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TMS320C6746EZCEA3

Texas Instruments

TMS320C6746EZCEA3 by Texas Instruments

TMS320C6746EZCEA3 by Texas Instruments is a DSP with 30MHz clock, 327680 RAM words, and 80 DMA channels. Ideal for industrial applications requiring low power mode, it features a single internal bus architecture and floating-point format for high-performance signal processing tasks.

Median Price

$20.080

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 26 parts In-Stock

1+ parts

$13.688

100+ parts

$11.957

1k+ parts

$8.246

10k+ parts

-

26

$13.688

$11.957

$8.246

-

DigiKey

USA . 163 parts In-Stock

1+ parts

$20.080

100+ parts

$15.019

1k+ parts

$13.617

10k+ parts

-

163

$20.080

$15.019

$13.617

-

Mouser Electronics

USA . 145 parts In-Stock

1+ parts

$20.080

100+ parts

$13.620

1k+ parts

$13.610

10k+ parts

-

145

$20.080

$13.620

$13.610

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,935 parts In-Stock

1+ parts

$13.004

100+ parts

-

1k+ parts

-

10k+ parts

-

3,935

$13.004

-

-

-

Vyrian

USA . 4,738 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,738

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$11.894

100+ parts

$10.824

1k+ parts

$9.753

10k+ parts

-

40

$11.894

$10.824

$9.753

-

Corphita

USA . 3,047 parts In-Stock

1+ parts

$12.319

100+ parts

-

1k+ parts

-

10k+ parts

-

3,047

$12.319

-

-

-

Corohmni

South Africa . 168 parts In-Stock

1+ parts

$12.831

100+ parts

-

1k+ parts

-

10k+ parts

-

168

$12.831

-

-

-

Parana Technologies

USA . 1,641 parts In-Stock

1+ parts

$33.418

100+ parts

-

1k+ parts

$125.169

10k+ parts

-

1,641

$33.418

-

$125.169

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DigiPath Technology Company

USA . 1,794 parts In-Stock

1+ parts

$36.797

100+ parts

-

1k+ parts

-

10k+ parts

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1,794

$36.797

-

-

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ChromeModa Solutions

Germany . 2,675 parts In-Stock

1+ parts

$37.548

100+ parts

$30.789

1k+ parts

-

10k+ parts

-

2,675

$37.548

$30.789

-

-

IDEA Electronic Components Group

UK . 612 parts In-Stock

1+ parts

$37.548

100+ parts

$35.671

1k+ parts

$33.793

10k+ parts

-

612

$37.548

$35.671

$33.793

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,500

-

-

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Speed Components Ltd (Excess)

Israel . 2 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2

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Overview

Unlock the power of cutting-edge technology with the TMS320C6746EZCEA3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality digital signal processors that are versatile and reliable. Ideal for applications requiring high-speed data processing, this DSP offers unparalleled performance and efficiency. Experience the value of seamless integration, low power consumption, and advanced features that elevate your projects to new heights. Embrace innovation with Texas Instruments and revolutionize your designs with the TMS320C6746EZCEA3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Integrated Cache: YES

Having integrated cache helps in improving the performance of the DSP by reducing the access time to frequently used data.

Surface Mount: YES

Surface mount technology allows for compact and efficient placement of the DSP on a PCB, saving space and reducing assembly time.

Maximum Supply Voltage: 1.05 V

Operating at a maximum supply voltage of 1.05 V helps in minimizing power consumption and heat generation.

On Chip Data RAM Width: 8

With a wider data RAM width of 8, the DSP can process larger data sets more efficiently.

Address Bus Width: 23

A wider address bus width of 23 allows the DSP to access a larger memory space, enabling it to handle complex calculations and tasks.

Package Shape: SQUARE

The square package shape provides a symmetric and efficient footprint for the DSP, making it easier to integrate into system designs.

No. of Terminals: 361

Having a high number of terminals allows for versatile connectivity options and the ability to interface with various other components in a system.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array, low profile, and fine pitch package style offers high-density packaging, enabling more functionality in a smaller form factor.

Minimum Supply Voltage: 0.95 V

Operating at a low minimum supply voltage of 0.95 V helps in further reducing power consumption and extending battery life.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, the DSP can withstand demanding environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The ability to operate at a minimum temperature of -40°C makes the DSP suitable for use in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides good conductivity and corrosion resistance, ensuring reliable connections.

Terminal Position: BOTTOM

Having terminals positioned at the bottom simplifies PCB layout and enables easier heat dissipation.

Maximum Seated Height: 1.3 mm

With a maximum seated height of 1.3 mm, the DSP can be mounted in slim devices or space-constrained electronic systems.

RAM Words: 327680

Having a large RAM capacity of 327680 words allows the DSP to store and process a significant amount of data efficiently.

Width: 13 mm

The compact width of 13 mm makes the DSP suitable for applications where space is a constraint.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging of the DSP during production and maintenance phases.

External Data Bus Width: 16

With an external data bus width of 16, the DSP can efficiently transfer data to and from external peripherals.

Maximum Clock Frequency: 30 MHz

Operating at a maximum clock frequency of 30 MHz enables high-speed processing of data and real-time signal processing.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds minimizes thermal stress on the DSP during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering and mechanical stability during PCB assembly.

Internal Bus Architecture: SINGLE

The single internal bus architecture simplifies data transfer within the DSP, improving efficiency and reducing latency.

Length: 13 mm

The compact length of 13 mm contributes to the overall small form factor of the DSP, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades ensures that the DSP can operate reliably in harsh industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The DSP's peripheral IC type indicates its specialization in digital signal processing tasks, making it a suitable choice for audio, video, and communication applications.

No. of Timers: 8

Having 8 timers enables the DSP to perform time-sensitive operations and control functions efficiently.

Technology: CMOS

Utilizing CMOS technology allows the DSP to achieve low power consumption, high integration, and reliable performance.

Terminal Form: BALL

Having terminals in ball form simplifies the soldering process and ensures a reliable connection with the PCB during assembly.

Nominal Supply Voltage: 1 V

Operating at a nominal supply voltage of 1 V strikes a balance between power efficiency and performance for the DSP.

No. of DMA Channels: 80

With 80 DMA channels, the DSP can efficiently offload data transfer tasks, freeing up the processor for other computational tasks.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density mounting of the DSP on the PCB, contributing to a compact system design.

Format: FLOATING POINT

Operating in a floating-point format enables the DSP to handle complex mathematical calculations with higher precision and dynamic range.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the DSP can withstand moderate exposure to moisture during storage and assembly processes.

Low Power Mode: YES

The availability of a low power mode allows the DSP to reduce power consumption during idle or low processing load periods, extending battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6746EZCEA3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPEARTES AT 1.1V AND 1.2V SUPLLY

Address Bus Width:

23

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

80

No. of Terminals:

361

No. of Timers:

8

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

327680

Maximum Seated Height:

1.3 mm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13 mm

Peripheral IC Type:

Trade Compliance

TMS320C6746EZCEA3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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