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TMS320C6727BZDHMUD

Texas Instruments

TMS320C6727BZDHMUD by Texas Instruments

TMS320C6727BZDHMUD by Texas Instruments is a 32-bit DSP with 13-bit address bus, operating at up to 25 MHz. It features low power mode and boundary scan, making it ideal for digital signal processing applications requiring high-speed data processing in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,909 parts In-Stock

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Digiode

USA . 472 parts In-Stock

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AZTECH Wire

Italy . 582 parts In-Stock

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$13.142

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One Stop Electronics

USA . 668 parts In-Stock

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$28.000

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$36.340

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$33.069

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$29.799

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Parana Technologies

USA . 936 parts In-Stock

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$48.467

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DigiPath Technology Company

USA . 1,179 parts In-Stock

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$53.368

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ChromeModa Solutions

Germany . 3,114 parts In-Stock

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$54.457

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$44.655

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IDEA Electronic Components Group

UK . 529 parts In-Stock

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$54.457

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$51.734

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$49.011

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Corohmni

South Africa . 2,097 parts In-Stock

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$83.666

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Component Stockers USA

USA . 301 parts In-Stock

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$441.980

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Corphita

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Overview

Unlock the power of advanced digital signal processing with the TMS320C6727BZDHMUD by Texas Instruments. As a leader in semiconductor technology, Texas Instruments ensures superior quality and reliability in their products. The TMS320C6727BZDHMUD falls under the category of Digital Signal Processors (DSPs) and is perfect for applications requiring high-performance computing capabilities. With its low power mode and maximum clock frequency of 25 MHz, this DSP offers unmatched efficiency and speed. Experience seamless integration and top-notch performance with the TMS320C6727BZDHMUD from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the DSP, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and effort in the manufacturing process.

Maximum Supply Voltage: 1.32 V

The higher supply voltage allows for better performance and power efficiency in processing signals.

Address Bus Width: 13

A wider address bus allows for better memory addressing capabilities and overall performance of the DSP.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the circuit board.

No. of Terminals: 256

Having a large number of terminals provides more connectivity options for interfacing with external devices.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6727BZDHMUD attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

13

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.02 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TMS320C6727BZDHMUD Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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