multiple power supply voltages for flexibility in different operating environments.

No. of Terminals: 548

High number of terminals provide ample connectivity options for peripheral devices and external components.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array and fine pitch package style offer precise and secure mounting of the DSP on printed circuit boards.

Minimum Supply Voltage: 1.14 V

Can operate at a low minimum supply voltage, ensuring energy efficiency and extended battery life.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides solderability and conductivity for reliable electrical connections.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB layout and integration into electronic designs.

Maximum Seated Height: 2.8 mm

Low seated height allows for slim and compact product designs without compromising on performance.

RAM Words: 16384

Large RAM capacity enables storage of a significant amount of data for processing complex algorithms.

Width: 23 mm

Compact width dimension enables the DSP to fit into space-constrained electronic devices.

Boundary Scan: YES

Boundary scan feature helps in testing and debugging the DSP during the manufacturing process, improving product quality.

External Data Bus Width: 32

Wide external data bus width facilitates high-speed data transfer between the DSP and external peripherals.

Maximum Clock Frequency: 75 MHz

High maximum clock frequency allows for rapid execution of computational tasks and real-time processing.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data throughput and parallel processing capability of the DSP.

Length: 23 mm

Compact length dimension contributes to the overall small form factor of the DSP, ideal for space-limited applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral IC type supports a wide range of signal processing applications and functions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the DSP.

Terminal Form: BALL

Ball terminal form provides reliable and secure connections with the PCB for stable operation.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage ensures consistent and reliable performance of the DSP under varying load conditions.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density mounting of the DSP on the PCB, saving space and optimizing circuit layout.

Format: FIXED POINT

Fixed-point format is suitable for many signal processing applications where precise and fast calculations are required.

Moisture Sensitivity Level (MSL): 4

MSL 4 rating indicates that the DSP can withstand moderate exposure to moisture during handling and storage.

Low Power Mode: YES

Low power mode feature helps in reducing power consumption during idle or low utilization periods, extending battery life.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM640GDK400 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

548

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA548,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM640GDK400 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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