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TMS320C80GGP50

Texas Instruments

TMS320C80GGP50 by Texas Instruments

TMS320C80GGP50 by Texas Instruments is a 32-bit DSP with 64-bit external data bus width, operating at max 100 MHz clock frequency. It features 25600 RAM words and supports boundary scan technology. Ideal for applications requiring high-speed signal processing in digital communication systems.

Median Price

$531.120

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3 parts In-Stock

1+ parts

$439.830

100+ parts

$413.440

1k+ parts

$387.050

10k+ parts

-

3

$439.830

$413.440

$387.050

-

DigiKey

USA . 3 parts In-Stock

1+ parts

$531.120

100+ parts

-

1k+ parts

-

10k+ parts

-

3

$531.120

-

-

-

Verical

USA . 3 parts In-Stock

1+ parts

$549.788

100+ parts

$516.800

1k+ parts

$483.813

10k+ parts

-

3

$549.788

$516.800

$483.813

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,464 parts In-Stock

1+ parts

$485.156

100+ parts

-

1k+ parts

-

10k+ parts

-

3,464

$485.156

-

-

-

DigiKey Marketplace

USA . 3 parts In-Stock

1+ parts

$531.120

100+ parts

-

1k+ parts

-

10k+ parts

-

3

$531.120

-

-

-

Vyrian

USA . 8,808 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,808

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 356 parts In-Stock

1+ parts

$27.140

100+ parts

-

1k+ parts

-

10k+ parts

-

356

$27.140

-

-

-

Parana Technologies

USA . 821 parts In-Stock

1+ parts

$29.277

100+ parts

-

1k+ parts

$57.506

10k+ parts

-

821

$29.277

-

$57.506

-

DigiPath Technology Company

USA . 56 parts In-Stock

1+ parts

$32.237

100+ parts

$29.658

1k+ parts

-

10k+ parts

-

56

$32.237

$29.658

-

-

IDEA Electronic Components Group

UK . 439 parts In-Stock

1+ parts

$32.895

100+ parts

$31.250

1k+ parts

$29.606

10k+ parts

-

439

$32.895

$31.250

$29.606

-

ChromeModa Solutions

Germany . 220 parts In-Stock

1+ parts

$32.895

100+ parts

$26.974

1k+ parts

-

10k+ parts

-

220

$32.895

$26.974

-

-

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$51.321

100+ parts

$46.702

1k+ parts

$42.083

10k+ parts

-

5,000

$51.321

$46.702

$42.083

-

Corphita

USA . 322 parts In-Stock

1+ parts

$459.621

100+ parts

-

1k+ parts

-

10k+ parts

-

322

$459.621

-

-

-

Microchip USA

USA . 219 parts In-Stock

1+ parts

$485.320

100+ parts

$472.380

1k+ parts

$465.910

10k+ parts

$459.430

219

$485.320

$472.380

$465.910

$459.430

Assy Fe

Spain . 27 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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27

-

-

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Overview

Unlock the power of advanced digital signal processing with the TMS320C80GGP50 by Texas Instruments. Designed to meet the highest quality standards, this DSP offers unparalleled performance and reliability. From cutting-edge audio and video processing to complex control algorithms, this versatile chip is perfect for a wide range of applications. With Texas Instruments' reputation for excellence, you can trust that the TMS320C80GGP50 will deliver exceptional value, benefits, and advantages to meet your needs. Experience the difference with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications.

Maximum Supply Voltage: 3.465 V

The higher maximum supply voltage allows for flexibility in powering the device and handling potential voltage fluctuations.

Address Bus Width: 32

With a wide address bus width, the DSP can access a large memory space efficiently, enhancing performance.

Bit Size: 32

A 32-bit architecture enables the DSP to process data in larger chunks, improving speed and efficiency.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the DSP can function reliably even in demanding environments.

RAM Words: 25600

Having a large RAM capacity allows the DSP to store and access a significant amount of data quickly.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The versatile peripheral IC type supports various functions, making the DSP suitable for diverse applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the DSP.

Maximum Clock Frequency: 100 MHz

A high maximum clock frequency allows the DSP to perform operations quickly, making it suitable for real-time signal processing.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C80GGP50 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

32

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B352

Length:

35 mm

Low Power Mode:

NO

No. of DMA Channels:

0

No. of External Interrupts:

4

No. of Serial I/Os:

0

No. of Terminals:

352

No. of Timers:

1

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA352,26X26,50

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, LOW PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

25600

Maximum Seated Height:

1.7 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

2300 mA

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

35 mm

Peripheral IC Type:

Trade Compliance

TMS320C80GGP50 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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